Edge barrier film for electronic devices

    公开(公告)号:US11075357B2

    公开(公告)日:2021-07-27

    申请号:US15899651

    申请日:2018-02-20

    Abstract: In some embodiments, a first product is provided. The first product may include a substrate, a device having a device footprint disposed over the substrate, and a barrier film disposed over the substrate and substantially along a side of the device footprint. The barrier film may comprise a mixture of a polymeric material and non-polymeric material. The barrier film may have a perpendicular length that is less than or equal to 3.0 mm from the side of the device footprint.

    OLED lighting device with short tolerant structure

    公开(公告)号:US10164000B2

    公开(公告)日:2018-12-25

    申请号:US15604748

    申请日:2017-05-25

    Abstract: A first device that may include a short tolerant structure, and methods for fabricating embodiments of the first device, are provided. A first device may include a substrate and a plurality of OLED circuit elements disposed on the substrate. Each OLED circuit element may include a fuse that is adapted to open an electrical connection in response to an electrical short in the pixel. Each OLED circuit element may comprise a pixel that may include a first electrode, a second electrode, and an organic electroluminescent (EL) material disposed between the first and the second electrodes. Each of the OLED circuit elements may not be electrically connected in series with any other of the OLED circuit elements.

    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES
    16.
    发明申请
    MANUFACTURING FLEXIBLE ORGANIC ELECTRONIC DEVICES 审中-公开
    制造柔性有机电子器件

    公开(公告)号:US20160133838A1

    公开(公告)日:2016-05-12

    申请号:US14996600

    申请日:2016-01-15

    Abstract: A method of forming microelectronic systems on a flexible substrate includes depositing (typically sequentially) on a first side of the flexible substrate at least one organic thin film layer, at least one electrode and at least one thin film encapsulation layer over the at least one organic thin film layer and the at least one electrode, wherein depositing the at least one organic thin film layer, depositing the at least one electrode and depositing the at least one thin film encapsulation layer each occur under vacuum and wherein no physical contact of the at least one organic thin film layer or the at least one electrode with another solid material occurs prior to depositing the at least one thin film encapsulation layer.

    Abstract translation: 在柔性衬底上形成微电子系统的方法包括在柔性衬底的第一侧上沉积(通常顺序地)至少一个有机薄膜层,至少一个电极和至少一个有机薄膜封装层上的至少一个薄膜封装层 薄膜层和所述至少一个电极,其中沉积所述至少一个有机薄膜层,沉积所述至少一个电极并沉积所述至少一个薄膜封装层,每个都在真空下进行,并且其中至少一个 一个有机薄膜层或至少一个具有另一固体材料的电极在沉积至少一个薄膜封装层之前发生。

    Flexible lighting devices
    17.
    发明授权
    Flexible lighting devices 有权
    灵活的照明设备

    公开(公告)号:US09184419B2

    公开(公告)日:2015-11-10

    申请号:US14202430

    申请日:2014-03-10

    Abstract: A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10−1 Nm and 10−6 Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.

    Abstract translation: 提供了用于制造第一装置的第一装置和方法。 第一器件可以包括柔性衬底和设置在柔性衬底上的至少一个有机发光器件(OLED)。 第一装置可以具有在10-1Nm至10-6Nm之间的弯曲刚度,并且第一装置的临界应变能释放速率与材料密度因子的比可以大于0.05Jm / Kg。

    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES
    19.
    发明申请
    BARRIER FILM FOR ELECTRONIC DEVICES AND SUBSTRATES 审中-公开
    用于电子设备和基板的遮蔽膜

    公开(公告)号:US20140087497A1

    公开(公告)日:2014-03-27

    申请号:US14018449

    申请日:2013-09-05

    CPC classification number: H01L51/56 H01L51/0097 H01L51/5253

    Abstract: Methods for forming a coating over a surface are disclosed. A method includes directing a first source of barrier film material toward a substrate in a first direction at an angle θ relative to the substrate, wherein θ is greater than about 0° and less than about 85°. Additionally, a method of depositing a barrier film over a substrate includes directing a plurality of N sources of barrier film material toward a substrate, each source being directed at an angle θN relative to the substrate, wherein for each θN, θ is greater than about 0° and less than about 180°. For at least a first of the θN, θN is greater than about 0° and less than about 85°, and for at least a second of the θN, θN is greater than about 95° and less than about 180°.

    Abstract translation: 公开了在表面上形成涂层的方法。 一种方法包括以第一方向以角度将第一阻挡膜材料源朝向衬底引导; 相对于基底,其中& 大于约0°且小于约85°。 另外,在衬底上沉积阻挡膜的方法包括将多个N源的阻挡膜材料引导向衬底,每个源相对于衬底以一定角度N指向;其中对于每个衬底,N, ; 大于约0°且小于约180°。 对于至少第一个“N”和“N”,N大于约0°且小于约85°,并且对于至少一秒的“N”和“N”,N大于约95°或更小 比约180°。

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