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    CIRCUIT MODULE
    1.
    发明申请
    CIRCUIT MODULE 审中-公开
    电路模块

    公开(公告)号：US20150062835A1

    公开(公告)日：2015-03-05

    申请号：US14102241

    申请日：2013-12-10

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Takehiko KAI ,  Eiji MUGIYA ,  Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Hiroshi NAKAMURA ,  Tetsuo SAJI

    IPC: H05K1/02 ,  H05K3/10

    CPC classification number: H05K1/0218 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/101 ,  H05K9/003 ,  H05K2201/0715 ,  Y10T29/4913

    Abstract: A circuit module includes a wiring substrate having a mount surface that has first, second, and third areas; a plurality of electronic components mounted on the areas; an insulating sealing layer that has a main surface and a side surface and covers the plurality of electronic components, the main surface having a trench that is sequentially formed along a boundary between the areas to be diverged en route and has a tapered shape toward the mount surface, the side surface being formed around the main surface; and a conductive shield that has first and second shield portions and includes conductive resin, the first shield portion covering the side surface of the sealing layer and having a first thickness, the second shield portion being provided in the trench and having a second thickness larger than the first thickness at a height of half the total height of the second shield portion.

    Abstract translation: 电路模块包括具有第一，第二和第三区域的安装表面的布线基板; 安装在所述区域上的多个电子部件; 绝缘密封层，其具有主表面和侧表面并且覆盖所述多个电子部件，所述主表面具有沟槽，所述沟槽沿着要沿着所述发散的区域之间的边界顺序地形成，并且具有朝向所述安装件的锥形形状 表面，所述侧表面围绕所述主表面形成; 以及具有第一和第二屏蔽部分并且包括导电树脂的导电屏蔽，所述第一屏蔽部分覆盖所述密封层的侧表面并具有第一厚度，所述第二屏蔽部分设置在所述沟槽中，并且具有大于 第一厚度在第二屏蔽部分的总高度的一半的高度处。

    CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
    5.
    发明申请
    CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE 有权
    电路模块和电路模块的制造方法

    公开(公告)号：US20150044822A1

    公开(公告)日：2015-02-12

    申请号：US14517424

    申请日：2014-10-17

    Applicant: Taiyo Yuden Co., Ltd.

    Inventor： Eiji MUGIYA ,  Takehiko KAI ,  Masaya SHIMAMURA ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

    IPC: H01L23/552 ,  H01L21/52 ,  H01L21/56

    CPC classification number: H01L23/552 ,  H01L21/52 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00

    Abstract: A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

    Abstract translation: 电路模块包括电路基板，至少一个安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有第一密封体部分和具有第二厚度大于第一厚度的第二密封体部分。 屏蔽罩覆盖密封体，并且具有形成在第一密封体部分上并具有第三厚度的第一屏蔽部分和形成在第二密封体部分上并且具有小于第三厚度的第四厚度的第二屏蔽部分。 第四厚度和第二厚度之和等于第一厚度和第三厚度之和。

    ELECTRONIC COMPONENT MODULE
    7.
    发明申请
    ELECTRONIC COMPONENT MODULE 审中-公开

    公开(公告)号：US20180286816A1

    公开(公告)日：2018-10-04

    申请号：US15934829

    申请日：2018-03-23

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Kenzo KITAZAKI ,  Takehiko KAI ,  Masaya SHIMAMURA ,  Mikio AOKI ,  Jin MIKATA ,  Taiji ITO

    IPC: H01L23/552 ,  H01L23/28 ,  H01L23/02

    Abstract: To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.

    METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE
    10.
    发明申请
    METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE 审中-公开

    公开(公告)号：US20180286817A1

    公开(公告)日：2018-10-04

    申请号：US15935829

    申请日：2018-03-26

    Applicant: TAIYO YUDEN CO., LTD.

    Inventor： Kenzo KITAZAKI ,  Takehiko KAI ,  Masaya SHIMAMURA ,  Mikio AOKI ,  Jin MIKATA ,  Taiji ITO

    IPC: H01L23/552 ,  H01L23/66 ,  H01L21/56 ,  H01L21/78

    Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.

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