公开(公告)号：US09464899B2

公开(公告)日：2016-10-11

申请号：US14497317

申请日：2014-09-25

Applicant: mCube Inc.

Inventor： Wenhua Zhang

IPC: G01C19/5776

CPC classification number: G01C19/5776 ,  B81B2201/0242 ,  H03B2200/0094

Abstract: A gyroscope device and method of operation therefor. The gyroscope device can include a power input, a charge pump portion coupled to the power input, a selection mechanism, a switching mechanism, an oscillator driving mechanism coupled to the switching mechanism, and an oscillator coupled to the charge pump portion and to the oscillator driving mechanism. The method of operation can include providing a first or second selection signal from a selection mechanism associated with the outputting of a DC input power or DC output power from a switching mechanism, respectively. These signals, along with an oscillator driving signal from an oscillator driving mechanism, can be used to initiate and maintain oscillation of an oscillator at a steady-state frequency within a predetermined range of frequencies.

Abstract translation: 陀螺仪装置及其操作方法。 陀螺仪装置可以包括功率输入，耦合到功率输入的电荷泵部分，选择机构，开关机构，耦合到开关机构的振荡器驱动机构，以及耦合到电荷泵部分和振荡器 驱动机制。 操作方法可以包括分别从与切换机构输出DC输入功率或DC输出功率相关的选择机构提供第一或第二选择信号。 这些信号以及来自振荡器驱动机构的振荡器驱动信号可以用于启动并保持在预定频率范围内的稳态频率的振荡器的振荡。

公开(公告)号：US09174838B2

公开(公告)日：2015-11-03

申请号：US14102465

申请日：2013-12-10

Applicant: mCube Inc.

Inventor： Wenhua Zhang ,  Shingo Yoneoka

IPC: H01L21/00 ,  B81C1/00 ,  H01L41/113

CPC classification number: B81B7/02 ,  B81B7/0041 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0292 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/0145 ,  B81C2203/0154 ,  H01L21/56 ,  H01L41/1132

Abstract: A method for fabricating a multiple MEMS device. A semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided. The first MEMS can be encapsulated within the first cavity and the second MEMS device can be encapsulated within the second cavity. These devices can be encapsulated within a provided first encapsulation environment at a first air pressure, encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity can then be subjected to a provided second encapsulating environment at a second air pressure via the channel of the second cavity.

Abstract translation: 一种用于制造多个MEMS器件的方法。 可以提供具有第一和第二MEMS器件的半导体衬底以及包括至少一个通道的具有第一腔和第二腔的封装晶片。 第一MEMS可以封装在第一腔内，并且第二MEMS器件可被封装在第二腔内。 这些装置可以以第一空气压力封装在所提供的第一封装环境内，在第一空气压力下将第一MEMS装置封装在第一空腔内。 然后可以在第二空腔内的第二MEMS装置经由第二空腔的通道在第二空气压力下经受所提供的第二封装环境。

公开(公告)号：US20140361348A1

公开(公告)日：2014-12-11

申请号：US14297337

申请日：2014-06-05

Applicant: MCube Inc.

Inventor： SHINGO YONEOKA ,  Sudheer Sridharamurthy ,  Wenhua Zhang ,  Te-Hsi Terrence Yoneoka

IPC: G01P15/13 ,  G01P15/08

CPC classification number: G01P15/131 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5762 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/084 ,  G01P2015/0865

Abstract: An integrated MEMS inertial sensor device. The device includes a MEMS inertial sensor overlying a CMOS substrate. The MEMS inertial sensor includes a drive frame coupled to the surface region via at least one drive spring, a sense mass coupled to the drive frame via at least a sense spring, and a sense electrode disposed underlying the sense mass. The device also includes at least one pair of quadrature cancellation electrodes disposed within a vicinity of the sense electrode, wherein each pair includes an N-electrode and a P-electrode.

Abstract translation: 集成的MEMS惯性传感器装置。 该器件包括覆盖CMOS衬底的MEMS惯性传感器。 MEMS惯性传感器包括经由至少一个驱动弹簧耦合到表面区域的驱动框架，经由至少一个感测弹簧耦合到驱动框架的感测质量块和设置在感测质量块下方的感测电极。 该装置还包括设置在感测电极附近的至少一对正交消除电极，其中每对包括N电极和P电极。