公开(公告)号：US10429509B2

公开(公告)日：2019-10-01

申请号：US14674650

申请日：2015-03-31

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Jerome Teysseyre

IPC: G01V8/00 ,  G01S17/02 ,  H01L25/16 ,  G01S7/481 ,  H01L31/173

Abstract: A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

公开(公告)号：US10403661B2

公开(公告)日：2019-09-03

申请号：US15619649

申请日：2017-06-12

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

IPC: H01L27/146 ,  H01L31/0203

Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.

公开(公告)号：US10381504B2

公开(公告)日：2019-08-13

申请号：US15969908

申请日：2018-05-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/0232 ,  H01L31/18 ,  H03K17/94 ,  H03K17/96 ,  H01L31/167 ,  G01S17/02 ,  G01S7/481 ,  H01L25/16 ,  G01V8/12 ,  H01L21/56

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

公开(公告)号：US10347786B2

公开(公告)日：2019-07-09

申请号：US15880090

申请日：2018-01-25

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis Renard ,  Cheng-Lay Ang

IPC: H01G9/20 ,  G01S17/08 ,  G01S7/481 ,  H01L31/12 ,  H01S5/022 ,  H01S5/183 ,  H01L31/042 ,  H01L31/046 ,  H01L31/047 ,  H01L31/173 ,  H01L31/0203 ,  H01L31/0236 ,  H01L31/0475

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.

公开(公告)号：US10147834B2

公开(公告)日：2018-12-04

申请号：US14885215

申请日：2015-10-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Laurent Herard ,  David Gani

IPC: H01L31/167 ,  H01L25/16 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/00 ,  H01L33/58 ,  G01S17/02 ,  H01L31/16 ,  G01S7/481 ,  G01D5/347 ,  H01L33/54

Abstract: An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to the substrate and includes first and second encapsulation openings therethrough aligned with the optical sensor and the lens, respectively.

公开(公告)号：US09754861B2

公开(公告)日：2017-09-05

申请号：US14512208

申请日：2014-10-10

Applicant: STMicroelectronics Pte Ltd

Inventor： Wing Shenq Wong

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.

公开(公告)号：US09691801B2

公开(公告)日：2017-06-27

申请号：US14578718

申请日：2014-12-22

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jean-Michel Grebet ,  Wee Chin Judy Lim

IPC: H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

Abstract: An image sensing device may include an interconnect layer and grid array contacts carried by the interconnect layer, and an image sensor IC carried by the interconnect layer and coupled to the grid array contacts, the image sensor IC having an image sensing surface. The image sensing device may include a transparent plate carried by the image sensor IC and aligned with the image sensing surface, and a cap carried by the interconnect layer and having an opening aligned with the image sensing surface. The cap may have an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity, and the cap may define an air vent coupled to the internal cavity.

公开(公告)号：US09620438B2

公开(公告)日：2017-04-11

申请号：US14615673

申请日：2015-02-06

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics S.r.l. ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Valter Motta ,  Xueren Zhang ,  Kim-Yong Goh

IPC: H01L23/02 ,  H01L23/495

CPC classification number: H01L23/49568 ,  H01L23/4334 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2924/18301 ,  H01L2924/00014

Abstract: An electronic device includes an integrated circuit chip mounted to a heat slug. The heat slug has a peripheral region having first thickness along a first direction, the peripheral region surrounding a recess region (having a second, smaller, thickness along the first direction) that defines a chip mounting surface along a second direction perpendicular to the first direction. The recess region defines side borders and a nook extends into the heat slug along the side borders. An insulating body embeds the integrated circuit one chip and heat slug. Material of the insulating body fills the nook.

公开(公告)号：US09525094B2

公开(公告)日：2016-12-20

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric Saugier ,  Wing Shenq Wong ,  David Gani

IPC: H01L31/167 ,  H01L31/02 ,  H01L25/16 ,  H01S5/022 ,  H01S5/183 ,  H01L31/18

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

公开(公告)号：US09525002B2

公开(公告)日：2016-12-20

申请号：US14589210

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface.

Abstract translation: 图像传感器装置可以包括互连层，由互连层承载并具有图像感测表面的图像传感器IC，以及侧向围绕图像传感器IC并且覆盖图像传感器IC的上表面的封装材料，直到图像感测 表面。 图像传感器装置可以包括光学板，其具有由封装材料的上表面承载并与图像感测表面对准的周边下表面，光学板在图像感测表面上方间隔开以限定内部空腔，并且透镜 组件耦合到封装材料并与图像感测表面对齐。