公开(公告)号：US20050087718A1

公开(公告)日：2005-04-28

申请号：US10496471

申请日：2003-02-19

申请人： Toru Okada

发明人： Toru Okada

IPC分类号： A61K8/19 ,  A61Q5/00 ,  A61Q5/04 ,  A61Q7/00 ,  B05D3/00

CPC分类号： A61Q5/00 ,  A61K8/19 ,  A61Q5/04 ,  A61Q7/00

摘要： A treatment agent for animal fiber protection which comprises an aqueous solution containing divalent metal ions or a divalent metal salt. The treatment agent prevents hair and animal fiber damage associated with permanent wave treatments, bleaching treatments, etc.

摘要翻译： 一种含有二价金属离子或二价金属盐的水溶液的动物纤维保护用处理剂。 治疗剂可防止与永久性波浪治疗相关的头发和动物纤维损伤，漂白处理等。

公开(公告)号：US4020568A

公开(公告)日：1977-05-03

申请号：US670024

申请日：1976-03-24

申请人： Yuzo Tajima ,  Toru Okada

发明人： Yuzo Tajima ,  Toru Okada

IPC分类号： G09B27/02 ,  G09B27/00

CPC分类号： G09B27/02

摘要： A planetarium moon projector of the direct casting type includes two alternatively interchangeable occulting elements which rotate at twice the period of moon phasing to intercept the projected light beam and effect the waxing and waning of the moon, and which are conically shaped with the same convergent angle as the projected convergent light and with an occulting relief angle. Two intermittent gears revolve integrally with the occulting elements and there is provided a fixed cylindrical rail with a rack, which keeps contact with the intermittent gears, and which interchanges the occulting elements when the intermittent gears are engaged with the rack. An eccentric drive coupling is provided to correct the dislocation of the moon phase caused by the occulting relief angle.

摘要翻译： 直接铸造型天文馆月亮投影仪包括两个交替可互换的遮蔽元件，其以两倍的月相定时旋转以截取投影光束并且实现月亮的打蜡和减弱，并且以相同的会聚角度 作为投射的会聚光并具有隐蔽的角度。 两个间歇齿轮与遮蔽元件一体地旋转，并且设置有一个具有齿条的固定圆柱形轨道，其与间歇齿轮保持接触，并且当间歇齿轮与齿条啮合时，使遮蔽元件相互交换。 提供偏心驱动联轴器来校正由隐形释放角引起的月相位错。

公开(公告)号：US09618416B2

公开(公告)日：2017-04-11

申请号：US13990024

申请日：2011-12-09

申请人： Toru Okada ,  Takayuki Fukuda

发明人： Toru Okada ,  Takayuki Fukuda

IPC分类号： G01L25/00 ,  G01M17/02

CPC分类号： G01L25/003 ,  G01M17/02 ,  G01M17/021

摘要： A crosstalk correction coefficient of a multi component force detector provided in a rolling resistance testing machine is calibrated. A method of calibrating a multi component force detector provided in a rolling resistance testing machine including a spindle shaft to which a tire is attached, a running drum with a simulation road surface on which the tire is pressed, and a rotation torque meter provided in a rotation shaft of the running drum; in which, in performing a process of calculating a force acting on the tire from a measurement value of the multi component force detector by using a crosstalk correction coefficient that corrects an influence of crosstalk occurring in the multi component force detector, the crosstalk correction coefficient is calibrated by using a rolling test data including a rotation torque measured by the rotation torque meter and a force measured by the multi component force detector.

公开(公告)号：US20130253852A1

公开(公告)日：2013-09-26

申请号：US13990024

申请日：2011-12-09

申请人： Toru Okada ,  Takayuki Fukuda

发明人： Toru Okada ,  Takayuki Fukuda

IPC分类号： G01L25/00

CPC分类号： G01L25/003 ,  G01M17/02 ,  G01M17/021

摘要： A crosstalk correction coefficient of a multi component force detector provided in a rolling resistance testing machine is calibrated. A method of calibrating a multi component force detector provided in a rolling resistance testing machine including a spindle shaft to which a tire is attached, a running drum with a simulation road surface on which the tire is pressed, and a rotation torque meter provided in a rotation shaft of the running drum; in which, in performing a process of calculating a force acting on the tire from a measurement value of the multi component force detector by using a crosstalk correction coefficient that corrects an influence of crosstalk occurring in the multi component force detector, the crosstalk correction coefficient is calibrated by using a rolling test data including a rotation torque measured by the rotation torque meter and a force measured by the multi component force detector.

摘要翻译： 在滚动阻力测试机中设置的多分力检测器的串扰校正系数被校准。 一种校准设置在滚动阻力试验机中的多分力测力机的方法，所述滚动阻力试验机包括安装有轮胎的主轴，具有轮胎压靠在其上的模拟路面的行驶滚筒， 运行滚筒的旋转轴; 其中，在通过使用校正多分力检测器中发生的串扰的影响的串扰校正系数执行从多分力检测器的测量值计算作用在轮胎上的力的处理时，串扰校正系数为 通过使用包括由旋转扭矩计测量的旋转扭矩和由多分力检测器测量的力的滚动测试数据进行校准。

公开(公告)号：US08434670B2

公开(公告)日：2013-05-07

申请号：US12485642

申请日：2009-06-16

申请人： Toru Okada ,  Satoshi Emoto

发明人： Toru Okada ,  Satoshi Emoto

IPC分类号： B23K3/00 ,  B23K3/04 ,  B23K1/00 ,  B23K1/018

CPC分类号： H05K3/3494 ,  B23K1/012 ,  B23K3/04 ,  H05K3/225 ,  H05K2201/10371 ,  H05K2203/081

摘要： A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

摘要翻译： 修理装置包括加热头装置，其被配置为加热焊接到电路板的焊接部件。 加热头装置包括加热头和由加热头加热的接触构件。 接触构件由具有比加热头的热导率高的弹簧特性和导热性的材料形成。 接触构件被配置成以弹性力与焊接构件的焊接表面接触，以便熔化将焊接构件接合到电路板的焊料。

公开(公告)号：US20120060356A1

公开(公告)日：2012-03-15

申请号：US13225902

申请日：2011-09-06

申请人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

发明人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

IPC分类号： G01R31/28 ,  B23P21/00

CPC分类号： H05K13/0486 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49004 ,  Y10T29/53022

摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

摘要翻译： 一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。

公开(公告)号：US08089562B2

公开(公告)日：2012-01-03

申请号：US11642903

申请日：2006-12-20

申请人： Toru Okada ,  Hiroyuki Ebinuma

发明人： Toru Okada ,  Hiroyuki Ebinuma

IPC分类号： H04N5/18 ,  H04N5/57 ,  H04N5/16

CPC分类号： H04N5/53 ,  H04N7/015 ,  H04N21/42607

摘要： A signal processing circuit includes an auto gain control circuit and amplifies a signal with an amplification ratio determined based on a synchronous signal level having a positive potential with respect to a black level included in a high definition television video signal. In consequence, during the processing of the high definition television video signal, the signal processing is performed with a desired amplification ratio.

摘要翻译： 信号处理电路包括自动增益控制电路，并且以相对于包含在高清晰度电视视频信号中的黑电平具有正电位的同步信号电平确定的放大率来放大信号。 因此，在处理高分辨率电视视频信号期间，以期望的放大率进行信号处理。

公开(公告)号：US07963434B2

公开(公告)日：2011-06-21

申请号：US12774881

申请日：2010-05-06

申请人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

发明人： Keiichi Yamamoto ,  Masakazu Takesue ,  Masanao Fujii ,  Toru Okada

IPC分类号： B23K1/018

CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

摘要翻译： 一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。

公开(公告)号：US07717317B2

公开(公告)日：2010-05-18

申请号：US11864600

申请日：2007-09-28

申请人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

发明人： Masanao Fujii ,  Toru Okada ,  Yutaka Noda ,  Ryoji Matsuyama ,  Hidehiko Kobayashi ,  Hisao Tanaka

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： H01L21/4853 ,  B23K3/0623 ,  H01L2224/11334 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082

摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

摘要翻译： 本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地 从具有相同尺寸的多个球捕获一个球。 该装置包括：保持构件111，其包括保持壁111a，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有比一个球的尺寸大的孔1111，并且小于 在保持壁的上部形成有两个球; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

公开(公告)号：US07436062B2

公开(公告)日：2008-10-14

申请号：US10223454

申请日：2002-08-20

申请人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

发明人： Norio Kainuma ,  Shunji Baba ,  Hidehiko Kira ,  Toru Okada

IPC分类号： H01L23/48 ,  H01L23/04

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/13 ,  H01L24/14 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05664

摘要： An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 μm is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

摘要翻译： 一种用于改善超声波接合并安装在电路板上的半导体芯片元件100的底部填充填充的装置和方法。 半导体芯片元件100包括硅芯片101和形成在芯片101的底表面101a上的一组柱形突起117。 信号柱凸起113由金制成，而电源凸块114，接地柱形凸块115和虚拟凸块凸块116都由金 - 钯合金制成，其比信号柱凸块113更硬，因此在超声波期间不容易变形 治疗。 因此，在安装半导体芯片元件100的状态下，在芯片100的底面101a与半导体芯片元件100的电路基板120的上表面之间保持约30μm的间隙 安装。