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    Physical quantity sensor and semiconductor device having package and cover
    12.
    发明授权
    Physical quantity sensor and semiconductor device having package and cover 有权
    物理量传感器和具有封装和封盖的半导体器件

    公开(公告)号：US07719006B2

    公开(公告)日：2010-05-18

    申请号：US12072319

    申请日：2008-02-26

    申请人： Tatsuya Watanabe ,  Masahiko Imoto

    发明人： Tatsuya Watanabe ,  Masahiko Imoto

    IPC分类号： H01L23/58

    CPC分类号： H01L23/04 ,  H01L23/053 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor device includes: a semiconductor chip; a package for accommodating the chip, wherein the package has a box shape with an opening and a bottom; and a cover for sealing the opening of the package. The semiconductor chip is disposed on the bottom of the package. The cover has a plate shape. The cover includes a protrusion, which is disposed at a center of the plate shape. The protrusion protrudes toward an outside of the package.

    摘要翻译： 半导体器件包括：半导体芯片; 用于容纳所述芯片的封装，其中所述封装具有带有开口和底部的盒形; 以及用于密封包装的开口的盖。 半导体芯片设置在封装的底部。 盖板具有板形。 该盖包括设置在板形中心的突出部。 突出部朝向包装体的外侧突出。

    Condensed furan compounds
    13.
    发明申请
    Condensed furan compounds 失效
    稠化呋喃化合物

    公开(公告)号：US20090156803A1

    公开(公告)日：2009-06-18

    申请号：US12320583

    申请日：2009-01-29

    申请人： Takayuki Kawaguchi ,  Hidenori Akatsuka ,  Toru Iijima ,  Tatsuya Watanabe ,  Jun Murakami ,  Takashi Mitsui

    发明人： Takayuki Kawaguchi ,  Hidenori Akatsuka ,  Toru Iijima ,  Tatsuya Watanabe ,  Jun Murakami ,  Takashi Mitsui

    IPC分类号： C07D491/048

    CPC分类号： C07D491/04 ,  C07D213/75

    摘要： The present invention provides a condensed furan compound of the formula (I): wherein Ring X is benzene, pyridine, or the like; Y is an optionally substituted amino, an optionally substituted cycloalkyl, an optionally substituted aryl, an optionally substituted saturated heterocyclic group, an optionally substituted unsaturated heterocyclic group; A is a single bond, lower alkylene, lower alkenylidene, lower alkenylene or an oxygen atom; R3 is hydrogen or the like; and, R4 is hydrogen, or the like, or pharmaceutically acceptable salts thereof, which is useful as a medicament, particularly, as an activated blood coagulation factor X inhibitor.

    摘要翻译： 本发明提供式（I）的缩合呋喃化合物：其中环X为苯，吡啶等; Y是任选取代的氨基，任选取代的环烷基，任选取代的芳基，任选取代的饱和杂环基，任选取代的不饱和杂环基; A是单键，低级亚烷基，低级亚烯基，低级亚烯基或氧原子; R3是氢等; 和R4为氢等，或其药学上可接受的盐，其可用作药物，特别是活性凝血因子X抑制剂。

    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case
    14.
    发明申请
    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权
    制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法

    公开(公告)号：US20080296796A1

    公开(公告)日：2008-12-04

    申请号：US12156518

    申请日：2008-06-02

    申请人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    发明人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    IPC分类号： B29C45/00

    CPC分类号： H01L21/565 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/2708 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

    摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。

    Water-soluble mutein of FGF receptor, DNA and production thereof
    17.
    发明授权
    Water-soluble mutein of FGF receptor, DNA and production thereof 失效
    FGF受体的水溶性突变蛋白，DNA及其生产

    公开(公告)号：US5750371A

    公开(公告)日：1998-05-12

    申请号：US471570

    申请日：1995-06-06

    申请人： Masaharu Senoo ,  Tatsuya Watanabe ,  Koichi Igarashi

    发明人： Masaharu Senoo ,  Tatsuya Watanabe ,  Koichi Igarashi

    IPC分类号： A61K38/00 ,  C07K14/71 ,  C12N15/12 ,  C07H21/00 ,  C12N15/63

    CPC分类号： C07K14/71 ,  A61K38/00

    摘要： Disclosed are (1) a water-soluble mutein of an animal protein having activity as a receptor for a fibroblast growth factor (FGF) protein, (2) a recombinant DNA having a nucleotide sequence coding for the above water-soluble mutein, (3) a vector containing the above recombinant DNA, (4) a transformant transformed with the above vector, and (5) a process for producing the water-soluble mutein which comprises cultivating the above transformant in a culture medium, the mutein being useful as therapeutic agents or to enhance cell proliferation activity.

    摘要翻译： 公开了（1）具有作为成纤维细胞生长因子（FGF）蛋白的受体的活性的动物蛋白质的水溶性突变蛋白，（2）具有编码上述水溶性突变蛋白的核苷酸序列的重组DNA（3 ）含有上述重组DNA的载体，（4）用上述载体转化的转化体，和（5）一种生产水溶性突变蛋白的方法，其包括在培养基中培养上述转化体，所述突变蛋白可用作治疗 药剂或增强细胞增殖活性。

    Reflection plate, light-emitting device and method of manufacturing reflection plate
    18.
    发明授权
    Reflection plate, light-emitting device and method of manufacturing reflection plate 有权
    反射板，发光装置及制造反射板的方法

    公开(公告)号：US08080939B2

    公开(公告)日：2011-12-20

    申请号：US12578951

    申请日：2009-10-14

    申请人： Yu Nomura ,  Hiroyuki Kiso ,  Tatsuya Watanabe

    发明人： Yu Nomura ,  Hiroyuki Kiso ,  Tatsuya Watanabe

    IPC分类号： H01J1/62

    CPC分类号： B29D11/00596 ,  G02B5/201 ,  G02B19/0028 ,  G02B19/0047 ,  G02B19/0066 ,  H01L27/322 ,  H01L51/5271 ,  H01L51/5284 ,  H01L2251/5315

    摘要： A reflection plate allowing the prevention of the generation of stray light, a method of manufacturing the same, and a light-emitting device using such a reflection plate are provided. The reflection plate includes: a base having light transparency, and having a plurality of projections formed on a surface thereof; a reflecting mirror film arranged so as to be laid over a side surface of each of the projections in the base; and a light absorption layer arranged in a part or the whole of each of depressions on the surface of the base, the depressions being formed in spaces between the plurality of projections.

    摘要翻译： 提供了允许防止杂散光的产生的反射板，其制造方法和使用这种反射板的发光装置。 反射板包括：具有透光性的基底，在其表面上形成有多个突起; 反射镜膜，布置成布置在基部中的每个突起的侧表面上; 以及布置在基座表面上的每个凹部的一部分或全部的光吸收层，所述凹陷形成在所述多个突起之间的空间中。

    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case
    20.
    发明授权
    Method of manufacturing electronic device having resin-molded case and molding tool for forming resin-molded case 有权
    制造具有树脂模制外壳的电子装置和用于形成树脂模制壳体的模制工具的方法

    公开(公告)号：US07776247B2

    公开(公告)日：2010-08-17

    申请号：US12156518

    申请日：2008-06-02

    申请人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    发明人： Tatsuya Watanabe ,  Masahiko Imoto ,  Yoshinari Goshima

    IPC分类号： B29C45/14

    CPC分类号： H01L21/565 ,  B29C45/0046 ,  B29C45/14639 ,  B29C45/2708 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

    摘要翻译： 在制造电子设备的方法中，电子元件设置在与连接器端子电耦合的布线板上，布线板的第一表面被第一壳体元件覆盖，并且布线板的第二表面是 覆盖有第二壳体元件以形成电子电路部分，电子电路部分设置在模制工具的壳体腔中，并且将树脂填充到壳体腔中以形成树脂模制壳体，同时保持 将第一壳体元件推向布线板并随时间变化的第一压力基本上等于将第二壳体元件推向布线板并随时间变化的第二压力。