摘要:
A liquid crystal display device includes: a pair of substrates disposed to face each other with a predetermined distance therebetween; a seal pattern, provided between the pair of substrates and has a closed-loop shape to surround and seal a liquid crystal, wherein the liquid crystal is provided in a form of a plurality of droplets on one of the pair of substrates and then is sandwiched between the pair of substrates, so that the plurality of droplets are respectively spread and sealed in a region surrounded by the seal pattern; and a dummy pattern, which is formed on the one substrate in the region surrounded by the seal pattern and has a height less than half of the predetermined distance, the dummy pattern being arranged adjacent to and in parallel to the seal pattern and in a range to which one droplet is spread out.
摘要:
A semiconductor integrated circuit device includes first to k-th decoders, and a MOS transistor switch group having a hierarchical structure of first to k-th hierarchies and operated on a second voltage level. An n-bit input signal of a first voltage level is divided into k groups (k is an integral number equal to or larger than 2) and input to the first to k-th decoders. The first to k-th decoders decode the input signal, shift the decode results to the second voltage level higher than the first voltage level and output the same. The MOS transistor switch group is supplied with 2n analog inputs at the first hierarchy, selects one of the 2n analog inputs and outputs the selected analog input from the k-th hierarchy.
摘要:
A method for manufacturing a microlens formed on a semiconductor substrate includes the steps of preparing the semiconductor substrate, forming an insulating film, which has high etching selectivity with the semiconductor substrate, on the semiconductor substrate, forming a first resist layer, which has an opening that exposes a part of the insulating film, on the insulating film, forming a lens forming portion by eliminating a part of the insulting film, using the first resist layer as a mask, forming a second resist layer, which has roughly cylindrical shape, on the lens forming portion surrounded by the insulating film, transforming the second resist layer into a third resist layer that has roughly hemispheric shape by reflowing the second resist later with a heat treatment, and forming a lens on the semiconductor substrate by etching the third resist layer, the semiconductor substrate, and the insulating film simultaneously with anisotropic etching.
摘要:
A semiconductor integrated circuit is fabricated in a substrate having a semiconductor layer and an underlying insulator layer. The fabrication process includes a step of locally oxidizing the semiconductor layer to form a field oxide, during which step the semiconductor layer is protected by a nitride film. The nitride film has both openings to permit local oxidization in the integrated circuit area, and an opening defining an alignment mark adjacent to the circuit area. The alignment mark may be formed either in the semiconductor and insulator layers, or in a part of the nitride film left after the nitride film is removed from the circuit area. In either case, the edge height of the alignment mark is not limited by the thickness of the semiconductor layer. Using the nitride layer to define both the alignment mark and the field oxide reduces the necessary number of fabrication steps.
摘要:
A forward direction-only path (first substrate transport path) is formed for transporting substrates in a forward direction to pass the substrates on to an exposing apparatus. A separate, substrate transport path (second substrate transport path) is formed exclusively for post-exposure bake (PEB). Substrate transport along each path is carried out independently of substrate transport along the other. A fourth main transport mechanism is interposed as a predetermined substrate transport mechanism between transfer points consisting of a buffer acting as a temporary storage module for temporarily storing the substrates and a post-exposure bake (PEB) unit corresponding to a predetermined treating unit. This arrangement forms the path for transporting the substrates between the buffer and the PEB unit, to allow PEB treatment of the substrates to be performed smoothly. Similarly, the substrates are transported smoothly to the buffer.
摘要:
A liquid crystal display device significantly reduces power consumption and causes no signal delay when a liquid crystal panel performs an inversion-type drive. The liquid crystal display device comprises a digital controller, a level shift circuit, a digital-to-analog (D/A) converter, a liquid crystal panel, and a plurality of capacitors. In the D/A converter, a charging control circuit is provided corresponding to each capacitor. The charging control circuit comprises a switch, a diode and an inverter, the switch and the diode being coupled in parallel. The switch is turned on and off in response to a switching signal from the digital controller. The switch is changed to a turning- on state during a blanking period after one horizontal displaying. Upon turning-on of the switch, the capacitors are charged. Digital pixel data outputted from the digital controller undergoes a level changing depending on a voltage across the electrodes of the capacitors, according to a charge conservation.
摘要:
A compound semiconductor device including a semiconductor substrate having (100) plane as a crystal growth plane, a first semiconductor layer as an electron traveling layer and a second semiconductor layer for supplying electrons to the electron traveling layer. The first semiconductor layer is formed on the semiconductor substrate and has a different lattice constant from the semiconductor substrate so that a first strain is applied in the first semiconductor layer in a first strain direction. The second semiconductor layer is formed on the first semiconductor layer and has a different lattice constant from the first semiconductor layer to thereby apply a second strain to the second semiconductor layer. The second strain has a direction that is inverse to the first strain direction. In addition, the thickness of the semiconductor layer is defined so as to compensate for the first strain applied to the first semiconductor layer by the second strain applied to the second semiconductor.
摘要:
The present invention relates to a phase shifting mask for use in a photolithographic process of forming a wiring pattern. The phase shifting mask comprises a transparent base plate (11), shading layers (12) formed selectively on the transparent base plate (11), and two kinds of phase shifting layers (13a, 13b) formed on transparent portions of the transparent base plate between the adjacent shading layers, respectively. The phase difference of the two kinds of phase shifting layers (13a, 13b) relative to the transparent base plate (11) is 90.degree., and the phase difference between the phase shifting layers is 180.degree.. The transfer of an unnecessary pattern in the shifter edge portion can be obviated by using the shading layers having a phase difference of 90.degree. relative to the transparent base plate.
摘要:
An output circuit which outputs an output signal based on an input signal from an output terminal and brings the output terminal into a high impedance state in response to an impedance control signal. The output circuit includes an output pMOS transistor connected at a source thereof to a first power supply. The output circuit includes an output nMOS transistor connected between a drain of the output pMOS transistor and ground. The output circuit includes an output terminal connected between the drain of the output pMOS transistor and a drain of the output nMOS transistor. The output circuit includes a first level shifter circuit which outputs a first gate control signal from a first gate control terminal to control on/off of the output pMOS transistor. The output circuit includes a second level shifter circuit which outputs a second gate control signal from a second gate control terminal to control on/off of the output nMOS transistor.
摘要:
A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.