公开(公告)号：US20200243139A1

公开(公告)日：2020-07-30

申请号：US16382060

申请日：2019-04-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C16/10 ,  G11C16/04 ,  G11C16/26 ,  G11C14/00 ,  G11C11/54 ,  G06N3/04

Abstract: A memory device includes a plurality of memory cells and a controller. The controller is configured to program each of the memory cells to one of a plurality of program states, and to read the memory cells using a read operation of applied voltages to the memory cells. During the read operation, separations between adjacent ones of the program states vary based on frequencies of use of the program states in the plurality of memory cells.

公开(公告)号：US10720217B1

公开(公告)日：2020-07-21

申请号：US16382060

申请日：2019-04-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C16/04 ,  G11C16/26 ,  G11C16/10 ,  G11C11/54 ,  G06N3/04 ,  G11C14/00 ,  H01L27/11521

Abstract: A memory device includes a plurality of memory cells and a controller. The controller is configured to program each of the memory cells to one of a plurality of program states, and to read the memory cells using a read operation of applied voltages to the memory cells. During the read operation, separations between adjacent ones of the program states vary based on frequencies of use of the program states in the plurality of memory cells.

公开(公告)号：US10714489B2

公开(公告)日：2020-07-14

申请号：US16209515

申请日：2018-12-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Yuri Tkachev ,  Alexander Kotov ,  Nhan Do

IPC: H01L29/788 ,  H01L27/11521 ,  G11C16/04

Abstract: A memory device with a memory cell and control circuitry. The memory cell includes source and drain regions formed in a semiconductor substrate, with a channel region extending there between. A floating gate is disposed over a first portion of the channel region for controlling its conductivity. A select gate is disposed over a second portion of the channel region for controlling its conductivity. A control gate is disposed over the floating gate. An erase gate is disposed over the source region and adjacent to the floating gate. The control circuitry is configured to perform a program operation by applying a negative voltage to the erase gate for causing electrons to tunnel from the erase gate to the floating gate, and perform an erase operation by applying a positive voltage to the erase gate for causing electrons to tunnel from the floating gate to the erase gate.

公开(公告)号：US10699787B2

公开(公告)日：2020-06-30

申请号：US16783286

申请日：2020-02-06

Applicant: Silicon Storage Technology, Inc.

Inventor： Vipin Tiwari ,  Nhan Do ,  Hieu Van Tran

IPC: G11C16/10 ,  G11C11/56 ,  G11C16/04 ,  H01L29/788 ,  H01L29/423

Abstract: An improved programming technique for non-volatile memory cell arrays, in which memory cells to be programmed with higher programming values are programmed first, and memory cells to be programmed with lower programming values are programmed second. The technique reduces or eliminates the number of previously programmed cells from being adversely incrementally programmed by an adjacent cell being programmed to higher program levels, and reduces the magnitude of adverse incremental programming for most of the memory cells, which is caused by floating gate to floating gate coupling. The memory device includes an array of non-volatile memory cells and a controller configured to identify programming values associated with incoming data, and perform a programming operation in which the incoming data is programmed into at least some of the non-volatile memory cells in a timing order of descending value of the programming values.

公开(公告)号：US10692548B2

公开(公告)日：2020-06-23

申请号：US16551593

申请日：2019-08-26

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Xian Liu ,  Nhan Do

IPC: G11C16/06 ,  G11C7/10 ,  G11C8/12 ,  H01L27/11521 ,  H01L21/28 ,  G11C16/08 ,  G11C29/02 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  G11C8/08 ,  G11C8/10 ,  G11C16/04 ,  G11C29/12 ,  H01L27/11524

Abstract: A system and method are disclosed for performing address fault detection in a flash memory system. In one embodiment, a flash memory system comprises a memory array comprising flash memory cells arranged in rows and columns, a row decoder for receiving a row address as an input, the row decoder coupled to a plurality of word lines, wherein each word line is coupled to a row of flash memory cells in the memory array, an address fault detection array comprising a column of memory cells, wherein each of the plurality of word lines is coupled to a memory cell in the column, and an analog comparator for comparing a current drawn by the column with a reference current and for indicating a fault if the current drawn by the column exceeds the reference current.

公开(公告)号：US10658027B2

公开(公告)日：2020-05-19

申请号：US15002302

申请日：2016-01-20

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Xian Liu ,  Vipin Tiwari ,  Hieu Van Tran

IPC: H01L29/76 ,  G11C11/419 ,  G11C16/04 ,  G11C16/14 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  H01L27/11521

Abstract: A method of forming a memory device that includes forming on a substrate, a first insulation layer, a first conductive layer, a second insulation layer, a second conductive layer, a third insulation layer. First trenches are formed through third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer, leaving side portions of the first conductive layer exposed. A fourth insulation layer is formed at the bottom of the first trenches that extends along the exposed portions of the first conductive layer. The first trenches are filled with conductive material. Second trenches are formed through the third insulation layer, the second conductive layer, the second insulation layer and the first conductive layer. Drain regions are formed in the substrate under the second trenches. A pair of memory cells results, with a single continuous channel region extending between drain regions for the pair of memory cells.

公开(公告)号：US20200065660A1

公开(公告)日：2020-02-27

申请号：US16182237

申请日：2018-11-06

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Mark Reiten ,  Nhan Do

IPC: G06N3/063 ,  G06F17/16 ,  G06F3/06 ,  G06N3/08

Abstract: Numerous embodiments are disclosed for a configurable hardware system for use in an analog neural memory system for a deep learning neural network. The components within the configurable hardware system that are configurable can include vector-by-matrix multiplication arrays, summer circuits, activation circuits, inputs, reference devices, neurons, and testing circuits. These devices can be configured to provide various layers or vector-by-matrix multiplication arrays of various sizes, such that the same hardware can be used in analog neural memory systems with different requirements.

公开(公告)号：US20200051635A1

公开(公告)日：2020-02-13

申请号：US16550248

申请日：2019-08-25

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Thuan Vu ,  Stanley Hong ,  Anh Ly ,  Vipin Tiwari ,  Nhan Do

IPC: G11C16/04 ,  H01L27/11521 ,  H01L29/788 ,  G06N3/08

Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Different calibration algorithms and systems are also disclosed. Compensation measures are utilized to compensate for changes in voltage or current as the number of cells being programmed changes.

公开(公告)号：US20200019848A1

公开(公告)日：2020-01-16

申请号：US16150606

申请日：2018-10-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Nhan Do

IPC: G06N3/063 ,  G06N3/04 ,  G06N3/08 ,  G06F17/16 ,  G06F3/06

Abstract: Numerous embodiments are disclosed for compensating for differences in the slope of the current-voltage characteristic curve among reference transistors, reference memory cells, and flash memory cells during a read operation in an analog neural memory in a deep learning artificial neural network. The embodiments are able to compensate for slope differences during both sub-threshold and linear operation of reference transistors.

公开(公告)号：US20200013882A1

公开(公告)日：2020-01-09

申请号：US16576348

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L21/3213 ,  H01L27/11521 ,  H01L27/11536 ,  H01L27/11531 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.