ELECTRONIC DIE TESTING DEVICE AND METHOD

    公开(公告)号:US20230036484A1

    公开(公告)日:2023-02-02

    申请号:US17869301

    申请日:2022-07-20

    Abstract: A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

    Method and apparatus for converting a digital image

    公开(公告)号:US11568515B2

    公开(公告)日:2023-01-31

    申请号:US17361783

    申请日:2021-06-29

    Abstract: An embodiment method for converting an initial digital image into a converted digital image, electronic chip, system and computer program product are disclosed, the initial digital image comprising a set of pixels, the pixels being associated respectively with colors, the initial digital image being acquired by an acquisition device, and the converted digital image able to be used by a neural network. The embodiment method comprises redimensioning of the initial digital image in order to obtain an intermediate digital image, the redimensioning being carried out by a reduction in the number of pixels of the initial image, modification of a format of one of the pixels of the intermediate digital image in order to obtain a converted digital image, the modification being carried out, after the redimensioning, by increasing the number of bits used to represent the color of the pixel.

    Time domains synchronization in a system on chip

    公开(公告)号:US11552777B2

    公开(公告)日:2023-01-10

    申请号:US17457354

    申请日:2021-12-02

    Abstract: A method for synchronizing a first time domain with a second time domain of a system on chip includes a detection of at least one periodic trigger event generated in the first time domain, the second time domain or in a third time domain; acquisitions, made at the instants of the at least one trigger event, of the current timestamp values representative of the instantaneous states of the time domain(s) other than the trigger time domain; a comparison, made in the third time domain, between differential durations between current timestamp values which are respectively acquired successively; and a synchronization of the second time domain with the first time domain, on the basis of the comparison.

    Interrupt controller and method of managing an interrupt controller

    公开(公告)号:US11550744B2

    公开(公告)日:2023-01-10

    申请号:US17229307

    申请日:2021-04-13

    Abstract: In accordance with an embodiment, an electronic device includes: an interrupt controller having an input for receiving a controller clock signal, and an output, the interrupt controller configured to deliver an output interrupt signal on the output when the controller clock signal is active, and a control circuit comprising, an input interface for receiving at least one interrupt signal from at least one item of equipment external to the device, a clock input for receiving an external clock signal, and a first controller connected to the input interface and to the clock input, the first controller configured to automatically generate the controller clock signal from the external clock signal from when the at least one interrupt signal is asserted until a delivery of a corresponding output interrupt signal.

    INTEGRATED CIRCUIT OPTICAL PACKAGE
    258.
    发明申请

    公开(公告)号:US20220392820A1

    公开(公告)日:2022-12-08

    申请号:US17833153

    申请日:2022-06-06

    Abstract: A cap is mounted to a support substrate, the cap including a cap body and an optical shutter. The cap and support substrate define a housing. An electronic chip is disposed in the housing above the support substrate. A face of the electronic chip supports an optical device that is optically coupled with the optical shutter. The cap body is thermally conductive. Within the housing, a thermally conductive linking structure is coupled in a thermally conductive manner between the cap body and the electronic chip. The thermally conductive linking structure surrounds the electronic chip. A thermal interface material fills a portion of the housing between the thermally conductive linking structure and the cap body.

    Laser diode driver circuits and methods of operating thereof

    公开(公告)号:US11482836B2

    公开(公告)日:2022-10-25

    申请号:US16774889

    申请日:2020-01-28

    Abstract: A driver circuit includes a fly capacitor with a first end and a second end. The driver circuit includes a laser diode having an anode and a cathode. The driver circuit is configured to operate in first and second operating states. The anode is coupled to the first end of the fly capacitor. In the first operating state, the cathode is coupled to a first voltage supply node, the first end of the fly capacitor is coupled to a second voltage supply node, and the second end of the fly capacitor is coupled to a first reference terminal. In the second operating state, the cathode is coupled to a second reference terminal and decoupled from the first voltage supply node, the first end of the fly capacitor is decoupled from the second voltage supply node, and the second end of the fly capacitor is coupled to a third reference terminal.

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