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3901 条记录 (耗时 0.029 秒)

    LIGHT EMITTING DEVICE
    12.
    发明申请
    LIGHT EMITTING DEVICE 有权

    公开(公告)号：US20230125799A1

    公开(公告)日：2023-04-27

    申请号：US18146070

    申请日：2022-12-23

    申请人： NICHIA CORPORATION

    发明人： Shota MURAKAMI ,  Soichiro MIURA

    IPC分类号： H01S5/022 ,  H01S5/024 ,  H01S5/026

    摘要： A light emitting device includes: a base having a bottom face and a lateral part surrounding the bottom face and extending upwards from the bottom face, wherein the lateral part comprises a first stepped portion and a second stepped portion facing the first stepped portion; a first semiconductor laser element disposed on the bottom face and located between the first stepped portion and the second stepped portion in a top view, wherein the first semiconductor laser element is configured to emit light towards the second stepped portion; a first wiring region located on the first stepped portion; and one or more first wires, each having a first end that is connected to the first wiring region. At least one of the one or more first wires is electrically connected to the first semiconductor laser element.

    Semiconductor device and method of manufacturing the semiconductor device
    13.
    发明授权
    Semiconductor device and method of manufacturing the semiconductor device 有权

    公开(公告)号：US11581699B2

    公开(公告)日：2023-02-14

    申请号：US17319678

    申请日：2021-05-13

    申请人： NICHIA CORPORATION

    发明人： Shohei Itonaga ,  Eiichiro Okahisa

    IPC分类号： H01S5/022 ,  H01S5/0237 ,  B41M3/00 ,  B23K1/00 ,  H01S5/02216 ,  B23K101/40

    摘要： A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.

    Light emitting device
    14.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11371675B2

    公开(公告)日：2022-06-28

    申请号：US17047220

    申请日：2019-04-10

    申请人： Panasonic Intellectual Property Management Co., Ltd.

    发明人： Tatsuya Okuno ,  Takeshi Abe ,  Shozo Oshio

    IPC分类号： F21V7/26 ,  F21V15/01 ,  H01S5/022

    摘要： Alight emitting device (A) includes a laser light source (1) that emits laser light (100), a housing (2A) that includes a bottom wall (3) and a side wall, and a first wavelength converter (20) provided on the side wall, the first wavelength converter (20) containing a first phosphor. The bottom wall of the housing is irradiated with the laser light emitted from the laser light source, and the first phosphor is excited by diffused light of the laser light diffused by the bottom wall. With such a configuration, the light emitting device (A) improves color uniformity and chromaticity flexibility while increasing power density of output light.

    SEMICONDUCTOR LASER DEVICE
    15.
    发明申请
    SEMICONDUCTOR LASER DEVICE 有权

    公开(公告)号：US20220190224A1

    公开(公告)日：2022-06-16

    申请号：US17579449

    申请日：2022-01-19

    申请人： NICHIA CORPORATION

    发明人： Kazuma KOZURU ,  Ryota OKUNO

    IPC分类号： H01L33/62 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60 ,  H01L33/10 ,  H01S5/00 ,  H01S5/022 ,  H01S5/02253

    摘要： A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

    Laser module and laser apparatus
    16.
    发明授权
    Laser module and laser apparatus 有权

    公开(公告)号：US11309683B2

    公开(公告)日：2022-04-19

    申请号：US16978100

    申请日：2018-12-18

    申请人： Fujikura Ltd.

    发明人： Yohei Kasai

    IPC分类号： H01S5/062 ,  H01S5/022 ,  H01S5/068 ,  H01S5/00

    摘要： A laser module includes: a laser device that emits a laser beam including a major polarization component and a minor polarization component; a beam splitter that splits the laser beam into the major polarization component and the minor polarization component and that directs the major polarization component and the minor polarization component in different directions; an optical fiber that is optically coupled to the major polarization component split by the beam splitter and externally outputs the major polarization component; a package housing that houses the laser device and that has an inner surface including a minor polarization component irradiation portion that is irradiated by the minor polarization component split by the beam splitter; and a temperature measurement element that is attached to the package housing and that detects a temperature change of the minor polarization component irradiation portion.

    Semiconductor laser device
    18.
    发明授权
    Semiconductor laser device 有权

    公开(公告)号：US11258000B2

    公开(公告)日：2022-02-22

    申请号：US17025545

    申请日：2020-09-18

    申请人： NICHIA CORPORATION

    发明人： Kazuma Kozuru ,  Ryota Okuno

    IPC分类号： H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00 ,  H01L33/10 ,  H01S5/00 ,  H01S5/022 ,  H01S5/02253

    摘要： A semiconductor laser device includes: a package includes a recess and an upper surface that has an outer peripheral surface and a bonding surface positioned between the recess and the outer peripheral surface, the bonding surface having inner corners on the recess side and outer corners on the outer peripheral surface side; at least one semiconductor laser element disposed in the recess of the package; and a light-transmissive member bonded to the bonding surface of the package. The radius of curvature of inner corners is greater than the radius of curvature of outer corners.

    Light synthesizing device
    19.
    发明授权
    Light synthesizing device 有权

    公开(公告)号：US11237467B2

    公开(公告)日：2022-02-01

    申请号：US16655652

    申请日：2019-10-17

    申请人： NICHIA CORPORATION

    发明人： Soichiro Miura

    IPC分类号： G03B21/20 ,  H01S5/40 ,  G02B5/30 ,  G02B27/28 ,  H01S5/02208 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/022 ,  G03B21/00

    摘要： A light synthesizing device includes first and second light emitting devices, first and second polarization control members, and a synthesis member. Each of the first and second light emitting devices has at least one first semiconductor laser element and at least one second semiconductor laser element, and configured such that a polarization direction of exit light from the first semiconductor laser element is different from a polarization direction of exit light from the second semiconductor laser element. The first and second polarization control members are respectively configured to change the polarization directions of the exit lights from the first semiconductor laser element of the first light emitting device and the second semiconductor laser element of the second light emitting device. The synthesis member is configured to combine light exited from the first light emitting device and light exited from the second light emitting device.