摘要:
A semiconductor integrated circuit device of the present invention includes a plurality of banks and a plurality of sense amplifier bands. A switch circuit included in each sense amplifier band receives a signal on a transmission line and outputs a signal read from the bank to a global data input/output line arranged in the column direction. A column bank control circuit for outputting a column bank control signal is arranged on the column decoder side. The column bank control signal is supplied to the transmission line through a column bank control signal line arranged in the column direction. The switch circuit operates in accordance with the column bank control signal. By such a configuration, a column-related operation can be matched easily.
摘要:
Current is reduced in driving a word line in stress acceleration testing such as burn-in, and the time required for the stress acceleration testing is reduced. For an address signal applied from an address buffer, a predetermined internal address signal bit is degenerated and a remaining address signal bit is rendered valid in response to an activation of a stress acceleration mode designation signal to simultaneously drive a desired number of word lines of all word lines to selected state. Any number of word lines can be simultaneously selected and hence current flowing in driving word lines can be reduced in the stress acceleration mode. In the stress acceleration mode of operation, bit line voltage and cell plate voltage are changed, and a current required for driving a plurality of word lines into a selected state is limited.
摘要:
In a defective cell write mode, a precharge potential generating circuit generates a precharge potential at a high level or a low level in accordance with an external control signal, and applies the potential to a bit line pair. Parallel to a fuse element provided between a main bit line precharge potential supply line and a sub bit line precharge potential supply line and is cut when a column is replaced by a redundancy column of memory cells, a pass transistor which is rendered conductive in the defective cell write mode is provided.
摘要:
A semiconductor circuit or a MOS-DRAM wherein converting means is provided that converts substrate potential or body bias potential between two values for MOS-FETs in a logic circuit, memory cells, and operating circuit of the MOS-DRAM, thereby raising the threshold voltage of the MOS-FETs when in the standby state and lowering it when in active state. The converting means includes a level shift circuit and a switch circuit. The substrate potential or body bias potential is controlled only of the MOS-FETs which are nonconducting in the standby state; this configuration achieves a reduction in power consumption associated with the potential switching. Furthermore, in a structure where MOS-FETs of the same conductivity type are formed adjacent to each other, MOS-FETs of SOI structure are preferable for better results.
摘要:
A semiconductor memory device comprises a main bit line pair, a plurality of subbit line pairs, a plurality of selection transistor pairs, a plurality of word lines, a plurality of memory cells, and a plurality of first precharging circuits. The subbit line pairs are provided in correspondence to the main bit line pair. One and other subbit lines of the subbit line pairs are arranged in straight lines along the main bit line pair. The selection transistors are provided in correspondence to the subbit line pairs. Each of the selection transistor pairs is connected between the main bit line pair and the corresponding subbit line pair, and turned on in response to a prescribed selection signal. The word lines are arranged to intersect with one and the other subbit lines of the subbit line pairs. The memory cells are provided in correspondence to intersection points between one and the other subbit lines of the subbit line pairs and the word lines. Each of the memory cells is connected to the corresponding subbit line and the corresponding word line. The first precharging circuits are provided in correspondence to the subbit line pairs. Each of the first precharging circuits directly precharges the corresponding subbit line pair at the prescribed precharging potential.
摘要:
Data input/output pad portions are arranged corresponding to memory blocks and adjacent to a corresponding memory block in the center region between memory blocks, and memory blocks. Power supply pads are arranged at both ends of the center region. Power supply pad transmits a power supply voltage to data input/output pad portions, and power supply pad transmits the power supply voltage to data input/output pad portions. Power supply pad for peripheral circuitry is arranged in the center portion of the center region. A multibit test circuit is provided for each memory block. A data input/output buffer operating stably at high speed is implemented in a large storage capacity memory device which in turn accommodates a multibit test mode.
摘要:
One memory array is divided into a plurality of banks sharing a row of memory cells. Global IO buses are disposed for memory column blocks forming the plurality of banks included in one memory array. The global IO buses are selectively and electrically connected to the same data input/output terminal.
摘要:
In a DRAM, an upper address is assigned to each of ways W0 and W1, and a lower address is assigned to each word line WL in each of ways W0 and W1. A self-refresh start trigger generating circuit senses start of self-refresh, and a refresh address change sensing circuit senses change in an upper address. Based on the result of sensing, way selection signals RX0 and RX1 will not be reset and held at an active level while ways W0 and W1 are selected, respectively. Consequently, power consumption can be reduced compared to a conventional example in which signals RX0 and RX1 are reset every time a single word line WL is selected.
摘要:
A semiconductor memory device includes a semiconductor substrate, a plurality of sub bit line pairs formed on the semiconductor substrate, a main bit line pair formed at a layer above the plurality of sub bit line pairs, a plurality of selecting transistors, a plurality of word lines located to cross the sub bit line pairs, and a plurality of memory cells. Each selecting transistor is provided corresponding to one sub bit line and has one source/drain region connected to a corresponding sub bit line. At a layer above the other source/drain region of the selecting transistor, an intermediate layer is formed in the same layer as that of a storage node of memory cell. The intermediate layer is connected to the other source/drain region of the selecting transistor through a contact hole formed beneath it. The intermediate layer is further connected to the main bit line through another contact hole formed on the intermediate layer.
摘要:
Main bit lines MBL and ZMBL are disposed at opposite sides of a sense amplifier SA. Main bit lines MBL and ZMBL each are provided for paired sub-bit lines SBL1 and SBL2 (or SBL3 and SBL4). Sub-bit line pair SBL1 and SBL2 is connected to main bit line MBL via a block select switch T1. Sub-bit line pair SBL3 and SBL4 is connected to main bit line ZMBL via a block select switch T2. Since one main bit line is provided for two sub-bit lines, a pitch of the main bit lines is twice as large as a pitch of the sub-bit lines, so that conditions on the pitch of main bit lines are remarkably eased, which facilitates layout of elements.