IGBT DEVICE WITH MOS CONTROLLABLE HOLE PATH
    11.
    发明申请

    公开(公告)号:US20200235231A1

    公开(公告)日:2020-07-23

    申请号:US16601609

    申请日:2019-10-15

    Abstract: The present invention relates to the technical field of power semiconductor devices, particularly to an insulated gate bipolar transistor with a MOS controllable hole path. According to the present invention, a MOS controllable gate structure formed by a gate dielectric layer, a MOS control gate electrode and a P-type MOS channel region are embedded in a P+ floating p-body region of the conventional IGBT structure. The MOS region is equivalent to a switch controlled by a gate voltage. When the device is turned on under a forward voltage, the potential of the p-body region is floated to store holes, reducing the saturation conduction voltage drop of the device. Under the condition of turn-off and short-circuit, the hole extracting path is provided and the Miller capacitance is lowered, thereby lowering the turn-off losses and enhancing the short-circuit withstand capability.

    Antenna for generating arbitrarily directed Bessel beam

    公开(公告)号:US20190036214A1

    公开(公告)日:2019-01-31

    申请号:US15959305

    申请日:2018-04-23

    Abstract: An antenna for generating an arbitrarily directed Bessel beam, including a beam-forming plane and a feeding horn, the beam-forming plane is a dual-layer dielectric substrate structure having a beam focusing function, including: a printed circuit bottom layer, a high-frequency dielectric substrate lower layer, a printed circuit middle layer, a high-frequency dielectric substrate upper layer, and, a printed circuit upper layer; the printed circuit bottom layer, the high-frequency dielectric substrate lower layer, the printed circuit middle layer, the high-frequency dielectric substrate upper layer, and the printed circuit upper layer are co-axially stacked from the bottom to the top: the beam-forming plane is entirely divided into periodically arranged beam-forming units by a plurality of meshes, and each beam-forming unit consists of printed circuit upper, middle and lower metal patches of which centers are on the same longitudinal axis, the high-frequency dielectric substrate lower layer and the high-frequency dielectric substrate upper layer.

    ULTRA LOW-POWER PIPELINED PROCESSOR
    16.
    发明申请
    ULTRA LOW-POWER PIPELINED PROCESSOR 有权
    超低功率流水线加工机

    公开(公告)号:US20140304572A1

    公开(公告)日:2014-10-09

    申请号:US13929758

    申请日:2013-06-27

    Abstract: A pipelined processor including a combinational logic of several stages, a voltage regulator, a counter, a comparator, and a plurality of stage registers. Each stage register is disposed between two adjacent stages of the combinational logic. The stage register includes a flip-flop, a latch, an XOR gate, and a MUX module. When the high level of a register clock is coming, the flip-flop latches first data at the rising edge, and the latch receives second data during the high level. The data latched by the flip-flop and the latch respectively are compared by the XOR gate. If they are same, the output Error of the XOR gate is low level, and the output of the flip-flop is delivered to the next stage. Otherwise, the output Error of the XOR gate is high level, and the output of the latch is delivered to the next stage.

    Abstract translation: 一种流水线处理器,包括几级的组合逻辑,电压调节器,计数器,比较器和多个级寄存器。 每个级寄存器被布置在组合逻辑的两个相邻级之间。 级寄存器包括触发器,锁存器,异或门和MUX模块。 当寄存器时钟的高电平到来时,触发器在上升沿锁存第一数据,并且锁存器在高电平期间接收第二数据。 由触发器和锁存器锁存的数据分别由XOR门进行比较。 如果它们相同,则XOR门的输出误差为低电平,触发器的输出被传送到下一级。 否则,异或门的输出误差为高电平,并将锁存器的输出传送到下一级。

    POWER SEMICONDUCTOR DEVICE
    18.
    发明申请

    公开(公告)号:US20220367712A1

    公开(公告)日:2022-11-17

    申请号:US17367442

    申请日:2021-07-05

    Abstract: A power semiconductor device includes a P-type substrate, an N-type well region, a P-type body region, a gate oxide layer, a polysilicon gate, a first oxide layer, a first N+ contact region, a first P+ contact region, drain metal, a first-type doped region, and a gate oxide layer. An end of the P-type body region is flush with or exceeds an end of the polysilicon gate, wherein Cgd of the power semiconductor device is reduced and a switching frequency of the power semiconductor device is increased. A polysilicon field plate connected with a source is introduced over a drift region that is not only shield an influence of the polysilicon gate on the drift region, thereby eliminating Cgd caused by overlapping of traditional polysilicon gate and drift region, but also enable the power semiconductor device to have strong robustness against an hot carrier effect.

    LATERAL POWER SEMICONDUCTOR DEVICE
    19.
    发明申请

    公开(公告)号:US20220352304A1

    公开(公告)日:2022-11-03

    申请号:US17351267

    申请日:2021-06-18

    Abstract: A lateral power semiconductor device includes a first type doping substrate at a bottom of the lateral power semiconductor device, a second type doping drift region, a second type heavy doping drain, a first type doping body; a first type heavy doping body contact and a second type heavy doping source, where dielectric layers are on a right side of the second type heavy doping source; the dielectric layers are arranged at intervals in a longitudinal direction in the first type doping body, and between adjacent dielectric layers in the longitudinal direction is the first type doping body; and a polysilicon is surrounded by the dielectric layer at least on a right side. Compared with conventional trench devices, the lateral power semiconductor device introduces a lateral channel, to increase a current density, thereby realizing a smaller channel on-resistance.

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