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公开(公告)号:US11714132B2
公开(公告)日:2023-08-01
申请号:US17219297
申请日:2021-03-31
发明人: Mei-Mei Su , Seth Craighead
IPC分类号: G01R31/319 , G01R31/28
CPC分类号: G01R31/31908 , G01R31/2875 , G01R31/31905
摘要: Presented embodiments facilitate efficient and effective diagnostic of test system operations, including temperature control of test equipment components. In one embodiment a test equipment diagnostic method includes applying a known/expected first bit pattern to a test equipment component, applying a known/expected second bit pattern to a test equipment component, and performing a test equipment temperature control analysis based upon the results of applying the known/expected first bit pattern and known/expected second bit pattern. The first bit pattern and second bit pattern have known/expected respective thermal loads and corresponding respective first known/expected/expected temperature and second known/expected/expected temperature. In one embodiment, performing a test equipment temperature control analysis includes determining if temperature control components control a temperature of the test equipment component within acceptable tolerances. In one exemplary implementation, the test equipment component is a test control component (e.g., a field programmable gate array (FPGA), etc.).
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公开(公告)号:US11703244B2
公开(公告)日:2023-07-18
申请号:US17117139
申请日:2020-12-10
发明人: Chih-Chieh Liao , Yu-Min Sun , Chih-Feng Cheng
CPC分类号: F24F11/48 , G01R31/2875
摘要: A testing apparatus including a base and a preheating unit arranged on the base is provided. The preheating unit includes a gas generator, a blocking mechanism and a heating device. The gas generator is configured to discharge air toward the base to form an air wall. The blocking mechanism is located above the air wall and forms a heat preservation space with the air wall. The heating device is arranged in the heat preservation space.
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公开(公告)号:US20190235005A1
公开(公告)日:2019-08-01
申请号:US16330097
申请日:2017-06-16
发明人: Cheng-Hang Ho
CPC分类号: G01R31/003 , G01R31/2875
摘要: Disclosed are a high-temperature testing device, including a trolley, a furnace and a door body. The trolley includes a base and a display panel placing area defined at the base. The base includes a support table and a protruding block formed on an upper surface of and perpendicular to the support table; the display panel placing area is defined on the protruding block. A power supplier and a signal generator are both defined on the support table. A cavity is formed in the furnace body to match and receive the trolley. A first heat insulating plate and a second heat insulating plate are respectively defined on opposite inner walls at two sides of the furnace body. A gap is defined between opposite end portions of the first heat insulating plate and the second heat insulating plate, for the protruding block to pass through.
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公开(公告)号:US20180335450A1
公开(公告)日:2018-11-22
申请号:US15971235
申请日:2018-05-04
申请人: Hermes-Epitek Corp.
发明人: WEN-YUAN HSU , SHIH-YING CHOU
CPC分类号: G01R1/44 , G01R1/04 , G01R31/2601 , G01R31/2865 , G01R31/2874 , G01R31/2875 , G01R31/2877
摘要: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.
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公开(公告)号:US20180321279A1
公开(公告)日:2018-11-08
申请号:US15971321
申请日:2018-05-04
申请人: Hermes-Epitek Corp.
发明人: WEN-YUAN HSU
CPC分类号: G01R1/44 , G01R1/07307 , G01R31/2601 , G01R31/2865 , G01R31/2875 , G01R31/2877 , G01R31/2891 , G01R31/2893 , H01L21/67109
摘要: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.
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公开(公告)号:US20180299505A1
公开(公告)日:2018-10-18
申请号:US15486287
申请日:2017-04-12
发明人: AN-SUNG WANG , CHING-CHANG WONG , YANG-HAN LEE
CPC分类号: G01R31/2893 , B65G47/914 , G01R31/2875
摘要: A length adjustable arm and MEMS position detection equipment rotation test apparatus includes an extendible section and first and second rotary bodies provided at one end of a rotation device for variation of a feeding position of a first feeding component so that feeding component is capable of conducting various feeding ways. Further, a worktable is provided thereon with at least one rotation section, which has a surface on which a plurality of operation stations is mounted. As such, through circular change made by the rotation section in respect of the locations of the operation stations, an effect of effectively and efficiently burning or testing can be achieved. Further, the operation stations are provided, on a periphery thereof, with a turning section, and the turning section is operable to turn each of the operation stations in order to effectively conduct tests for various MEMS inertial components.
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17.
公开(公告)号:US10006959B2
公开(公告)日:2018-06-26
申请号:US14484546
申请日:2014-09-12
申请人: Darryl G. Walker
发明人: Darryl G. Walker
IPC分类号: G01R31/26 , G01R31/02 , G11C7/04 , G11C29/02 , G11C29/50 , G01R31/28 , G11C29/00 , G11C11/406
CPC分类号: G01R31/2628 , G01R31/025 , G01R31/2856 , G01R31/2875 , G11C7/04 , G11C11/40615 , G11C11/40626 , G11C29/006 , G11C29/023 , G11C29/028 , G11C29/50 , G11C29/50016 , G11C2029/5002
摘要: A method of determining temperature ranges and setting performance parameters in a semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. The performance parameters may be set to improve speed parameters and/or decrease current consumption over a wide range of temperature ranges.
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公开(公告)号:US20180136275A1
公开(公告)日:2018-05-17
申请号:US15799431
申请日:2017-10-31
发明人: Sakiko SHIMIZU , Akira IKEDA
IPC分类号: G01R31/28
CPC分类号: G01R31/2875 , G01R31/2877 , G01R31/2891
摘要: A temperature-measuring apparatus includes a heat source capable of changing a heat generation temperature, a temperature sensor that detects a temperature of a predetermined position other than a measurement target accommodated in a measurement subject, and a temperature computation portion that computes a temperature of the measurement target on the basis of heat balance characteristics of the temperature of the measurement target, a temperature of the heat source, and the temperature of the predetermined position, the temperature of the heat source, and the detected temperature of the predetermined position.
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公开(公告)号:US09869714B2
公开(公告)日:2018-01-16
申请号:US15185468
申请日:2016-06-17
申请人: INTEL CORPORATION
CPC分类号: G01R31/2874 , G01R1/0458 , G01R1/06722 , G01R1/06783 , G01R1/44 , G01R31/2642 , G01R31/2875 , G01R31/2891 , H05K7/20
摘要: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.
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20.
公开(公告)号:US20170363680A1
公开(公告)日:2017-12-21
申请号:US15628076
申请日:2017-06-20
发明人: Yuki SAITO , Yoshiyuki FUKAMI , Hidehiro KIYOFUJI
CPC分类号: G01R31/2874 , G01R1/07307 , G01R1/07378 , G01R31/2863 , G01R31/2875 , G01R31/2891
摘要: A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.
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