公开(公告)号：US20190195685A1

公开(公告)日：2019-06-27

申请号：US16213197

申请日：2018-12-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: G01J1/02 ,  G01J1/42

CPC classification number: G01J1/0271 ,  G01J1/4204

Abstract: One or more embodiments are directed to ambient light sensor packages, and methods of making ambient light sensor packages. One embodiment is directed to an ambient light sensor package that includes an ambient light sensor die having opposing first and second surfaces, a light sensor on the first surface of the ambient light sensor die, one or more conductive bumps on the second surface of the ambient light sensor die, and a light shielding layer on at least the first surface and the second surface of the ambient light sensor die. The light shielding layer defines an opening over the light sensor. The ambient light sensor package may further include a transparent cover between the first surface of the ambient light sensor die and the light shielding layer, and an adhesive that secures the transparent cover to the ambient light sensor die.

公开(公告)号：US20180062003A1

公开(公告)日：2018-03-01

申请号：US15340216

申请日：2016-11-01

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Laurent HERARD ,  Yong Jiang LEI

IPC: H01L31/0203 ,  H01L31/12 ,  H01L31/18

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US20240194709A1

公开(公告)日：2024-06-13

申请号：US18582860

申请日：2024-02-21

Applicant: STMicroelectronics PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: H01L27/146

CPC classification number: H01L27/14618

Abstract: Disclosed herein is a method of reducing noise captured by an image sensor. The method includes affixing a bottom surface of a glass covering to the image sensor, permitting light to impinge upon the glass covering, and shaping the glass covering such that when the light that impinges upon the glass covering impinges upon a sidewall of the glass covering, the sidewall reflects the light on a trajectory away from the image sensor.

公开(公告)号：US20220352057A1

公开(公告)日：2022-11-03

申请号：US17729452

申请日：2022-04-26

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Pte Ltd

Inventor： Roberto TIZIANI ,  Laurent HERARD

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/13

Abstract: A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

公开(公告)号：US20210020555A1

公开(公告)日：2021-01-21

申请号：US16927776

申请日：2020-07-13

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (ROUSSET) SAS

Inventor： Laurent HERARD ,  David PARKER ,  David GANI

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides devices and methods in which a semiconductor chip has a reduced size and thickness. The device is manufactured by utilizing a sacrificial or dummy silicon wafer. A recess is formed in the dummy silicon wafer where the semiconductor chip is mounted in the recess. The space between the dummy silicon wafer and the chip is filled with underfill material. The dummy silicon wafer and the backside of the chip are etched using any suitable etching process until the dummy silicon wafer is removed, and the thickness of the chip is reduced. With this process, the overall thickness of the semiconductor chip can be thinned down to less than 50 μm in some embodiments. The ultra-thin semiconductor chip can be incorporated in manufacturing flexible/rollable display panels, foldable mobile devices, wearable displays, or any other electrical or electronic devices.

公开(公告)号：US20190319157A1

公开(公告)日：2019-10-17

申请号：US16378153

申请日：2019-04-08

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics Pte Ltd

Inventor： Romain COFFY ,  Laurent HERARD ,  David GANI

IPC: H01L31/12 ,  H01L31/0203

Abstract: A carrier wafer has a back face and a front face and a network of electrical connections between the back face and the front face. A first electronic chip is mounted with its bottom face on top of the front face of the carrier wafer. The first electronic chip has a through-opening extending between the bottom face and a face. A second electronic chip is installed in the through-opening and mounted to the front face of the carrier wafer.

公开(公告)号：US20210384241A1

公开(公告)日：2021-12-09

申请号：US17326537

申请日：2021-05-21

Applicant: STMicroelectronics Pte Ltd

Inventor： Laurent HERARD ,  David GANI

IPC: H01L27/146

Abstract: A digital image sensor package includes an image sensor substrate and a glass covering. The image sensor substrate carries photodiodes. The glass covering has a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering. The glass covering overlies the photodiodes. A surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to the top and bottom surfaces of the glass.

公开(公告)号：US20180331236A1

公开(公告)日：2018-11-15

申请号：US16027647

申请日：2018-07-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN ,  Laurent HERARD ,  Yong Jiang LEI

IPC: H01L31/0203 ,  H01L31/153 ,  H01L31/18 ,  H01L31/12 ,  G01S7/481

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US20170186644A1

公开(公告)日：2017-06-29

申请号：US14982103

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: H01L21/78 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/85

Abstract: A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form an encapsulated body over the at least one IC and substrate with the electrically conductive shield layer at an outer surface of the encapsulated body.

公开(公告)号：US20170110618A1

公开(公告)日：2017-04-20

申请号：US14885215

申请日：2015-10-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent HERARD ,  David GANI

IPC: H01L31/167 ,  H01L33/00 ,  H01L31/0203 ,  H01L33/54 ,  H01L31/18 ,  H01L33/58

CPC classification number: H01L31/167 ,  G01D5/34715 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/16 ,  H01L31/18 ,  H01L33/005 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/15151 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2933/0058

Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.