公开(公告)号：US11703319B2

公开(公告)日：2023-07-18

申请号：US16651919

申请日：2018-11-22

Applicant: TDK Electronics AG

Inventor： Ramón García Rojo ,  Fernando Ferrer ,  Gustavo Sänchez

IPC: G01N21/59 ,  G01B11/06 ,  G01N21/84 ,  G01N21/86 ,  H01G4/00

CPC classification number: G01B11/0625 ,  G01B11/0691 ,  G01N21/59 ,  G01N21/8422 ,  G01N21/86 ,  H01G4/00 ,  G01N2021/8427 ,  G01N2021/8438

Abstract: A method for determining properties of a coating on a transparent film, a method for manufacturing a capacitor film and a device configured to determine properties of a coating on a transparent film are disclosed. In an embodiment a method includes moving the transparent film with the coating on a path which passes between a light source and a sensor, illuminating, by the light source, the coating on the transparent film, detecting, by the sensor, an intensity of transmitted light from the light source and calculating, by a processor, the properties of the coating on the transparent film based on the detected intensity of transmitted light.

公开(公告)号：US20170310296A1

公开(公告)日：2017-10-26

申请号：US15497167

申请日：2017-04-25

Applicant: Kumu Networks, Inc.

Inventor： Wilhelm Steffen Hahn ,  Alfred Riddle ,  Ernie Landi

IPC: H03H7/32 ,  H03H7/01 ,  H01G11/82 ,  H01G4/38 ,  H01G4/232

CPC classification number: H03H7/32 ,  H01G4/00 ,  H01G4/002 ,  H01G4/005 ,  H01G4/01 ,  H01G4/012 ,  H01G4/018 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/385 ,  H01G9/008 ,  H01G11/82 ,  H03H7/01 ,  H03H7/0115 ,  H03H7/09 ,  H03H7/1708 ,  H03H7/1775 ,  H03H2001/0085

Abstract: A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.

公开(公告)号：US09064638B2

公开(公告)日：2015-06-23

申请号：US13803925

申请日：2013-03-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shoichiro Suzuki ,  Masanori Nakamura ,  Koichi Banno ,  Taisuke Kanzaki ,  Akihiro Shiota ,  Masahiro Otsuka

IPC: C04B35/468 ,  H01G4/06 ,  H01G4/30 ,  C04B35/49 ,  H01B3/12 ,  H01G4/12 ,  H01G4/00 ,  C04B35/626 ,  C01G25/00 ,  C01G29/00

CPC classification number: H01G4/30 ,  C01G25/006 ,  C01G29/006 ,  C04B35/468 ,  C04B35/4682 ,  C04B35/49 ,  C04B35/62685 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3248 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/6562 ,  C04B2235/768 ,  C04B2235/79 ,  H01B3/12 ,  H01G4/00 ,  H01G4/1227

Abstract: A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba1-x-yCaxSry)m(Ti1-zZrz)O3 (1.005≦m≦1.2, 0≦x+y≦0.2, and 0≦z≦0.2) as a major component and an amount of Bi relative to 100 parts by mol of the major component which is 1.0 part by mol or more and 40 parts by mol or less.

Abstract translation: 提供能够进行低温烧制并且具有良好的介电特性的电介质陶瓷，以及使用其的叠层陶瓷电子元件。 含有（Ba1-x-yCaxSry）m（Ti1-zZrz）O3（1.005＆nlE; m＆nlE; 1.2,0＆nlE; x + y＆nlE; 0.2和0＆amp; nlE; z＆nlE; 0.2）的介电陶瓷作为主要成分， 相对于100份（摩尔）为1.0份摩尔以上且40份（摩尔）以下的主成分。

公开(公告)号：US08400754B2

公开(公告)日：2013-03-19

申请号：US12631924

申请日：2009-12-07

Applicant: Makoto Ogawa ,  Seiichi Matsumoto ,  Akihiro Motoki ,  Toshiyuki Iwanaga ,  Tatsuo Kunishi

Inventor： Makoto Ogawa ,  Seiichi Matsumoto ,  Akihiro Motoki ,  Toshiyuki Iwanaga ,  Tatsuo Kunishi

IPC: H01G4/06 ,  H01G4/228

CPC classification number: H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

公开(公告)号：US20110234336A1

公开(公告)日：2011-09-29

申请号：US13049343

申请日：2011-03-16

Applicant: Rafi Hershtig

Inventor： Rafi Hershtig

IPC: H03H7/01 ,  H01G4/002 ,  H01G7/00

CPC classification number: H03H7/46 ,  H01G4/00 ,  H01G4/02 ,  H01G7/00 ,  H03H7/0115 ,  H03H2001/0014 ,  H05K1/181 ,  Y10T29/417 ,  Y10T29/43

Abstract: A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.

Abstract translation: 提出了一种高功率，低无源互调电容器，其使用金属覆层基板形成，其通过薄的气隙广泛耦合。 每个基板可以包括固定在两侧的金属层，其电耦合在一起以形成单个电容器板，或者每个基板可以在邻近气隙的表面上仅具有单个金属层。 该电容器在低成本RF和微波滤波器中具有特殊应用，可用于通信设备和通信测试设备（如双工器），用于低PIM应用。

公开(公告)号：US20100147676A1

公开(公告)日：2010-06-17

申请号：US12524428

申请日：2008-01-25

Applicant: Paul R. Goudy, JR.

Inventor： Paul R. Goudy, JR.

IPC: H05F3/06 ,  C25C3/16

CPC classification number: H01G4/00 ,  B03C3/08 ,  B03C3/38 ,  B03C3/49 ,  H01T23/00

Abstract: A method of using honeycomb material having opposite surfaces and flow channels between the surfaces, includes directing fluid flow through the channels while applying a voltage between the surfaces and across fluid flowing in the channels. A method of using honeycomb material that includes at least one electrode, the honeycomb material and electrode be useful in an electrical or electronic device, includes using the honeycomb material to support or to suspend the electrical or electronic device. An apparatus includes a honeycomb structure of dielectric material having a number of flow channels therethrough, an electrode at a surface of the dielectric material responsive to electrical input to apply an electrical response alone or with regard to another electrode, the honeycomb structure having cohesive strength and rigidity to support itself and the electrode from in suspended relation.

Abstract translation: 使用在表面之间具有相对表面和流动通道的蜂窝材料的方法包括引导流体流过通道，同时在表面之间施加电压并且跨过在通道中流动的流体。 使用包括至少一个电极，蜂窝材料和电极用于电气或电子设备的蜂窝材料的方法包括使用蜂窝体材料来支撑或悬挂电气或电子设备。 一种装置包括具有穿过其中的多个流动通道的电介质材料的蜂窝状结构，电介质材料的表面上的电极响应于电输入以单独地或相对于另一个电极施加电响应，所述蜂窝结构体具有内聚强度， 刚性支撑自身和电极悬浮关系。

公开(公告)号：US3321699A

公开(公告)日：1967-05-23

申请号：US39657164

申请日：1964-09-15

Applicant: LAB VOOR INSTR DALAWELL N V

Inventor： RADEMAKERS PETRUS J

IPC: G01P15/08 ,  H01C10/02 ,  H01G4/00

CPC classification number: H01G4/00 ,  G01P15/08 ,  H01C10/02

公开(公告)号：US3271642A

公开(公告)日：1966-09-06

申请号：US51362965

申请日：1965-11-04

Applicant: DU PONT

Inventor： VINCENT BALDWIN LOUIS

IPC: H01G4/00 ,  H01G4/32

CPC classification number: H01G4/32 ,  H01G4/00

公开(公告)号：US09928964B1

公开(公告)日：2018-03-27

申请号：US14470319

申请日：2014-08-27

Applicant: Kemet Electronics Corporation

Inventor： Yang Jin ,  Qingping Chen

IPC: H01G9/00 ,  C07D409/14 ,  C08G75/06 ,  C25B3/00 ,  C23C28/00 ,  H01G4/00 ,  H01G11/00

CPC classification number: H01G9/0032 ,  C07D409/14 ,  C08G75/06 ,  C23C28/00 ,  C25B3/00 ,  H01G4/00 ,  H01G11/00 ,  H01G2009/0014

Abstract: An improved process for forming a conjugated thiophene precursor is described as in the formation of an improved polymer prepared from the conjugated thiophene and an improved capacitor formed from the improved polymer. The improved process includes forming a thiophene mixture comprising thiophene monomer, unconjugated thiophene oligomer, optionally a solvent and heating the thiophene mixture at a temperature of at least 100° C. to no more than the lower of 250° C. or the boiling point of a component of said thiophene mixture with the lowest boiling point temperature.

公开(公告)号：US20160233025A1

公开(公告)日：2016-08-11

申请号：US15099283

申请日：2016-04-14

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Hidetoshi MASUDA

IPC: H01G4/06 ,  H01G4/005 ,  H01G4/228

CPC classification number: H01G4/06 ,  H01G4/00 ,  H01G4/005 ,  H01G4/10 ,  H01G4/12 ,  H01G4/228

Abstract: A capacitor includes a dielectric layer, a first conductive layer, a second conductive layer, first inner electrodes, second inner electrodes, a first external power electrode layer, a second external power electrode layer, a first outer electrode, and a second outer electrode. The first and second inner electrodes and first and second second outer electrodes are a conductive material. The dielectric layer has through-holes connecting with a first main surface and a second main surface. The first inner electrodes are in a first set of the through-holes and connected to the first conductive layer. The second inner electrodes are in a second set of the through-holes and connected to the second conductive layer. The first outer electrode is on the first external power electrode layer and some side-faces of the dielectric layer. The second outer electrode is on the second external power electrode layer and some side-faces of the dielectric layer.

Abstract translation: 电容器包括电介质层，第一导电层，第二导电层，第一内电极，第二内电极，第一外电源电极层，第二外电源电极层，第一外电极和第二外电极。 第一和第二内部电极以及第一和第二外部电极是导电材料。 电介质层具有与第一主表面和第二主表面连接的通孔。 第一内部电极位于第一组通孔中并连接到第一导电层。 第二内部电极位于第二组通孔中，并连接到第二导电层。 第一外部电极位于第一外部电力电极层和电介质层的一些侧面。 第二外部电极位于第二外部电力电极层和电介质层的一些侧面。