公开(公告)号：US10297607B2

公开(公告)日：2019-05-21

申请号：US13615723

申请日：2012-09-14

申请人： Takao Akaogi ,  Yider Wu ,  Yi-Hsiu Chen

发明人： Takao Akaogi ,  Yider Wu ,  Yi-Hsiu Chen

IPC分类号： H01L27/11565 ,  H01L21/762 ,  H01L27/11568 ,  H01L21/8234

摘要： A non-volatile memory having discrete isolation structures and SONOS (Silicon Oxide Nitride Oxide Silicon) memory cells, a method of operating the same, and a method of manufacturing the same are introduced. Every isolation structure on a semiconductor substrate having an array region has a plurality of gaps so as to form discrete isolation structures and thereby implant source lines in the gaps of the semiconductor substrate. Since the source lines are not severed by the isolation structures, the required quantity of barrier pins not connected to the source line is greatly reduced, thereby reducing the space required for the barrier pins in the non-volatile memory.

公开(公告)号：US08012825B2

公开(公告)日：2011-09-06

申请号：US12350298

申请日：2009-01-08

申请人： Yider Wu ,  Yung-Chung Lee ,  Yi-Hsiu Chen

发明人： Yider Wu ,  Yung-Chung Lee ,  Yi-Hsiu Chen

IPC分类号： H01L21/336

CPC分类号： H01L27/11521 ,  H01L29/42324 ,  H01L29/66825 ,  H01L29/7881

摘要： In a method of manufacturing a double-implant NOR flash memory structure, a phosphorus ion implantation process is performed, so that a P-doped drain region is formed in a semiconductor substrate between two gate structures to overlap with a highly-doped drain (HDD) region and a lightly-doped drain (LDD) region. Therefore, the electric connection at a junction between the HDD region and the LDD region is enhanced and the carrier mobility in the memory is not lowered while the problems of short channel effect and punch-through of LDD region are solved.

摘要翻译： 在制造双注入NOR NOR闪存结构的方法中，执行磷离子注入工艺，使得在两个栅极结构之间的半导体衬底中形成P掺杂漏极区，以与高掺杂漏极（HDD ）区域和轻掺杂漏极（LDD）区域。 因此，解决了HDD区域和LDD区域之间的连接处的电连接，并且解决了存储器中的载流子迁移率，同时解决了LDD区域的短沟道效应和穿通问题。

公开(公告)号：US20100227447A1

公开(公告)日：2010-09-09

申请号：US12399124

申请日：2009-03-06

申请人： Hung-Wei Chen ,  Yider Wu

发明人： Hung-Wei Chen ,  Yider Wu

IPC分类号： H01L21/8234

CPC分类号： H01L27/11519 ,  H01L29/40114

摘要： A flash memory device manufacturing process includes the steps of providing a semiconductor substrate; forming two gate structures on the substrate; performing an ion implantation process to form two first source regions in the substrate at two lateral outer sides of the two gate structures; performing a further ion implantation process to form a first drain region in the substrate between the two gate structures; performing a pocket implantation process between the gate structures to form two doped regions in the substrate at two opposite sides of the first drain region; forming two facing L-shaped spacer walls between the two gate structures above the first drain region; performing an ion implantation process to form a second drain region beneath the first drain region, both of which having a steep junction profile compared to the first source regions; and forming a barrier plug above the first drain region.

摘要翻译： 闪存器件制造方法包括以下步骤：提供半导体衬底; 在基板上形成两个栅极结构; 执行离子注入工艺以在两个栅极结构的两个侧向外侧处在衬底中形成两个第一源极区域; 执行另外的离子注入工艺以在所述两个栅极结构之间的所述衬底中形成第一漏极区; 在所述栅极结构之间执行凹穴注入工艺，以在所述衬底中在所述第一漏极区的两个相对侧形成两个掺杂区域; 在所述第一漏极区域之上的所述两个栅极结构之间形成两个面对的L形间隔壁; 执行离子注入工艺以在所述第一漏极区域下方形成第二漏极区域，所述第二漏极区域与所述第一源极区域相比具有陡峭的接合轮廓; 以及在所述第一漏极区域上方形成阻挡塞。

公开(公告)号：US20100197108A1

公开(公告)日：2010-08-05

申请号：US12761460

申请日：2010-04-16

申请人： Yider Wu

发明人： Yider Wu

IPC分类号： H01L21/28 ,  H01L21/762

CPC分类号： H01L29/78 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11524

摘要： A non-volatile semiconductor manufacturing method comprises the steps of making element isolation/insulation films that partitions element-forming regions in a semiconductor substrate; stacking a floating gate on the semiconductor substrate via a first gate insulating film; stacking a second gate insulating film formed on the floating gate, and stacking a control gate formed on the floating gate via the second gate insulating film, and self-aligning source and drain diffusion area with the control gate. In the process of stacking a floating gate by partially etching a field oxide film in a select gate area, followed by floating gate formed in a element-forming region and select gate region, and followed by a chemical mechanical polish(CMP) process, both floating gate and select gate is hereby formed simultaneously. Thereby, when memory cells are miniaturized, the invention allows the process to be simple and reduce the defect density.

摘要翻译： 非易失性半导体制造方法包括以下步骤：制造在半导体衬底中分隔元件形成区域的元件隔离/绝缘膜; 通过第一栅极绝缘膜在半导体衬底上堆叠浮置栅极; 堆叠形成在浮置栅极上的第二栅极绝缘膜，并且通过第二栅极绝缘膜堆叠形成在浮置栅极上的控制栅极以及与控制栅极的自对准源极和漏极扩散区域。 在通过在选择栅极区域中局部蚀刻场氧化物膜的同时堆叠浮栅的过程中，随后是形成在元件形成区域中的浮栅并选择栅极区域，然后进行化学机械抛光（CMP）工艺， 浮动门和选择门同时形成。 因此，当存储单元小型化时，本发明允许该过程简单并减少缺陷密度。

公开(公告)号：US20070026675A1

公开(公告)日：2007-02-01

申请号：US11193409

申请日：2005-08-01

申请人： Unsoon Kim ,  Angela Hui ,  Yider Wu ,  Kuo-Tung Chang ,  Hiroyuki Kinoshita

发明人： Unsoon Kim ,  Angela Hui ,  Yider Wu ,  Kuo-Tung Chang ,  Hiroyuki Kinoshita

IPC分类号： H01L21/302

CPC分类号： H01L27/11526 ,  H01L27/105 ,  H01L27/11521 ,  H01L27/11531

摘要： A method for forming a memory device is provided. A nitride layer is formed over a substrate. The nitride layer and the substrate are etched to form a trench. The nitride layer is trimmed on opposite sides of the trench to widen the trench within the nitride layer. The trench is filled with an oxide material. The nitride layer is stripped from the memory device, forming a mesa above the trench.

摘要翻译： 提供了一种用于形成存储器件的方法。 在衬底上形成氮化物层。 蚀刻氮化物层和衬底以形成沟槽。 在沟槽的相对侧上修整氮化物层，以加宽氮化物层内的沟槽。 沟槽填充有氧化物材料。 从存储器件剥离氮化物层，在沟槽上方形成台面。

公开(公告)号：US06509232B1

公开(公告)日：2003-01-21

申请号：US09969573

申请日：2001-10-01

申请人： Unsoon Kim ,  Mark S. Chang ,  Yider Wu ,  Chi Chang ,  Angela Hui ,  Yu Sun

发明人： Unsoon Kim ,  Mark S. Chang ,  Yider Wu ,  Chi Chang ,  Angela Hui ,  Yu Sun

IPC分类号： H01L21336

CPC分类号： H01L27/11526 ,  H01L27/105 ,  H01L27/11536

摘要： STI (shallow trench isolation) structures are formed for a flash memory device fabricated within an semiconductor substrate comprised of a core area having an array of core flash memory cells fabricated therein and comprised of a periphery area having logic circuitry fabricated therein. A first set of STI (shallow trench isolation) openings within the core area are etched through the semiconductor substrate, and a second set of STI (shallow trench isolation) openings within the periphery area are etched through the semiconductor substrate. A core active device area of the semiconductor substrate within the core area is surrounded by the first set of STI openings, and a periphery active device area of the semiconductor substrate within the periphery area is surrounded by the second set of STI openings. Dielectric liners are formed at sidewalls of the first and second sets of STI openings with reaction of the semiconductor substrate at the sidewalls of the STI openings such that top corners of the semiconductor substrate of the core and periphery active device areas adjacent the STI openings are rounded. A trench dielectric material is deposited to fill the STI openings. In addition, the top corners of the periphery active device area are exposed by etching portions of the sidewalls of the second set of STI structures in a dip-off etch. The exposed top corners of the periphery active device area are further rounded after additional thermal oxidation of the exposed top corners of the periphery active device area. The rounded corners of the core and periphery active device areas result in minimized leakage current through a flash memory cell fabricated within the core active device area and through a MOSFET fabricated within the periphery active device area.

摘要翻译： 形成STI（浅沟槽隔离）结构，用于制造在半导体衬底内的闪存器件，该半导体衬底由具有在其中制造的核心闪存单元阵列的核心区域组成，并由其中制造的逻辑电路的外围区域组成。 核心区域内的第一组STI（浅沟槽隔离）开口被蚀刻穿过半导体衬底，并且外围区域内的第二组STI（浅沟槽隔离）开口被蚀刻穿过半导体衬底。 核心区域内的半导体衬底的核心有源器件区域由第一组STI开口包围，并且周边区域内的半导体衬底的外围有源器件区域被第二组STI开口包围。 电介质衬垫通过半导体衬底在STI开口的侧壁处的反应而形成在第一和第二组STI开口的侧壁处，使得芯部的半导体衬底和邻近STI开口的周边有源器件区域的顶角是圆形的 。 沉积沟槽电介质材料以填充STI开口。 此外，通过在浸渍蚀刻中蚀刻第二组STI结构的侧壁的部分来暴露外围有源器件区域的顶角。 外围有源器件区域的暴露的顶角在外围有源器件区域的暴露顶角的额外的热氧化之后被进一步倒圆。 核心和外围有源器件区域的圆角导致通过在核心有源器件区域内制造的闪存单元和通过在外围有源器件区域内制造的MOSFET的最小化的漏电流。

公开(公告)号：US06468865B1

公开(公告)日：2002-10-22

申请号：US09723653

申请日：2000-11-28

申请人： Jean Y. Yang ,  Mark T. Ramsbey ,  Hidehiko Shiraiwa ,  Michael A. Van Buskirk ,  David M. Rogers ,  Ravi Sunkavalli ,  Janet Wang ,  Narbeh Derhacobian ,  Yider Wu

发明人： Jean Y. Yang ,  Mark T. Ramsbey ,  Hidehiko Shiraiwa ,  Michael A. Van Buskirk ,  David M. Rogers ,  Ravi Sunkavalli ,  Janet Wang ,  Narbeh Derhacobian ,  Yider Wu

IPC分类号： H01L21336

CPC分类号： H01L27/11568 ,  H01L27/115

摘要： One aspect of the present invention relates to a method of forming a non-volatile semiconductor memory device, involving the sequential or non-sequential steps of forming a charge trapping dielectric over a substrate, the substrate having a core region and a periphery region; removing at least a portion of the charge trapping dielectric in the periphery region; forming a gate dielectric in the periphery region; forming buried bitlines in the core region; removing at least a portion of the charge trapping dielectric positioned over the buried bitlines in the core region; forming a bitline isolation over the buried bitlines in the core region; and forming gates in the core region and the periphery region. Another aspect of the present invention relates to increasing the thickness of the gate dielectric in at least a portion of the periphery region simultaneously while forming the bitline isolation.

摘要翻译： 本发明的一个方面涉及一种形成非挥发性半导体存储器件的方法，涉及在衬底上形成电荷俘获电介质的顺序或非顺序步骤，所述衬底具有芯区域和外围区域; 去除外围区域中的电荷捕获电介质的至少一部分; 在周边区域形成栅电介质; 在核心区域形成掩埋位线; 去除位于芯区域中的掩埋位线之上的电荷捕获电介质的至少一部分; 在核心区域的掩埋位线上形成位线隔离; 并且在芯区域和周边区域中形成栅极。 本发明的另一方面涉及在形成位线隔离的同时在周边区域的至少一部分中增加栅极电介质的厚度。

公开(公告)号：US06445030B1

公开(公告)日：2002-09-03

申请号：US09772600

申请日：2001-01-30

申请人： Yider Wu ,  Jean Y. Yang ,  Hidehiko Shiraiwa ,  Che-Hoo Ng

发明人： Yider Wu ,  Jean Y. Yang ,  Hidehiko Shiraiwa ,  Che-Hoo Ng

IPC分类号： H01L2972

CPC分类号： H01L21/28211 ,  H01L21/28282 ,  H01L29/511 ,  H01L29/792

摘要： One aspect of the present invention relates to a non-volatile semiconductor memory device, containing a silicon substrate; a tunnel oxide layer over the silicon substrate, the tunnel oxide layer comprising fluorine atoms; a charge trapping layer over the tunnel oxide layer; an electrode or poly layer over the charge trapping layer; and source and drain regions within the silicon substrate. Another aspect of the present invention relates to a method of making a non-volatile semiconductor memory cell having improved erase speed, involving the steps of providing a silicon substrate; forming a tunnel oxide layer comprising fluorine atoms over the silicon substrate; and forming non-volatile memory cells over the tunnel oxide layer.

摘要翻译： 本发明的一个方面涉及一种包含硅衬底的非易失性半导体存储器件; 硅衬底上的隧道氧化物层，所述隧道氧化物层包含氟原子; 在隧道氧化物层上方的电荷捕获层; 在电荷捕获层上方的电极或多晶硅层; 以及硅衬底内的源区和漏区。 本发明的另一方面涉及一种制造具有改善的擦除速度的非易失性半导体存储单元的方法，包括提供硅衬底的步骤; 在所述硅衬底上形成包含氟原子的隧道氧化物层; 以及在所述隧道氧化物层上形成非易失性存储单元。

公开(公告)号：US06417082B1

公开(公告)日：2002-07-09

申请号：US09651684

申请日：2000-08-30

申请人： Yider Wu ,  Jean Yang ,  Hidehiko Shiraiwa ,  Mark E. Ramsbey

发明人： Yider Wu ,  Jean Yang ,  Hidehiko Shiraiwa ,  Mark E. Ramsbey

IPC分类号： H01L21425

CPC分类号： H01L21/28185 ,  H01L21/26506 ,  H01L21/26586

摘要： A process for making a semiconductor structure comprises implanting nitrogen through a layer comprising SiO2 into a substrate comprising Si, wherein the layer is on the substrate, and wherein the layer is from about 30 Å to about 300 Å thick.

摘要翻译： 制造半导体结构的方法包括将氮通过包含SiO 2的层注入到包含Si的衬底中，其中该层在衬底上，并且其中该层为约30埃至约300埃。

公开(公告)号：US06403420B1

公开(公告)日：2002-06-11

申请号：US09627664

申请日：2000-07-28

申请人： Jean Yang ,  Yider Wu ,  Mark Ramsbey ,  Yu Sun

发明人： Jean Yang ,  Yider Wu ,  Mark Ramsbey ,  Yu Sun

IPC分类号： H01L21336

CPC分类号： H01L27/11568 ,  H01L21/26506 ,  H01L21/28282 ,  H01L21/76202 ,  H01L27/115 ,  H01L29/66833

摘要： A gate structure for an ONO flash memory device includes a first layer of silicon oxide on top of a semiconductor substrate, a second layer of silicon oxide, a layer of silicon nitride sandwiched between the two silicon oxide layers, and a control gate on top of the second layer of silicon oxide. Nitrogen is implanted after the ONO layer and junction areas have been formed. The entire semiconductor structure is heated to anneal out the nitrogen implant damage and to diffuse or drive the implanted nitrogen into the substrate and silicon oxide interface to form strong SiN bonds at that interface. By implanting nitrogen into the ONO stack, instead of a single silicon oxide layer as done conventionally, damage to the underlying silicon substrate is reduced. This results in better isolation between adjacent bit lines and suppresses leakages between adjacent bit lines.

摘要翻译： 用于ONO闪速存储器件的栅极结构包括在半导体衬底的顶部上的第一氧化硅层，第二层氧化硅，夹在两个氧化硅层之间的氮化硅层和位于两个氧化硅层之上的控制栅极 第二层氧化硅。 在ONO层和接合区域已经形成之后注入氮。 整个半导体结构被加热以退出氮注入损伤，并将注入的氮扩散或驱动到衬底和氧化硅界面中，以在该界面处形成强的SiN键。 通过将氮气注入到ONO堆叠中，代替如常规制造的单个氧化硅层，降低了底层硅衬底的损坏。 这导致相邻位线之间更好的隔离并且抑制相邻位线之间的泄漏。