THERMOPLASTIC MOLDING COMPOUNDS CONTAINING STYRENE COPOLYMERS AND POLYAMIDES
    192.
    发明申请
    THERMOPLASTIC MOLDING COMPOUNDS CONTAINING STYRENE COPOLYMERS AND POLYAMIDES 审中-公开
    含有苯乙烯共聚物和聚酰胺的热塑性成型化合物

    公开(公告)号:US20110319550A1

    公开(公告)日:2011-12-29

    申请号:US13148393

    申请日:2010-01-29

    摘要: The thermoplastic molding composition comprises a) as component A, from 3 to 79% by weight of one or more styrene copolymers which have no units derived from maleic anhydride, b) as component B, from 15 to 91% by weight of one or more polyamides having, based on the entire component B, from 0.1 to 0.2% by weight of triacetonediamine (TAD) end groups, c) as component C, from 5 to 50% by weight of one or more impact-modifying rubbers, d) as component D, from 1 to 25% by weight of a styrene copolymer which, based on the entire component D, has from 1.9 to 2.3% by weight of units derived from maleic anhydride, e) as component E, from 0 to 40% by weight of further rubbers, f) as component F, from 0 to 50% by weight of one or more fibrous or particulate fillers, g) as component G, from 0 to 40% by weight of further additives, where the molding composition comprises less than 0.1% by weight of phthalic anhydride and the total amount of components A to D and, if appropriate, E to G is 100% by weight.

    摘要翻译: 热塑性模塑组合物包含a)作为组分A,3至79重量%的一种或多种苯乙烯共聚物,其不具有源自马来酸酐的单元,b)作为组分B,15至91重量%的一种或多种 具有基于整个组分B的0.1至0.2重量%的三丙酮二胺(TAD)端基的聚酰胺,c)作为组分C,5至50重量%的一种或多种冲击改性橡胶,d)为 组分D,1至25重量%的苯乙烯共聚物,其基于整个组分D,具有1.9至2.3重量%的源自马来酸酐的单元,e)作为组分E,0至40重量% f)作为组分F,0至50重量%的一种或多种纤维或颗粒填料,g)作为组分G,0至40重量%的其它添加剂,其中模塑组合物包含较少的 0.1重量%以上的邻苯二甲酸酐和成分A〜D的总量,如果合适,E〜G为100重量% 重量。

    Semiconductor wafers of silicon and method for their production
    193.
    发明授权
    Semiconductor wafers of silicon and method for their production 有权
    硅半导体晶圆及其生产方法

    公开(公告)号:US08043427B2

    公开(公告)日:2011-10-25

    申请号:US12011713

    申请日:2008-01-29

    IPC分类号: C30B15/22

    CPC分类号: C30B29/06 C30B15/203

    摘要: Semiconductor wafers of silicon are produced by pulling a single crystal growing on a phase boundary from a melt contained in a crucible and cutting of semiconductor wafers therefrom, wherein during pulling of the single crystal, heat is delivered to a center of the phase boundary and a radial profile of a ratio V/G from the center to an edge of the phase boundary is controlled, G being the temperature gradient perpendicular to the phase boundary and V being the pull rate. The radial profile of the ratio V/G is controlled so that the effect of thermomechanical stress in the single crystal adjoining the phase boundary, is compensated with respect to creation of intrinsic point defects. The invention also relates to defect-free semiconductor wafers of silicon, which can be produced economically by this method.

    摘要翻译: 硅的半导体晶片是通过从包含在坩埚中的熔融物中拉出在相边界上生长的单晶并从其中切割半导体晶片而制造的,其中在单晶拉制期间,热被传递到相边界的中心,并且 控制从相位边界的中心到边缘的比率V / G的径向轮廓,G是垂直于相边界的温度梯度,V是牵引速率。 控制比率V / G的径向轮廓,使得邻接相位边界的单晶中的热机械应力的影响被补偿以产生固有点缺陷。 本发明还涉及硅的无缺陷半导体晶片,其可以通过该方法经济地制造。

    Thermoplastic molding materials based on polyesters and styrene copolymers
    196.
    发明授权
    Thermoplastic molding materials based on polyesters and styrene copolymers 有权
    基于聚酯和苯乙烯共聚物的热塑性成型材料

    公开(公告)号:US07863377B2

    公开(公告)日:2011-01-04

    申请号:US11997797

    申请日:2006-07-31

    摘要: Thermoplastic molding compositions, comprising A) at least one thermoplastic polyester A, B) at least one graft polymer B of b1) a graft base of an elastomeric polymer B1 based on alkyl acrylates, ethylene/propylene, dienes, or on siloxanes, and with a glass transition temperature below 0° C., b2) a graft B2 composed of b21) styrene or of substituted styrenes B21 of formula I  where R is alkyl or hydrogen and R1 is alkyl radical and n is 1, 2, or 3, or mixture, and b22) at least one unsaturated nitrile B22, C) at least one thermoplastic copolymer C of c1) styrene and/or of substituted styrenes C1 of formula I, and c2) at least one unsaturated nitrile C2, D) at least one copolymer D, obtainable via reaction of d1) at least one thermoplastic methacrylate polymer D1 comprising at least one of epoxy, carboxy, hydroxy, anhydride, or oxazoline, with d2) at least one thermoplastic polyester D2.

    摘要翻译: 热塑性模塑组合物,包括A)至少一种热塑性聚酯A,B)至少一种接枝聚合物B,b1)基于丙烯酸烷基酯,乙烯/丙烯,二烯或硅氧烷的弹性体聚合物B1的接枝基, 玻璃化转变温度低于0℃,b2)由b21)苯乙烯或式I的取代苯乙烯B21构成的接枝B2,其中R是烷基或氢,R1是烷基,n是1,2或3,或 混合物和b22)至少一种不饱和腈B22,C)c1)苯乙烯和/或式I的取代苯乙烯C1的至少一种热塑性共聚物C,和c2)至少一种不饱和腈C2,D)至少一种 共聚物D,其通过d1)至少一种包含环氧基,羧基,羟基,酸酐或恶唑啉中的至少一种的热塑性甲基丙烯酸酯聚合物D1与d2)至少一种热塑性聚酯D2反应获得。

    Isolation of nucleic acids on surfaces
    198.
    发明申请
    Isolation of nucleic acids on surfaces 审中-公开
    表面上核酸的分离

    公开(公告)号:US20100159460A1

    公开(公告)日:2010-06-24

    申请号:US12584772

    申请日:2009-09-11

    摘要: New processes and equipment to isolate and purify nucleic acids on surfaces are provided. The invention focuses on processes which use surfaces, for example, porous membranes, on which the nucleic acids are immobilized in a simple manner from the sample containing the nucleic acids and can be released again by way of simple procedural steps, whereby the simple performance of the process according to the invention makes it possible to perform the processes specifically in a fully automatic manner. An additional aspect of the present invention focuses on binding the nucleic acids to an immobile phase, especially to a membrane, in such a way and manner, that they can be released without difficulty during an additional reaction stage from this phase and, if desired, can be used in other applications, such as restriction digestion, RT, PCR or RT-PCR, or in any of the suitable analyses or enzyme reactions mentioned in the disclosure. Special isolation devices are provided that can be used to carry out the processes according to the invention.

    摘要翻译: 提供了在表面上分离和纯化核酸的新工艺和设备。 本发明的重点是使用表面的方法,例如多孔膜,其中核酸以简单的方式从含有核酸的样品中固定,并且可以通过简单的程序步骤再次释放, 根据本发明的方法使得可以特别地以全自动的方式执行处理。 本发明的另一方面集中于以这样的方式和方式将核酸结合到固定相,特别是与膜结合,使得它们可以在该相的另外的反应阶段期间无困难地释放,并且如果需要, 可用于其他应用,如限制性消化,RT,PCR或RT-PCR,或本公开中提及的任何合适的分析或酶反应。 提供了可用于执行根据本发明的方法的特殊隔离装置。