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    PROTEIN-PEG INTERACTIONS THAT REDIRECT THE THERMAL UNFOLDING PATHWAY OF PEGYLATED HUMAN GALECTIN-3C
    14.
    发明公开
    PROTEIN-PEG INTERACTIONS THAT REDIRECT THE THERMAL UNFOLDING PATHWAY OF PEGYLATED HUMAN GALECTIN-3C 审中-公开

    公开(公告)号：US20240100174A1

    公开(公告)日：2024-03-28

    申请号：US18236078

    申请日：2023-08-21

    申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED

    发明人： Matthew Eddy ,  Michael Harris ,  Amanda Pritzlaff

    IPC分类号： A61K47/60 ,  C07K14/705

    CPC分类号： A61K47/60 ,  C07K14/7056

    摘要： Conjugation of polymers to proteins, including biomedically-relevant PEGylation, is a promising approach to address a central challenge of biologics and biotech: the lack of protein stability in demanding non-native environments. Application of conjugation is hindered by the lack of atomic level understanding of protein-polymerinteractions, preventing design of conjugates with predicted properties. An integrative structural and biophysical approach was used to address this challenge using a polymer-modified carbohydrate recognition domain of human galectin-3 (Gal3C), a lectin essential for cellular adhesion and potential biologic. Modification with PEG and other polymers dramatically increased Gal3C thermal stability and redirected its unfolding pathway through forming a stable intermediate. Distinct polymer properties which increased protein thermal stability were revealed. Structural details of Gal3C-polymer conjugates revealed by NMR pointed to the important role of polymer localization. Residues local to the site of conjugation were perturbed by polymer conjugation and these perturbations remained localized over a wide temperature range. For PEGylated conjugates, replacing key lysine residues within the PEG-perturbed region altered the protein-PEG interface and thermal unfolding behavior, providing mechanistic insight into rational design of conjugates that will expand the benefits of polymer conjugation.

    PRINTED CIRCUIT BOARD OBFUSCATION SYSTEMS AND METHODS
    15.
    发明公开
    PRINTED CIRCUIT BOARD OBFUSCATION SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20240090136A1

    公开(公告)日：2024-03-14

    申请号：US18463988

    申请日：2023-09-08

    申请人： UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED

    发明人： Navid ASADI-ZANJANI ,  John TRUE ,  Chengjie XI ,  Aslam KHAN

    IPC分类号： H05K3/00

    CPC分类号： H05K3/0005

    摘要： Various embodiments of the present disclosure provide a framework for obfuscation of a printed circuit board (PCB). In one example, an embodiment provides for generating a plurality of connections interconnecting a plurality of components of the PCB using additive manufacturing, permuting, using a micro electro-mechanical systems (MEMS) device, a first set of connections interconnecting a first component with a second component in the PCB, integrating the MEMS device into the PCB such that the MEMS device covers a second set of connections from an x-ray probe, probing the PCB using x-ray simulation, and iteratively adjusting the permutation of the first set of connections and the integration of the MEMS device using a result of the x-ray simulation to reduce the detectability of the first and second connections based on the result of the x-ray simulation.

    Set of modeling blocks
    17.
    外观设计
    Set of modeling blocks 有权

    公开(公告)号：USD1013059S1

    公开(公告)日：2024-01-30

    申请号：US29813080

    申请日：2021-10-26

    申请人： University Of Florida Research Foundation, Incorporated

    设计人： Chenjie Zeng

    摘要： FIG. 1 is a front orthogonal view of a set of modeling blocks showing the new design in a first configuration;
    FIG. 2 is a front view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 3 is a rear view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 4 is a right side view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 5 is a left side view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 6 is a top view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 7 is a bottom view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 8 is another orthogonal view of the invention illustrated in FIG. 1 in the first configuration;
    FIG. 9 is an orthogonal view of the set of modeling blocks illustrated in FIG. 1 in a second configuration;
    FIG. 10 is a front view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 11 is a rear view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 12 is a right side view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 13 is a left side view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 14 is a top view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 15 is a bottom view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 16 is another orthogonal view of the invention illustrated in FIG. 1 in the second configuration;
    FIG. 17 is an orthogonal view of the set of modeling blocks illustrated in FIG. 1 in a third configuration;
    FIG. 18 is a front view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 19 is a rear view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 20 is a right side view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 21 is a left side view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 22 is a top view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 23 is a bottom view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 24 is another orthogonal view of the invention illustrated in FIG. 1 in the third configuration;
    FIG. 25 is an orthogonal view of the set of modeling blocks illustrated in FIG. 1 in a fourth configuration;
    FIG. 26 is a front view of the invention illustrated in FIG. 1 in the fourth configuration;
    FIG. 27 is a rear view of the invention illustrated in FIG. 1 in the fourth configuration;
    FIG. 28 is a right side view of the invention illustrated in FIG. 1 in the fourth configuration;
    FIG. 29 is a left side view of the invention illustrated in FIG. 1 in the fourth configuration;
    FIG. 30 is a top view of the invention illustrated in FIG. 1 in the fourth configuration;
    FIG. 31 is a bottom view of the invention illustrated in FIG. 1 in the fourth configuration; and,
    FIG. 32 is another orthogonal view of the invention illustrated in FIG. 1 in the fourth configuration.
    The broken lines in the drawings depict environment, or portions, of the set of modeling blocks that form no part of the claimed design. The appearance of any portion of the article between the break lines forms no part of the claimed design. The surface shading in FIGS. 1-32 indicates a surface having a different color and/or texture from an unshaded surface.