公开(公告)号：US20110158773A1

公开(公告)日：2011-06-30

申请号：US13042407

申请日：2011-03-07

申请人： Terry BLUCK ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

发明人： Terry BLUCK ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

IPC分类号： H01L21/677

CPC分类号： H01L21/67184 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67745

摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

摘要翻译： 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。

公开(公告)号：US20110104847A1

公开(公告)日：2011-05-05

申请号：US12610187

申请日：2009-10-30

申请人： Terry BLUCK ,  Michael S. Barnes ,  Kevin P. Fairbairn

发明人： Terry BLUCK ,  Michael S. Barnes ,  Kevin P. Fairbairn

IPC分类号： H01L31/18

CPC分类号： H01L31/18 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67742 ,  Y10S438/908

摘要： A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the concentration gradient of each layer can be precisely controlled.

摘要翻译： 多个室围绕传送室布置。 线性传送室可以包括支撑机械臂的直线轨迹。 机器人将基板运送到室和从室传送。 每个室包括多个蒸发器，每个蒸发器独立地被控制。 位于室中的每个基板由多个蒸发器涂覆，使得通过独立地控制每个蒸发器的操作，能够精确地控制各层的形成和各层的浓度梯度。

公开(公告)号：US20110303148A1

公开(公告)日：2011-12-15

申请号：US13157077

申请日：2011-06-09

申请人： Jun XIE ,  Kevin P. Fairbairn ,  Charles Liu ,  Patrick Leahey ,  Robert L. Ruck ,  Terry Bluck

发明人： Jun XIE ,  Kevin P. Fairbairn ,  Charles Liu ,  Patrick Leahey ,  Robert L. Ruck ,  Terry Bluck

IPC分类号： C23C16/50

CPC分类号： C23C16/4412 ,  C23C16/4409 ,  H01J37/32513 ,  H01J37/32798 ,  H01J37/32834 ,  H01J37/32871

摘要： An enclosure for generating a secondary environment within a processing chamber for coating a substrate. An enclosure wall forms a secondary environment encompassing the coating source, plasma, and the substrate, and separating them from interior of the processing chamber. The enclosure wall includes a plurality of pumping channels for diverting gaseous flow away from the substrate. The channels have an intake of larger diameter from the exhaust opening and are oriented at an angle with the intake opening pointing away from the deposition source. A movable seal enables transport of the substrate in open position and processing the substrate in closed position. The seal may be formed as a labyrinth seal to avoid particle generation from a standard contact seal.

摘要翻译： 一种用于在用于涂覆基底的处理室内产生二次环境的外壳。 外壳壁形成包围涂料源，等离子体和基材的二次环境，并将它们从处理室的内部分离。 封闭壁包括多个泵送通道，用于将气流从衬底转向。 通道具有来自排气口的较大直径的入口并且与进气开口指向远离沉积源的角度定向。 可移动密封件使得能够将基板传送到打开位置并且将基板处于关闭位置。 密封件可以形成为迷宫式密封件，以避免从标准接触密封件产生颗粒。

公开(公告)号：US06919001B2

公开(公告)日：2005-07-19

申请号：US10361308

申请日：2003-02-10

申请人： Kevin P. Fairbairn ,  Terry Bluck ,  Craig Marion ,  Robert E. Weiss

发明人： Kevin P. Fairbairn ,  Terry Bluck ,  Craig Marion ,  Robert E. Weiss

IPC分类号： C23C14/56 ,  C23C16/458 ,  C23C16/54 ,  G11B5/84 ,  H01L21/00 ,  C23C14/32 ,  B65G65/00

CPC分类号： C23C16/4587 ,  C23C14/568 ,  C23C16/54 ,  G11B5/00 ,  G11B5/8404 ,  H01L21/67161 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276

摘要： There is described a disk processing and manufacturing equipment in which the processing chambers are stacked on top of each other and in which the disks move through the system on disk carriers which are adjustable to take disks of varying sizes. The disks enter the system through a load zone and are then installed into disk carriers. They move in the carriers sequentially through processing chambers at one level and then move to the other level in a lift or elevator. At this other level, the disks again move sequentially through the system on that level and then exit at an unload zone.

摘要翻译： 描述了一种磁盘处理和制造设备，其中处理室彼此堆叠，并且其中盘移动通过系统在可调节以容纳不同大小的盘的盘载体上。 磁盘通过加载区进入系统，然后安装到磁盘托盘中。 它们在载体中顺序地通过处理室在一个级别移动，然后在电梯或电梯中移动到另一个级别。 在这个其他级别，磁盘再次依次移动通过该级别的系统，然后在卸载区域退出。

公开(公告)号：US20170004987A1

公开(公告)日：2017-01-05

申请号：US14788574

申请日：2015-06-30

申请人： Kevin P. Fairbairn

发明人： Kevin P. Fairbairn

IPC分类号： H01L21/68 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/681 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68707

摘要： An improved position control means for robotic handling systems; particularly, a sensing system and method for precisely determining the center point of a substrate, such as a semiconductor wafer, relative to a destination point by using a set of multi pixel imaging sensors incorporated into the wafer carrying end effector of the robotic handling system.

摘要翻译： 一种用于机器人处理系统的改进的位置控制装置; 特别地，通过使用结合到机器人处理系统的晶片承载端部执行器中的一组多像素成像传感器来相对于目的地点精确地确定诸如半导体晶片的衬底的中心点的感测系统和方法。

公开(公告)号：US07042060B2

公开(公告)日：2006-05-09

申请号：US10891877

申请日：2004-07-15

申请人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

发明人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

IPC分类号： H01L31/00 ,  H01L29/04 ,  H01L29/06 ,  H01L31/062 ,  H01L31/113

CPC分类号： H01L27/14683 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14806

摘要： Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

摘要翻译： 以区域选择性的方式进行反向应用于用于电子轰击装置的成像传感器12。 进一步的布置导致与像素42或像素组对准的准直器51的阵列，从而提供这种图像传感器的改善的图像对比度。 在照明的后表面上提供薄的P掺杂层52提供了扩散屏障，从而提供改进的分辨率和用于参考像素的功能屏蔽。 P掺杂层52的浓度梯度优化了像素阵列处的电子收集。

公开(公告)号：US07479686B2

公开(公告)日：2009-01-20

申请号：US11290384

申请日：2005-11-30

申请人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

发明人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

IPC分类号： H01L31/00

CPC分类号： H01L27/14625 ,  H01L27/14603 ,  H01L27/14623 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14643

摘要： Backthinning in an area selective manner is applied to CMOS imaging sensors 12 for use in electron bombarded active pixel array devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels of an active pixel array providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

摘要翻译： 以区域选择性方式进行反向应用于用于电子轰击的有源像素阵列器件的CMOS成像传感器12。 进一步的布置导致准直器51的阵列与像素42或有源像素阵列的像素组对齐，从而提供这种图像传感器的改善的图像对比度。 在照明的后表面上提供薄的P掺杂层52提供了扩散屏障，从而提供改进的分辨率和用于参考像素的功能屏蔽。 P掺杂层52的浓度梯度优化了像素阵列处的电子收集。

公开(公告)号：US07005637B2

公开(公告)日：2006-02-28

申请号：US10795041

申请日：2004-03-05

申请人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

发明人： Kenneth A Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

IPC分类号： H01L31/00

CPC分类号： H01L27/14625 ,  H01L27/14603 ,  H01L27/14623 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14643

摘要： Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

公开(公告)号：US06625497B2

公开(公告)日：2003-09-23

申请号：US09901462

申请日：2001-07-10

申请人： Kevin P. Fairbairn ,  Bo Su

发明人： Kevin P. Fairbairn ,  Bo Su

IPC分类号： G05B1500

CPC分类号： H01L21/67253 ,  G03F7/70558 ,  G03F7/70625 ,  G03F7/70641 ,  G05B2219/32182 ,  G05B2219/32189 ,  G05B2219/45031 ,  H01L22/20 ,  H01L2924/0002 ,  Y02P90/22 ,  H01L2924/00

摘要： A method and apparatus for processing a semiconductor wafer to reduce CD variation feeds back information gathered during inspection of the wafer to a previously visited processing tool and feeds forward information to adjust the next process the wafer will undergo. The inspection and processing are performed at a single processing module without exposing the wafer to ambient atmospheric conditions. Embodiments include removing a wafer from a wafer cassette, and measuring a dimension of a feature on the surface of the wafer, such as the feature's CD using an optical measuring tool. A process, such as an etch process, is then performed on the wafer using a set of process parameter values, such as an etch recipe, selected based on the CD measurement, and the wafer is returned to a cassette. The CD measurements are also linked to photolithography adjustable parameters such as stepper focus and exposure settings. The linked information on focus and exposure is fed back to the previously visited photo cell so the stepper can be adjusted, either automatically or at the user's discretion, to correct the deviation in following lots. In some embodiments, post-etch processing, such as ash stripping, wet cleaning and/or further CD measurement, are performed by the module before the wafer is returned to a cassette. All of the transfer and processing steps performed by the module are performed in a clean environment, thereby increasing yield by avoiding exposing the wafer to the atmosphere and possible contamination between steps. This feedback and feed-forward mechanism improves CD control by adjusting processing parameters for every wafer based on the wafer's measured CD.