公开(公告)号：USD481703S1

公开(公告)日：2003-11-04

申请号：US29156744

申请日：2002-03-07

申请人： Shinichi Togawa ,  Yasuhide Tanaka ,  Katsuji Matsushita

设计人： Shinichi Togawa ,  Yasuhide Tanaka ,  Katsuji Matsushita

公开(公告)号：US06148136A

公开(公告)日：2000-11-14

申请号：US11550

申请日：1998-02-06

申请人： Shinya Tanaka ,  Takayasu Yoshida ,  Hideki Otaka ,  Shinichi Togawa

发明人： Shinya Tanaka ,  Takayasu Yoshida ,  Hideki Otaka ,  Shinichi Togawa

IPC分类号： H04N5/926 ,  H04N5/91

CPC分类号： H04N5/9261 ,  H04N5/926 ,  H04N5/9267

摘要： Among the recording/reproducing apparatus such as digital VCR, recording/reproducing and converting may be conducted using digital interface even if there are difference in the type of audio sampling and video compression. DV bus data is provided at digital I/F circuit 2, and A/V separator 101 separates the data into audio and video. The separated audio data undergoes the de-interleave processing at de-interleave instrument 102, and the rate conversion at rate converter 103. The rate- converted audio data undergoes the frame sequence processing and interleave processing at interleave instrument 104. While, the video data is delayed at delay memory 105, where the delay in the audio data processing is taken into account. These audio data and video data are multiplexed at A/V multiplexer 106 to output the DV bus data 3, which is recorded after having been applied with due processing for recording.

摘要翻译： PCT No.PCT / JP97 / 01965 Sec。 371日期1998年2月6日 102（e）日期1998年2月6日PCT提交1997年6月5日PCT公布。 出版物WO97 / 47132 日期1997年12月11日在诸如数字VCR的记录/再现装置中，即使音频采样和视频压缩的类型有差异，也可以使用数字接口进行记录/再现和转换。 数字I / F电路2提供DV总线数据，A / V分离器101将数据分离成音频和视频。 分离的音频数据在解交织器102处进行去交织处理，并且在速率转换器103处进行速率转换。速率转换的音频数据在交织器104进行帧序列处理和交织处理。而视频数据 在延迟存储器105中被延迟，其中考虑了音频数据处理的延迟。 这些音频数据和视频数据在A / V多路复用器106处被多路复用，以输出DV总线数据3，DV总线数据3在被应用适当的记录处理之后被记录。

公开(公告)号：US08629361B2

公开(公告)日：2014-01-14

申请号：US13414207

申请日：2012-03-07

申请人： Katsuya Koyama ,  Takuya Eguchi ,  Shinichi Togawa

发明人： Katsuya Koyama ,  Takuya Eguchi ,  Shinichi Togawa

IPC分类号： H01H9/04

CPC分类号： H01H21/08 ,  H01H2021/225 ,  H01H2207/034 ,  H01H2300/01

摘要： A switch device has a case, an operation knob disposed above the case, and a connector disposed under the case. The connector has connection terminals and a housing supporting the connection terminals, the housing being formed with an opening portion from which the connection terminals are led out. The case is provided with an impervious wall extending downward from the case so as to be opposed to both side surfaces of the housing parallel to a leading-out direction of the connection terminals. The impervious wall is arranged across a gap from each of the both side surfaces of the housing.

摘要翻译： 开关装置具有壳体，设置在壳体上方的操作旋钮和设置在壳体下方的连接器。 连接器具有连接端子和支撑连接端子的壳体，壳体形成有开口部分，连接端子从该开口部分引出。 壳体设置有从壳体向下延伸的不透水壁，以与壳体的两个侧表面相对平行于连接端子的导出方向。 不透水壁布置成跨过壳体的两个侧表面中的每一个的间隙。

公开(公告)号：US20120228101A1

公开(公告)日：2012-09-13

申请号：US13414207

申请日：2012-03-07

申请人： Katsuya Koyama ,  Takuya Eguchi ,  Shinichi Togawa

发明人： Katsuya Koyama ,  Takuya Eguchi ,  Shinichi Togawa

IPC分类号： H01H9/04

CPC分类号： H01H21/08 ,  H01H2021/225 ,  H01H2207/034 ,  H01H2300/01

摘要： A switch device has a case, an operation knob disposed above the case, and a connector disposed under the case. The connector has connection terminals and a housing supporting the connection terminals, the housing being formed with an opening portion from which the connection terminals are led out. The case is provided with an impervious wall extending downward from the case so as to be opposed to both side surfaces of the housing parallel to a leading-out direction of the connection terminals. The impervious wall is arranged across a gap from each of the both side surfaces of the housing.

摘要翻译： 开关装置具有壳体，设置在壳体上方的操作旋钮和设置在壳体下方的连接器。 连接器具有连接端子和支撑连接端子的壳体，壳体形成有开口部分，连接端子从该开口部分引出。 壳体设置有从壳体向下延伸的不透水壁，以与壳体的两个侧表面相对平行于连接端子的导出方向。 不透水壁布置成跨过壳体的两个侧表面中的每一个的间隙。

公开(公告)号：US20100032802A1

公开(公告)日：2010-02-11

申请号：US12539122

申请日：2009-08-11

申请人： Shinichi Togawa ,  Mutsumi Masumoto

发明人： Shinichi Togawa ,  Mutsumi Masumoto

IPC分类号： H01L23/498 ,  H01L29/92 ,  H01L21/768 ,  H01L21/50

CPC分类号： H01L23/50 ,  H01L23/49589 ,  H01L23/642 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/0555 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The objective of this invention is to provide an assembling method for electronic members characterized by the fact that electronic members can be joined reliably and easily without using solder paste. The semiconductor device of the present invention has the following parts: silicon substrate 100 with circuit elements formed on it, plural protrusion-shaped metal electrodes 110A, 110B formed on silicon substrate 100, and capacitor 140 having Au-plated electrodes 142, 144. The electrodes 142, 144 of capacitor 140 are metallurgically joined to protrusion-shaped metal electrodes 110A, 110B by means of ultrasonic thermo-compression bonding.

摘要翻译： 本发明的目的是提供一种用于电子部件的组装方法，其特征在于，电子部件可以可靠且容易地接合而不使用焊膏。 本发明的半导体装置具有：形成有电路元件的硅基板100，形成在硅基板100上的多个突起状金属电极110A，110B，以及具有镀金电极142,144的电容器140。 电容器140的电极142,144通过超声波热压接合冶金地连接到突起状金属电极110A，110B。

公开(公告)号：US20080105970A1

公开(公告)日：2008-05-08

申请号：US11679173

申请日：2007-02-26

申请人： Shinichi Togawa

发明人： Shinichi Togawa

IPC分类号： H01L23/043 ,  H01L21/58

CPC分类号： H01L23/16 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A high performance package and methods for its assembly are disclosed. A semiconductor package system of the invention is assembled in a method including the steps of affixing one or more spacers to a package substrate and affixing one or more passive components to the substrate adjacent to the spacers in order to define a plane. A semiconductor chip is affixed in the plane atop the one or more passive components and spacers and is electrically coupled to the one or more passive components.

摘要翻译： 公开了一种高性能封装及其组装方法。 以包括以下步骤的方法组装本发明的半导体封装系统，所述方法包括以下步骤：将一个或多个间隔物固定到封装衬底，并将一个或多个无源部件固定到与所述间隔物相邻的衬底上，以限定平面。 半导体芯片固定在一个或多个无源部件和间隔物的顶部的平面内，并且电耦合到一个或多个无源部件。

公开(公告)号：US07214894B1

公开(公告)日：2007-05-08

申请号：US11386458

申请日：2006-03-22

申请人： Hideyo Kakuno ,  Katsuya Koyama ,  Shinichi Togawa

发明人： Hideyo Kakuno ,  Katsuya Koyama ,  Shinichi Togawa

IPC分类号： H01H9/00

CPC分类号： H01H25/04 ,  G05G9/047 ,  H01H25/06 ,  H01H2025/043 ,  H01H2300/012

摘要： A switching apparatus includes a case, an operation shaft whose one end outwardly projects from inside of the case and which is provided at its central portion with a flange, a support member which supports the flange such that the operation shaft can rock and rotate, an operation knob mounted on one end of the operation shaft, a first contact which is switched when the operation knob is pushed to move the operation shaft and the support member is moved, a second contact which is switched when the operation knob is rotated to rotate the operation shaft, a third contact which is switched when the operation knob is rocked to rock the operation shaft, and a substrate respectively having the first, second and third contacts.

摘要翻译： 一种开关装置，包括壳体，其一端从壳体的内部向外突出并且在其中心部分设置有凸缘的操作轴，支撑所述凸缘以使得所述操作轴能够摇动和旋转的支撑构件， 安装在操作轴的一端的操作旋钮，当操作旋钮被推动以移动操作轴并且支撑构件移动时切换的第一触点;当操作旋钮旋转时切换的第二触点， 操作轴，当操作旋钮摇动操作轴时切换的第三触点和分别具有第一，第二和第三触点的基板。

公开(公告)号：US06476710B2

公开(公告)日：2002-11-05

申请号：US09837369

申请日：2001-04-19

申请人： Shinichi Togawa ,  Masato Asahina ,  Yoshizumi Ohta

发明人： Shinichi Togawa ,  Masato Asahina ,  Yoshizumi Ohta

IPC分类号： G08B300

CPC分类号： G10K9/13 ,  G10K9/22

摘要： An electromagnetic sound generator has a case provided with a yoke, a magnet, a vibrating plate and a coil, and a pair of leads. An end of the coil and the other end of the leads is secured to the case so as to be connected to an outside terminal. A terminal connecting device is provided for connecting the end of the lead to the outside terminal. The terminal connecting device comprises a cylindrical case secured to the case, a connecting rod slidably mounted in the cylindrical case, and a coil spring provided in the cylindrical case to outwardly urge the connecting rod so as to be contacted with the outside terminal at an end of the rod. A top end of the cylindrical case is contacted with the end of the lead.

摘要翻译： 电磁发声器具有设置有磁轭，磁体，振动板和线圈的壳体和一对引线。 线圈的一端和引线的另一端固定到壳体上以便连接到外部端子。 端子连接装置用于将引线的端部连接到外部端子。 端子连接装置包括固定到壳体上的圆柱形壳体，可滑动地安装在圆筒形壳体中的连接杆和设置在圆筒形壳体中的螺旋弹簧，以向外推动连接杆，以在端部与外部端子接触 的杆。 圆柱形壳体的顶端与引线的端部接触。