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公开(公告)号：US10147834B2
公开(公告)日：2018-12-04
申请号：US14885215
申请日：2015-10-16
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Laurent Herard , David Gani
IPC: H01L31/167 , H01L25/16 , H01L31/18 , H01L31/0203 , H01L33/00 , H01L33/58 , G01S17/02 , H01L31/16 , G01S7/481 , G01D5/347 , H01L33/54
Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.
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公开(公告)号：US20180331236A1
公开(公告)日：2018-11-15
申请号：US16027647
申请日：2018-07-05
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En LUAN , Laurent HERARD , Yong Jiang LEI
IPC: H01L31/0203 , H01L31/153 , H01L31/18 , H01L31/12 , G01S7/481
CPC classification number: H01L31/0203 , G01S7/481 , G01S7/4813 , G01S17/026 , G01S17/46 , H01L25/50 , H01L31/125 , H01L31/153 , H01L31/173 , H01L31/18
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.
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公开(公告)号：US10061057B2
公开(公告)日：2018-08-28
申请号：US14832971
申请日：2015-08-21
Inventor： Wing Shenq Wong , Andy Price , Eric Christison
IPC: G06M7/00 , G01V8/12 , H01L25/16 , H01L31/167
CPC classification number: G01V8/12 , H01L25/167 , H01L31/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
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公开(公告)号：US20180151772A1
公开(公告)日：2018-05-31
申请号：US15880090
申请日：2018-01-25
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Loic Pierre Louis RENARD , Cheng-Lay ANG
IPC: H01L31/173 , H01L31/12 , H01G9/20 , H01L31/046 , H01S5/183 , H01S5/022 , H01L31/042 , H01L31/0475 , H01L31/047
CPC classification number: H01L31/173 , G01S7/4813 , G01S17/08 , H01G9/20 , H01L31/0203 , H01L31/02366 , H01L31/042 , H01L31/046 , H01L31/047 , H01L31/0475 , H01L31/125 , H01S5/02252 , H01S5/183 , Y02E10/50
Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
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公开(公告)号：US20180017536A1
公开(公告)日：2018-01-18
申请号：US15213100
申请日：2016-07-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Tien Choy Loh , Shian Yeu Kam , Ravi Shankar
CPC classification number: G01N33/004 , G01N25/22 , G01N33/0047
Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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Patent Agency Ranking
公开(公告)号：US20180017513A1
公开(公告)日：2018-01-18
申请号：US15213230
申请日：2016-07-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Ravi Shankar , Shian Yeu Kam , Tien Choy Loh
CPC classification number: G01N27/128 , G01N33/0047
Abstract: A miniature gas analyzer capable of detecting VOC gases in ambient air as well as sensing relative humidity and ambient temperature can be used to monitor indoor air quality. The VOC gas sensor is thermally controlled and can be tuned to detect a certain gas by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the VOC gas sensor at a desired temperature. A local temperature sensor may be integrated with each gas sensor to provide feedback control. The heater, local temperature sensor, gas sensor(s), relative humidity sensor, and ambient temperature sensor are in the form of patternable thin films integrated on a single microchip, e.g., an ASIC. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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公开(公告)号：US20170261458A1
公开(公告)日：2017-09-14
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US09754861B2
公开(公告)日：2017-09-05
申请号：US14512208
申请日：2014-10-10
Applicant: STMicroelectronics Pte Ltd
Inventor： Wing Shenq Wong
IPC: H01L23/495
CPC classification number: H01L23/49503 , H01L23/49541 , H01L23/49551 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.
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259.发明申请公开(公告)号：US20170186644A1
公开(公告)日：2017-06-29
申请号：US14982103
申请日：2015-12-29
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Laurent HERARD , David GANI
CPC classification number: H01L21/78 , H01L21/4853 , H01L21/4871 , H01L21/561 , H01L21/565 , H01L23/552 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/3025 , H01L2924/00014 , H01L2224/85
Abstract: A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form an encapsulated body over the at least one IC and substrate with the electrically conductive shield layer at an outer surface of the encapsulated body.
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公开(公告)号：US09691801B2
公开(公告)日：2017-06-27
申请号：US14578718
申请日：2014-12-22
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel Grebet , Wee Chin Judy Lim
IPC: H01L27/146 , H01L31/0203
CPC classification number: H01L27/14618 , H01L27/14636 , H01L27/14683 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.
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