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公开(公告)号:US20230242734A1
公开(公告)日:2023-08-03
申请号:US18010540
申请日:2021-06-25
Applicant: ENEOS CORPORATION
Inventor: Keisuke CHINO , Yusuke MATSUO
CPC classification number: C08K3/041 , C08L91/00 , H01B1/20 , C08L2207/04 , C08L2205/03 , C08L2312/00 , C08L2207/32 , C08K2201/001 , C08K2201/011
Abstract: A conductive thermoplastic elastomer composition comprising: at least one elastomer component selected from the group consisting of elastomeric polymers (A) each of which has a side chain (a) containing a hydrogen-bond cross-linkable moiety having a carbonyl-containing group and/or a nitrogen-containing heterocycle and has a glass-transition point of 25° C. or below, and elastomeric polymers (B) each of which contains a hydrogen-bond cross-linkable moiety and a covalent-bond cross-linking moiety in a side chain and has a glass-transition point of 25° C. or below; a paraffin oil; and a branched multi-layered carbon nanotube, wherein a content ratio of the paraffin oil is 1 to 65% by mass relative to a total amount of the composition.
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公开(公告)号:US20230235858A1
公开(公告)日:2023-07-27
申请号:US18001879
申请日:2021-06-14
Applicant: ENEOS CORPORATION
Inventor: Tadashi SEIKE , Shinji OSHIMA , Ai MINODA , Toshio TEZUKA
CPC classification number: F17C13/02 , F17C5/06 , G01F1/84 , G01F25/15 , F17C2221/012 , F17C2225/036 , F17C2225/0123 , F17C2250/032 , F17C2250/043 , F17C2265/065
Abstract: A flowmeter failure determination method includes: a step of measuring a filling amount of hydrogen gas filled in a fuel tank of an automobile, using a flowmeter; a step of acquiring information of a pressure and a temperature of the fuel tank; a step of calculating the filling amount of the hydrogen gas filled in the fuel tank based on the acquired pressure and temperature and a capacity of the fuel tank in which an expansion rate of the fuel tank is considered; and a step of determining presence or absence of a failure of the flowmeter using an error value between the measured filling amount and the calculated filling amount.
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公开(公告)号:US11705098B2
公开(公告)日:2023-07-18
申请号:US16624583
申请日:2018-06-15
Applicant: Eneos Corporation
Inventor: Kunihiko Ibayashi , Hiroaki Konishi , Muneyuki Shiina , Masahiro Wakayama
IPC: B32B5/24 , G10K11/162 , B32B5/02 , G10K11/168 , B32B5/26 , B60R13/08
CPC classification number: G10K11/162 , B32B5/022 , B32B5/24 , B32B5/266 , G10K11/168 , B32B2307/102 , B60R13/08 , D10B2401/063
Abstract: The sound absorbing material according to the present invention is formed by laminating a porous sound absorber and two or more sheets of a nonwoven fabric one on another. The nonwoven fabric has a plurality of drawn filaments arranged and oriented in one direction. The mode value of the diameter distribution of the plurality of filaments is in the range of 1 to 4 μm. The grammage of the nonwoven fabric is in the range of 5 to 40 g/m2. The sound absorbing material according to the present invention provides high sound absorption performance in a predetermined low frequency band of 6000 Hz or less, and still remains light in weight and flexible enough and easy enough to handle to be substantially comparable to the porous sound absorber.
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公开(公告)号:US20230174747A1
公开(公告)日:2023-06-08
申请号:US18002262
申请日:2021-06-04
Applicant: ENEOS Corporation
Inventor: Makoto ASHIURA , Keisuke CHINO
Abstract: Provided is a silane coupling agent composition with which it is possible to obtain a rubber composition having excellent workability and a crosslinked product of a rubber composition having an excellent hardness, viscoelastic properties, and tensile strength. The silane coupling agent composition of the invention includes a silane compound represented by the following Formula (1), a protein denaturant, and/or a silanization reaction accelerator:
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公开(公告)号:US20230167290A1
公开(公告)日:2023-06-01
申请号:US17919201
申请日:2021-06-18
Applicant: ENEOS CORPORATION
Inventor: Keisuke CHINO , Keitaro IWASAKI , Makoto ASHIURA
IPC: C08L23/16 , C08F210/12 , C08L7/00 , C08F136/08 , C08L9/06 , C08F236/10
CPC classification number: C08L23/16 , C08F210/12 , C08L7/00 , C08F136/08 , C08L9/06 , C08F236/10
Abstract: A rubber composition, comprising:
an uncross-linked rubber having no hydrogen-bond cross-linkable moiety; and
at least one polymer component selected from the group consisting of polymers (A) each of which has a side chain (a) containing a hydrogen-bond cross-linkable moiety having a carbonyl-containing group and/or a nitrogen-containing heterocycle and has a glass-transition point of 25° C. or below and polymers (B) each of which contains a hydrogen-bond cross-linkable moiety and a covalent-bond cross-linking moiety in a side chain and has a glass-transition point of 25° C. or below; wherein
an amount of the polymer component contained is 0.01 to 200 parts by mass relative to 100 parts by mass of the uncross-linked rubber, and
the polymers (A) and the polymers (B) are each a reaction product of a maleic anhydride graft-modified thermoplastic polymer having a maleation ratio of 0.1 to 10% by mass and a cross-linkable compound.-
26.
公开(公告)号:US20230151138A1
公开(公告)日:2023-05-18
申请号:US17906829
申请日:2021-03-25
Applicant: ENEOS CORPORATION
Inventor: Shohei TAKATA , Takeshi KOIKE , Kenta UE
IPC: C08G59/18 , C08G59/02 , C07D493/08
CPC classification number: C08G59/18 , C08G59/02 , C07D493/08 , C07B2200/07
Abstract: Provided are a stereoisomer of an epoxy compound that when contained in a curable composition, can improve the heat resistance and dielectric properties of the cured product of the curable composition, a curable composition containing the stereoisomer, and a cured product of the curable composition. A stereoisomer of an epoxy compound represented by Formula (1) below, the stereoisomer being represented by Formula (2), and a curable composition containing the stereoisomer are used:
in which in Formula (1), R1 to R18 are each independently selected from the group consisting of hydrogen, an alkyl group, and an alkoxy group; and
in which in Formula (2), R1 to R18 are each the same as in Formula (1).-
公开(公告)号:US20230135291A1
公开(公告)日:2023-05-04
申请号:US17913593
申请日:2021-03-24
Applicant: ENEOS CORPORATION
Inventor: Tadashi SEIKE , Hideshi IKI , Seiji MAEDA
IPC: C01B3/56 , B01D53/22 , B01D53/047 , B01D53/04 , C01B3/22
Abstract: Provided is a hydrogen supply system that supplies hydrogen. The hydrogen supply system includes: a dehydrogenation reaction unit that subjects a raw material including a hydride to a dehydrogenation reaction to obtain a hydrogen-containing gas; a hydrogen purification unit that removes a dehydrogenation product from the hydrogen-containing gas obtained in the dehydrogenation reaction unit to obtain a purified gas including high-purity hydrogen; and a degassing unit that removes an inorganic gas contained in the raw material on an upstream side of the dehydrogenation reaction unit in a flow of the raw material.
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公开(公告)号:US20230126144A1
公开(公告)日:2023-04-27
申请号:US17914887
申请日:2021-03-26
Applicant: ENEOS CORPORATION
Inventor: Tadashi SEIKE , Hideshi IKI , Seiji MAEDA
IPC: G06Q10/0832 , C01B3/26
Abstract: Provided is an operation management system configured to manage delivery of a raw material from a raw material production base where the raw material including a hydride is produced to a plurality of dehydrogenation bases where the raw material is subjected to a dehydrogenation reaction to obtain a hydrogen-containing gas. The operation management system includes: an information acquisition unit configured to acquire first information on a dehydrogenation status in the plurality of dehydrogenation bases; and a delivery plan creation unit configured to create a delivery plan for delivering the raw material to the plurality of dehydrogenation bases on the basis of the first information.
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公开(公告)号:US11578166B2
公开(公告)日:2023-02-14
申请号:US16759688
申请日:2018-10-26
Applicant: ENEOS Corporation
Inventor: Yoshinori Nishitani , Masaki Minami , Tatsuki Sato
IPC: C08G59/26 , C07D265/16 , C08G59/24 , C08K3/36 , H01L23/29
Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).
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30.
公开(公告)号:US20230023687A1
公开(公告)日:2023-01-26
申请号:US17782082
申请日:2020-12-01
Applicant: ENEOS Corporation
Inventor: Kenta UE , Takeshi KOIKE , Atsushi KAMEYAMA
IPC: C08F222/10 , C08F220/32 , C08F220/06 , C08F220/14 , C08F2/50 , C08K5/09
Abstract: The present invention provides an alicyclic epoxy acrylate compound that can have high heat resistance in the form of a cured product when contained in a curable composition, a curable composition, and a cured product.
An alicyclic epoxy acrylate compound represented by the following Formula (1) where A denotes an oxygen atom and a curable composition comprising thereof are used: wherein one of R1 and R2 is a (meth)acryloyloxy group, the other of R1 and R2 is a hydrogen atom, R3 to R20 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, and an alkoxy group, and A is an oxygen atom or A is not present, and a carbon atom to which R8 binds and a carbon atom to which R9 binds together form a double bond.
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