APPLICATION OF ADHESIVES
    14.
    发明申请

    公开(公告)号:US20180273804A1

    公开(公告)日:2018-09-27

    申请号:US15524447

    申请日:2015-11-20

    Applicant: Zephyros, Inc.

    Abstract: Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

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