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    Adhesive wrapping film
    11.
    发明申请
    Adhesive wrapping film 失效
    胶粘包装膜

    公开(公告)号：US20020058127A1

    公开(公告)日：2002-05-16

    申请号：US09867393

    申请日：2001-05-31

    Inventor： Mitsuyoshi Itada ,  Reiko Takahashi

    IPC: B32B003/28

    CPC classification number: C09J7/30 ,  C09J7/22 ,  C09J2201/28 ,  C09J2201/32 ,  Y10S428/906 ,  Y10T428/24355 ,  Y10T428/24521 ,  Y10T428/24612 ,  Y10T428/24628 ,  Y10T428/2495 ,  Y10T428/28

    Abstract: An adhesive wrapping film having a continuous tackifier layer (A) on at least one side surface of a substrate layer (B) whose surface has a concavo-convex form, wherein a thickness of the tackifier layer at the concave portion of the substrate layer is larger than that at the convex portion of the substrate layer, and a thickness of the substrate layer BAV, a thickness of the tackifier layer at the concave portion of the substrate layer Amax a ten-point average roughness of the surface of the tackifier layer corresponding to a height of the convex portion of the tackifier layer RZ(A) and a ten-point average roughness of the surface of the substrate layer corresponding to a height of the convex portion of the substrate layer RZ(B) satisfy a relation of the following conditional expressions (1) and (2): (1) Amax

    Abstract translation: 一种在表面为凹凸形状的基材层（B）的至少一个侧面上具有连续增粘层（A）的粘合性包裹膜，其中，所述基材层的凹部的增粘层的厚度为 大于衬底层的凸部的厚度，衬底层BAV的厚度，衬底层的凹部的增粘层的厚度Amax与增粘层的表面的十点平均粗糙度对应 与增粘层RZ（A）的凸部的高度相对应，并且与基板层RZ（B）的凸部的高度对应的基板层的表面的十点平均粗糙度满足关系式 以下条件表达式（1）和（2）：（1）Amax

    Reversible shape memory multifunctional structural designs and method of using and making the same
    16.
    发明申请
    Reversible shape memory multifunctional structural designs and method of using and making the same 有权
    可逆形状记忆多功能结构设计及使用方法

    公开(公告)号：US20040197519A1

    公开(公告)日：2004-10-07

    申请号：US10487291

    申请日：2004-02-20

    Inventor： Dana M. Elzey ,  Haydn N.G. Wadley

    IPC: B32B003/28 ,  B32B003/26 ,  B32B003/12

    CPC classification number: B32B3/28 ,  B32B7/08 ,  B32B15/011 ,  B32B33/00 ,  B32B2311/005 ,  B32B2605/18 ,  C22F1/006 ,  F03G7/065 ,  Y10T29/49622 ,  Y10T29/49629 ,  Y10T428/1234 ,  Y10T428/12375 ,  Y10T428/12417 ,  Y10T428/12986 ,  Y10T428/23 ,  Y10T428/24149

    Abstract: A multifunctional member with a first active member (30), which is adapted to contract if exposed to a temperature above a first transition temperature range. A second active member (40), which is adapted to contract if exposed to a temperature above a second transition temperature range. A core member (20), which is adaptive for deformation. The first and second active members (30, 40) are attached on opposite or different sides of the core member (20). A heat source operatively connected to the first and second active members (30, 40) to expose them to transition temperatures. The first active member (30) contracts while above the first transition temperature range causing the second active member (40) to expand, wherein the second active member (40) is below the second transition temperature range. The second active member (40) contracts while above the second transition temperature range causing the first active member (30) to expand, wherein the first active member (30) is below the first transition temperature range.

    Abstract translation: 一种具有第一活性构件（30）的多功能构件，其适于在暴露于高于第一转变温度范围的温度时收缩。 第二活动构件（40），其适于在暴露于高于第二过渡温度范围的温度时收缩。 一个适应变形的芯构件（20）。 第一和第二活动构件（30,40）安装在芯构件（20）的相对侧或不同侧上。 可操作地连接到第一和第二活动构件（30,40）以将它们暴露于转变温度的热源。 第一活动构件（30）在高于使第二活动构件（40）膨胀的第一转变温度范围之上时收缩，其中第二活动构件（40）低于第二过渡温度范围。 第二活动构件（40）在第二过渡温度范围高于第一活动构件（30）膨胀的同时收缩，其中第一活动构件（30）低于第一转变温度范围。

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BURIED CONDUCTIVE LINES
    19.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BURIED CONDUCTIVE LINES 有权
    用引导线制造半导体器件的方法

    公开(公告)号：US20040121575A1

    公开(公告)日：2004-06-24

    申请号：US10322654

    申请日：2002-12-19

    Applicant: Macronix International Co., Ltd.

    Inventor： Chao-Yang Chen

    IPC: B32B003/30 ,  B32B003/28 ,  H01L021/44

    CPC classification number: H01L21/26586 ,  H01L21/74 ,  H01L27/10814 ,  H01L27/10885 ,  Y10S438/974

    Abstract: A method of manufacturing semiconductor devices with buried conductive lines is disclosed. The method uses an ion implantation process to form buried conductive lines under isolation regions such as shallow trench isolations. The buried conductive lines connect neighboring active regions and replace conventional contacts and lead lines connecting the active regions.

    Abstract translation: 公开了一种制造具有埋入导线的半导体器件的方法。 该方法使用离子注入工艺在诸如浅沟槽隔离的隔离区域下形成掩埋导电线。 掩埋的导线连接相邻的有源区，并代替连接有源区的常规触点和引线。

    Engineered flexure component
    20.
    发明申请
    Engineered flexure component 审中-公开
    工程挠曲部件

    公开(公告)号：US20040121125A1

    公开(公告)日：2004-06-24

    申请号：US10323460

    申请日：2002-12-18

    Applicant: GOODRICH CORPORATION

    Inventor： Michael Roman Hachkowski

    IPC: B32B003/30 ,  B32B003/28

    CPC classification number: F16F15/04 ,  F16F7/08 ,  G02B23/16 ,  Y10T428/2457

    Abstract: A bolt flange is provided with parallel grooves across its surface. One bolt flange surface has grooves that run in a vertical direction, while a second bolt flange surface has grooves that run in a horizontal direction, such that they are perpendicular to the grooves of the first bolt flange mating surface. The purpose of the grooves is to create a surface that consists of flexures. These flexures cause two effects to occur at the bolted interface. First, for a given clamping force, the resulting surface is greater because of the smaller contact area at the interface which in turn increases the friction force. Second, the flexures are sufficiently flexible enough to bend and not slide as the two interface surfaces move relative to each other. The flexure points may different configurations, i.e. squares, circles, triangles, or other geometric shapes. The grooving of the surfaces allows a designer of optical instruments to be capable of determining the stiffness of the resulting flexure as well as control the percentages of forces that are transferred across an interface through friction as compared with elastic bending. The flexured interface also allows the designer to invoke load path management design rules. In summary, load path management is a process by which a designer can control the effect of friction by not effecting the frictional mechanisms, but by changing the elastic stiffness that surrounds the frictional element. Placing grooves in the interface mating surfaces enables a designer to model the interface stiffness as a series of bending beams, which in turn allows the designer to explicitly model the percentage of force that acts through friction.

    Abstract translation: 螺栓法兰在其表面上设有平行的槽​​。 一个螺栓法兰表面具有沿垂直方向延伸的槽，而第二螺栓法兰表面具有在水平方向上延伸的槽，使得它们垂直于第一螺栓法兰配合表面的槽。 槽的目的是创建一个由弯曲组成的表面。 这些弯曲导致在螺栓接口处发生两种效应。 首先，对于给定的夹紧力，由于在界面处接触面积较小，所得到的表面更大，这又增加了摩擦力。 第二，当两个界面表面相对于彼此移动时，挠曲足够地足够弯曲并且不滑动。 挠曲点可以是不同的构造，即正方形，圆形，三角形或其他几何形状。 表面的切槽允许光学仪器的设计者能够确定所产生的挠曲的刚度，以及与弹性弯曲相比，控制通过摩擦传递通过界面的力的百分比。 弯曲界面还允许设计者调用加载路径管理设计规则。 总之，负载路径管理是设计者通过不影响摩擦机制来控制摩擦的影响，而是通过改变围绕摩擦元件的弹性刚度的过程。 在接口配合表面中放置槽可使设计人员将界面刚度建模为一系列弯曲梁，这又使设计者能够明确地模拟通过摩擦作用的力的百分比。

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