SUBSTRATE TREATMENT APPARATUS
    231.
    发明申请

    公开(公告)号:US20210354236A1

    公开(公告)日:2021-11-18

    申请号:US17388356

    申请日:2021-07-29

    Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.

    APPARATUS FOR DISTRIBUTING LOAD AND SYSTEM FOR TREATING SUBSTRATE WITH THE APPARATUS

    公开(公告)号:US20210331466A1

    公开(公告)日:2021-10-28

    申请号:US17237175

    申请日:2021-04-22

    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

    Method and apparatus for treating substrate

    公开(公告)号:US11139184B2

    公开(公告)日:2021-10-05

    申请号:US16158950

    申请日:2018-10-12

    Abstract: The inventive concept provides an apparatus and a method for heat-treating a substrate. The method includes a first treatment operation of spacing a substrate apart from a support plate provided with a heater to a first height in a state in which a treatment space, in which the substrate is treated, is closed and heating the substrate, a second treatment operation of, after the first treatment operation, lowering the substrate such that the substrate is located at a second height and heating the substrate, a third treatment operation of, after the second treatment operation, lifting the substrate such that the substrate is spaced apart from the support plate to be located at a third height and heating the substrate, and a fourth treatment operation of, after the third treatment operation, lowering the substrate such that the substrate is located at a fourth height and heating the substrate.

    CONVEYOR SYSTEM
    237.
    发明申请

    公开(公告)号:US20210210367A1

    公开(公告)日:2021-07-08

    申请号:US17143265

    申请日:2021-01-07

    Inventor: HYEONGJIN BAK

    Abstract: A conveyor system for moving a plurality of targets is provided. The conveyor system includes at least one input group to input the target, at least one output group to output the target, and at least one bridge group to connect the input group with the output group. Each of the input group, the output group, and the bridge group includes a plurality of nodes having a size corresponding to a size of one target. The conveyor system further includes a control unit to align the target moving on the conveyor system.

    Buffer unit, and apparatus for treating substrate with the unit

    公开(公告)号:US11056367B2

    公开(公告)日:2021-07-06

    申请号:US16546104

    申请日:2019-08-20

    Abstract: Embodiments of the inventive concept provide an apparatus and method for storing a substrate. A buffer unit for storing a substrate includes a housing having an entrance formed at one side and a buffer space inside, a substrate support unit that supports one or more substrates in the buffer space, a pressure adjustment unit that adjusts pressure in the buffer space, and a controller that controls the pressure adjustment unit. The pressure adjustment unit includes a gas supply line that supplies a gas for pressurizing the buffer space and a gas exhaust line that reduces the pressure in the buffer space. At least one of the gas supply line and the gas exhaust line includes a plurality of lines.

    Apparatus for treating substrate
    239.
    发明授权

    公开(公告)号:US11037807B2

    公开(公告)日:2021-06-15

    申请号:US16505883

    申请日:2019-07-09

    Applicant: Semes Co., Ltd

    Inventor: Jong Gu Lee

    Abstract: An apparatus for treating a substrate comprises a process chamber having a processing space inside, a substrate support unit that supports the substrate in the processing space, a heating unit that heats the substrate supported on the substrate support unit, an exhaust unit that evacuates the processing space, and a guide member that guides a gas flow in the processing space. The guide member comprises a blocking plate that is located between an upper wall of the process chamber and the substrate support unit and spaced apart from an inner sidewall of the process chamber and that has a diameter smaller than an inner diameter of the process chamber. The exhaust unit is connected, at a position overlapping the blocking plate, to the upper wall of the process chamber when viewed from above.

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