摘要:
In method of manufacturing a DRAM by using a laminate SOI technique, which makes it possible to form a thin semiconductor film of a uniform thickness, the method includes steps of forming a step portion on a major surface of a silicon substrate, forming an insulating film on the major surface of the silicon substrate, forming a capacitor which is connected to the step potion through a contact hole formed through the insulating film on the step portion, grinding the silicon substrate from the other major surface thereof after a support substrate is laminated onto the silicon substrate to remain the step portion, forming a thin silicon film on the insulating film by lateral epitaxial growth process based on the silicon of the remaining step portion serving as a seed for the lateral epitaxial growth, and forming a MOS transistor in the thin silicon film.
摘要:
The present invention prevents production of residue which causes short-circuit between word lines. A memory cell comprises a channel formation region CH, charge storage films CSF each comprised of a plurality of stacked dielectric films, two storages comprised of regions of the charge storage films CSF overlapping the two ends of the channel formation region CH, a single-layer dielectric film DF2 contacting the channel formation region CH between the storages, auxiliary layers (for example, bit lines BL1 and BL2) formed on two impurity regions S/D, two first control electrodes CG1 and CG2 formed on the auxiliary layers with dielectric film interposed and positioned on the storages, and a second control electrode WL buried in a state insulated from the first control electrodes CG1 and CG2 in a space between them and contacting the single-layer dielectric film DF2. Since the main regions on facing surfaces of the first control electrodes CG1 and CG2 become forward tapered, conductive residue is not left at the time of processing the second control electrode WL.
摘要:
The present invention prevents production of residue which causes short-circuit between word lines. A memory cell comprises a channel formation region CH, charge storage films CSF each comprised of a plurality of stacked dielectric films, two storages comprised of regions of the charge storage films CSF-overlapping the two ends of the channel formation region CH, a single-layer dielectric film DF2 contacting the channel formation region CH between the storages, auxiliary layers (for example, bit lines BL1 and BL2) formed on two impurity regions S/D, two first control-electrodes CG1 and CG2 formed on the auxiliary layers with dielectric film interposed and positioned on the storages, and a second control electrode WL buried in a state insulated from the first control electrodes CG1 and CG2 in a space between them and contacting the single-layer dielectric film DF2. Since the main regions on facing surfaces of the first control electrodes CG1 and CG2 become forward tapered, conductive residue is not left at the time of processing the second control electrode WL.
摘要:
A nonvolatile semiconductor memory device with high reliability (free from troubles in storing data), a high charge injection efficiency, and enabling parallel operation in a VG cell array, includes channel forming regions, a charge storing film which consists of stacked dielectric films and is capable of storing a charge, two storage portions forming parts of the charge storing film and overlapping the channel forming regions, a single layer dielectric film between the storage portions and in contact with the channel forming region, a control gate electrode on the single layer dielectric film, and a memory gate electrode on the storage portions.
摘要:
In a method of manufacturing a DRAM by using a laminate SOI technique, which makes it possible to form a thin semiconductor film of a uniform thickness, the method includes steps of forming a step portion on a major surface of a silicon substrate, forming an insulating film on the major surface of the silicon substrate, forming a capacitor which is connected to the step potion through a contact hole formed through the insulating film on the step portion, grinding the silicon substrate from the other major surface thereof after a support substrate is laminated onto the silicon substrate to remain the step portion, forming a thin silicon film on the insulating film by lateral epitaxial growth process based on the silicon of the remaining step portion serving as a seed for the lateral epitaxial growth, and forming a MOS transistor in the thin silicon film.
摘要:
An amino acid-modified organopolysiloxane is provided. It has an amino acid derivative bonded to at least one silicon atom of the organopolysiloxane segment constituting the backbone of the organopolysiloxane via an amide bond represented by the following general formula (1): wherein X and Y are independently a C1-10 divalent hydrocarbon group; m is an integer of 0 to 4; Ra is hydrogen atom, a monovalent hydrocarbon group containing 1 to 4 carbon atoms, or an organic group represented by the following general formula (2): (wherein Rb is hydrogen atom, a C1-7 monovalent hydrocarbon group, an alkaline metal, or an alkaline earth metal, and Rc is independently hydrogen atom, hydroxy group, or a C1-10 monovalent hydrocarbon group optionally containing oxygen atom, sulfur atom, or nitrogen atom); and Z is an organic group represented by the general formula (2).
摘要:
An amino acid-modified organopolysiloxane is provided. It has an amino acid derivative bonded to at least one silicon atom of the organopolysiloxane segment constituting the backbone of the organopolysiloxane via an amide bond represented by the following general formula (1): wherein X and Y are independently a C1-10 divalent hydrocarbon group; m is an integer of 0 to 4; Ra is hydrogen atom, a monovalent hydrocarbon group containing 1 to 4 carbon atoms, or an organic group represented by the following general formula (2): (wherein Rb is hydrogen atom, a C1-7 monovalent hydrocarbon group, an alkaline metal, or an alkaline earth metal, and Rc is independently hydrogen atom, hydroxy group, or a C1-10 monovalent hydrocarbon group optionally containing oxygen atom, sulfur atom, or nitrogen atom); and Z is an organic group represented by the general formula (2).
摘要:
A blending apparatus is provided, the blending apparatus including: an outer tube; and at least one inner tube disposed inside the outer tube, wherein a distal end, in a lengthwise direction, of the inner tube is located at an intermediate position, in a lengthwise direction, of the outer tube, and the inner tube has plural of through holes in a vicinity of the distal end thereof.
摘要:
The present invention relates to a zero point correction circuit for a load meter used for a press machine or the like, and more particularly to a configuration with which a zero point correction is made a plurality of times after a predetermined amount of time elapses, after press processing is performed, and a zero point correction value is set by calculating an average value of measured values. The predetermined amount of time is measured, for example, with an internal timer or the like, a sampling process is performed after the predetermined amount of time elapses, and an average value of sampled values is calculated and set as a zero point correction value, whereby an accurate zero point correction value can be obtained.
摘要:
The present invention prevents production of residue which causes short-circuit between word lines. A memory cell comprises a channel formation region CH, charge storage films CSF each comprised of a plurality of stacked dielectric films, two storages comprised of regions of the charge storage films CSF overlapping the two ends of the channel formation region CH, a single-layer dielectric film DF2 contacting the channel formation region CH between the storages, auxiliary layers (for example, bit lines BL1 and BL2) formed on two impurity regions S/D, two first control electrodes CG1 and CG2 formed on the auxiliary layers with dielectric film interposed and positioned on the storages, and a second control electrode WL buried in a state insulated from the first control electrodes CG1 and CG2 in a space between them and contacting the single-layer dielectric film DF2. Since the main regions on facing surfaces of the first control electrodes CG1 and CG2 become forward tapered, conductive residue is not left at the time of processing the second control electrode WL.