公开(公告)号：US20040244683A1

公开(公告)日：2004-12-09

申请号：US10482618

申请日：2004-07-19

Inventor： Volker Beckord

IPC: B05C013/00 ,  B05C013/02

CPC classification number: B05B13/0292 ,  E05C17/047 ,  E05C21/005

Abstract: A processing means (10; 20; 30) is disclosed, with which to hold part of a vehicle body (1; 6) during a processing operation in vehicle construction, in particular painting. With the objective of disclosing an improved, distinctly more economical and easily manipulated processing means of this kind, it is designed as a plastic holder with two contact or engagement sections (14; 19a; 22; 23; 33; 34; 35) disposed near its ends, which are to be inserted between two body parts (1; 2; 6) in order to fix them at a prespecified distance from one another.

公开(公告)号：US20040115387A1

公开(公告)日：2004-06-17

申请号：US10674946

申请日：2003-09-29

Inventor： Chang Bok Yi

IPC: B05C013/00 ,  B32B003/02

CPC classification number: G11B5/851 ,  C23C14/042 ,  C23C14/50 ,  Y10T428/216 ,  Y10T428/219

Abstract: A system for marking the different sides of a substrate so that the different sides can be identified is disclosed. A substrate holder is used for marking a substrate during the film growth process so that the different sides of the substrate can be distinguished includes a set of fingers having a groove for holding the substrate. The fingers extend over a surface of the substrate for shielding incoming material being deposited onto the surface of the substrate leaving a portion of the surface uncovered. The fingers are positioned asymmetrically. The fingers include a first finger, a second finger, and a third finger, with a distance between said first finger and said second finger is less than the distance between said first finger and said third finger and is less than the distance between said second finger and said third finger.

Abstract translation: 公开了一种用于标记基板的不同侧面以便可以识别不同侧面的系统。 衬底保持器用于在膜生长过程中标记衬底，使得可以区分衬底的不同侧面包括具有用于保持衬底的凹槽的一组手指。 指状物在衬底的表面上延伸，用于屏蔽沉积到衬底的表面上的进入材料，留下表面的一部分未被覆盖。 手指不对称地定位。 手指包括第一手指，第二手指和第三手指，所述第一手指和所述第二手指之间的距离小于所述第一手指和所述第三手指之间的距离，并且小于所述第二手指之间的距离 并说第三根手指。

公开(公告)号：US20040052958A1

公开(公告)日：2004-03-18

申请号：US10416192

申请日：2003-10-21

Inventor： Didier Dauchelle ,  Hugues Baudin ,  Patrice Lucas ,  Laurent Gacher ,  Yves Prigent

IPC: B05D001/18 ,  B05C011/02 ,  B05C013/00

CPC classification number: C23C2/40 ,  C23C2/003

Abstract: The invention relates to a process for the continuous dip-coating of a metal strip (1) in a tank (11) containing a liquid metal bath (12), in which process the metal strip (1) is made to run continuously through a duct (13), the lower part (13a) of which is immersed in the liquid metal bath (12) in order to define with the surface of the said bath a seal (14). A natural flow of the liquid metal from the surface of the liquid seal is set up in an overflow compartment (25) made in the said duct (13) and having an internal wall which extends the duct (13) in its lower part and the level of liquid metal in the said compartment (25) is maintained at a level below the surface of the liquid seal (14). The invention also relates to a plant for implementing the process.

Abstract translation: 本发明涉及一种用于在包含液态金属浴（12）的罐（11）中连续浸涂金属条（1）的方法，其中使金属条（1）连续地通过一 管道（13），其下部（13a）浸没在液体金属浴（12）中，以便与所述槽的表面限定密封件（14）。 来自液体密封件表面的液体金属的自然流动被设置在在所述管道（13）中制成的溢流室（25）中，并且具有在其下部部分延伸管道（13）的内壁， 所述隔室（25）中的液态金属的水平面保持在液体密封（14）的表面以下。 本发明还涉及一种用于实施该方法的设备。

公开(公告)号：US20040007173A1

公开(公告)日：2004-01-15

申请号：US10615800

申请日：2003-07-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shinji Kobayashi ,  Takahiro Kitano ,  Shinichi Sugimoto

IPC: B05C013/00 ,  B05D003/02

CPC classification number: H01L21/67034 ,  B05D3/0254 ,  B05D3/0493

Abstract: In drying a coating liquid such as a resist applied to a substrate under reduced pressure, a coating film in a peripheral portion tends to lose good shape regardless of duration of a drying period, and it is difficult to set an appropriate exhaust flow rate. After the substrate is loaded in an airtight container, a pressure is reduced from atmospheric pressure to a pressure slightly higher than the vapor pressure of a solvent, for example. Then, the solvent actively evaporates from the coating liquid. Here, evacuation is performed initially based on a first flow rate set value Q1, and thereafter, it is performed based on a second flow rate set value larger than Q1. Rounding of the surface in the peripheral portion is corrected by evacuation based on Q1, and more active evaporation of a solvent component is attained by switching to Q2.

Abstract translation: 在减压下涂布抗蚀剂等涂布液的干燥中，不管干燥时间长短如何，周边部分的涂膜容易失去良好的形状，难以设定合适的排气流量。 在将基板装载到气密容器中之后，例如将压力从大气压降至略高于溶剂蒸气压的压力。 然后，溶剂从涂布液中主动蒸发。 这里，首先基于第一流量设定值Q1进行排气，然后基于大于Q1的第二流量设定值进行排气。 通过基于Q1的抽真空来校正周边部分的表面的四舍五入，并且通过切换到Q2来获得更多的活性蒸发溶剂成分。

公开(公告)号：US20030019426A1

公开(公告)日：2003-01-30

申请号：US09983401

申请日：2001-10-24

Inventor： Hiroaki Inoue ,  Koji Mishima ,  Tsutomu Karimata ,  Kenji Nakamura ,  Moriji Matsumoto ,  Junji Kunisawa

IPC: B05C003/00 ,  B05C019/02 ,  B05C013/00 ,  B05C013/02 ,  B05C021/00

CPC classification number: H01L21/76843 ,  C23C18/1619 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76873 ,  H01L21/76874 ,  H01L21/76877 ,  H01L2221/1089

Abstract: The present invention relates to an electroless plating apparatus which can reduce the amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises a holding apparatus for holding a substrate with a surface, to be plated, facing upward, a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding apparatus, an electroless plating treatment liquid supply apparatus for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow the supplied electroless plating liquid to be stored on the substrate, and a heating apparatus provided below the substrate.

Abstract translation: 本发明涉及一种能够减少使用的电镀液量，保持电镀工序稳定，小型化，降低设备成本，在整个表面上形成均匀厚度的膜的化学镀设备，并且防止 电镀液由于升温而劣化。 本发明包括一个保持装置，用于将一个表面保持在待镀的表面上，一个电镀液保持机构，用于密封被保持装置保持的基板的待镀表面周边，一个无电镀 电镀处理液供给装置，用于向由电镀液保持机构密封的基板的待镀表面供给化学镀液体，使供给的化学镀液保存在基板上;以及加热装置， 基质。

公开(公告)号：US20020185230A1

公开(公告)日：2002-12-12

申请号：US09877366

申请日：2001-06-08

Inventor： Sam Kao

IPC: B05C013/00 ,  C23C016/00

CPC classification number: H01L21/6838 ,  H01J2237/2001

Abstract: An article (e.g. a semiconductor wafer) is held in an article holder by means of a number of gas flows emitted from gas vortex chambers. Some of the gas flows act to cool an adjacent article portion more than the other gas flows. For example, some of the vortex chambers emit more gas per unit of time than the other chambers. More cooling is provided to those portions of the article which are heated more during processing. Greater temperature uniformity can be achieved.

Abstract translation: 物品（例如半导体晶片）通过从气体涡流室发出的多个气流保持在物品保持器中。 一些气流用于比其他气体流更冷却相邻的物品部分。 例如，一些涡流室每单位时间发射的气体多于其他腔室。 更多的冷却被提供给在处理过程中被加热得更多的制品的那些部分。 可以实现更高的温度均匀性。

公开(公告)号：US20020144654A1

公开(公告)日：2002-10-10

申请号：US10134149

申请日：2002-04-29

Inventor： Jurgen Elger

IPC: B05C013/00

CPC classification number: H01L21/67294 ,  H01L21/67276 ,  Y10S134/902 ,  Y10S414/14

Abstract: An installation for processing wafers with a plurality of fabrication units and a plurality of measurement units as well as a transport system for transporting the wafers, is described. A transport control unit, which detects a capacity utilization of the installation and saves a processing sequence of the wafers, is allocated to the transport system. As a function of these parameters, control instructions are generated in the transport control unit, and can be output to the transport system for controlling the wafer transport procedure.

Abstract translation: 描述了用于处理具有多个制造单元和多个测量单元的晶片的装置以及用于输送晶片的输送系统。 传送控制单元，其检测设备的容量利用并保存晶片的处理顺序，分配给传送系统。 作为这些参数的函数，在传送控制单元中产生控制指令，并且可以将其输出到用于控制晶片传送过程的传送系统。

公开(公告)号：US20020132043A1

公开(公告)日：2002-09-19

申请号：US09810835

申请日：2001-03-16

Inventor： Evan F. Cromwell ,  Johann F. Adam ,  Eric D. Moen

IPC: B05D005/08 ,  B05C013/00 ,  B05C011/11

CPC classification number: B05C3/09 ,  B05C13/025 ,  B05D1/18 ,  G11B7/24 ,  G11B7/268 ,  G11B23/00 ,  G11B33/148

Abstract: A system for processing a disk includes an end-effector having a plurality of fingers. The end-effector is mounted to a rotary actuator. The rotary actuator is mounted to a linear stage. The linear stage is positioned adjacent to an air track and a tank. The rotary actuator and the linear stage place the fingers into the inner diameter of a disk on the air track. The fingers grip the inner diameter of the disk. The rotary actuator and the liner stage then place the fingers holding the disk into the tank. The tank is filled with a processing liquid such as a lubrication solution to lubricate the disk.

Abstract translation: 用于处理盘的系统包括具有多个手指的末端执行器。 末端执行器安装到旋转致动器。 旋转执行器安装在线性平台上。 线性平台位于空气轨道和水箱附近。 旋转执行器和线性平台将手指放置在空气轨道上的盘的内径中。 手指握住磁盘的内径。 然后旋转执行机构和衬垫台把握住盘的手指放入槽中。 罐中填充有诸如润滑溶液的处理液体以润滑盘。

公开(公告)号：US20020124801A1

公开(公告)日：2002-09-12

申请号：US09891844

申请日：2001-06-26

Inventor： Kyle M. Hanson

IPC: B05C013/00 ,  C23C016/00

CPC classification number: H01L21/67259 ,  H01L21/681

Abstract: A semiconductor processing workpiece support which includes a detection subsystem that detects whether a wafer or other workpiece is present. The preferred arrangement uses an optical beam emitter and an optical beam detector mounted along the back side of a rotor which acts as a workpiece holder. The emitted beam passes through the workpiece holder and is reflected by any workpiece present in the workpiece holder. The preferred units include both an optical emitter and pair of detectors. The detection is preferably able to discriminate on the basis of the angle of the reflected beam, so that a portion of the beam reflected by the workpiece holder is not considered or minimized.

Abstract translation: 一种半导体加工工件支撑件，其包括检测子晶体，其检测晶片或其它工件是否存在。 优选的布置使用光束发射器和沿着作为工件保持器的转子的后侧安装的光束检测器。 发射的光束通过工件保持器并被存在于工件保持器中的任何工件反射。 优选的单元包括光发射器和一对检测器。 该检测优选地能够基于反射光束的角度进行鉴别，使得不考虑或最小化由工件保持器反射的光束的一部分。

公开(公告)号：US20020014200A1

公开(公告)日：2002-02-07

申请号：US09840596

申请日：2001-04-23

Inventor： Terry L. Stemler ,  David Mattice ,  Kendall L. Wilcox

IPC: B05C011/02 ,  B05C013/00 ,  B05C013/02 ,  B05D003/12 ,  B05D007/00 ,  B05D001/02

CPC classification number: B01J2/006 ,  B05B3/1014

Abstract: A coating machine having an improved liquid atomizing array for applying a liquid coating on the granules, comprising a housing having a flow collar at one end for controlling an influx of the granule material. A rotatable granule-distributing disc is disposed below the flow collar for producing a cylindrical curtain of granule material falling through the housing. A scraper assembly is attached below the granule-distributing disk to rotatably engage an inner surface of the housing. An array of liquid atomizing discs is disposed along the longitudinal axis of the housing and below the rotatable granule-distributing disc. Each of the discs is generally circular in plan form and having a serrated peripheral edge defining a lineal circumference greater than that of a circle having a diameter equal to that of the disc. A drive system below the housing is interconnected to the plurality of liquid atomizing discs to rotate the discs at a speed in excess of two thousand revolutions per minute. A liquid dispenser coaxial with said rotatable granule-distributing disc dispenses the liquid coating onto the spinning discs. A discharge chute is provided at the bottom of the housing for gathering the liquid-coated granule material for transport to another location.

Abstract translation: 一种具有用于在颗粒上施加液体涂层的改进的液体雾化阵列的涂布机，包括在一端具有流动轴环的壳体，用于控制颗粒材料的流入。 可旋转的颗粒分配盘设置在流动环的下方，用于产生通过壳体落下的圆柱形颗粒状窗帘。 刮刀组件安装在颗粒分配盘的下方以可旋转地接合壳体的内表面。 液体雾化盘的阵列沿着壳体的纵向轴线设置并且位于可旋转颗粒分配盘的下方。 每个盘通常为平面形状的圆形，并且具有锯齿形周边边缘，该锯齿状周边边缘限定比直径等于圆盘直径的直线圆周的直线圆周。 壳体下方的驱动系统与多个液体雾化盘互连，以便以每分钟两千转的速度旋转盘。 与所述可旋转颗粒分配盘同轴的液体分配器将液体涂层分配到旋转盘上。 排放滑槽设置在壳体的底部，用于收集用于运输到另一位置的液体包裹的颗粒材料。