Work feeder controller
    21.
    发明授权
    Work feeder controller 失效
    工作进料器控制器

    公开(公告)号:US5231860A

    公开(公告)日:1993-08-03

    申请号:US842133

    申请日:1992-03-23

    IPC分类号: B21D43/05 G05B19/416

    摘要: A controller for a feeder which automatically feeds a work into and out of a press machine in relation to the operation of said press machine. The controller is capable of automatically setting optimum motion curve in accordance with the configurations and sizes of the press die and the work and determining whether any undue operating condition has been set. To this end, the feeder controller has a device for setting the operation start angle value and operation finish angle value in terms of the rotation angle of a crank shaft of the press machine, and computing device for determining a motion curve on the basis of the operation start and finish angle values. The feeder controller also has a device for computing allowable maximum operation stroke number of the press machine and a device for comparing this stroke number with a set stroke number for the purpose of determination as to whether motors are overloaded or not.

    摘要翻译: PCT No.PCT / JP90 / 01213 Sec。 371日期:1992年3月23日 102(e)1992年3月23日PCT PCT 1990年9月21日PCT公布。 出版物WO91 / 04116 PCT 日期1991年4月4日。一种用于相对于所述压力机的操作自动将工件进出压机的进给器的控制器。 控制器能够根据压模和工件的配置和尺寸自动设置最佳运动曲线,并确定是否设置了任何不适当的操作条件。 为此,进料器控制器具有用于根据压机的曲轴的旋转角度设定操作开始角度值和操作精加工角度值的装置,以及用于基于压力机的曲轴确定运动曲线的计算装置 操作开始和结束角度值。 进给器控制器还具有用于计算冲压机的允许最大操作冲程数的装置和用于将该冲程数与设定冲程数进行比较的装置,以便确定电动机是否过载。

    SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE
    22.
    发明申请
    SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE 有权
    SOI WAFER,其制造方法和MEMS器件

    公开(公告)号:US20130277675A1

    公开(公告)日:2013-10-24

    申请号:US13743878

    申请日:2013-01-17

    IPC分类号: H01L21/762 B81B3/00 H01L29/16

    摘要: In order to obtain a SOI wafer having an excellent ability of gettering metal impurities, an efficient method of manufacturing a SOI wafer, and a highly reliable MEMS device using such a SOI wafer, provided is a SOI wafer including: a support wafer (1) and an active layer wafer (6) which are bonded together with an oxide film (3) therebetween, each of the support wafer (1) and the active layer wafer (6) being a silicon wafer; a cavity (1b) formed in a bonding surface of at least one of the silicon wafers; and a gettering material (2) formed on a surface on a side opposite to the bonding surface.

    摘要翻译: 为了获得具有优异的金属杂质吸收能力的SOI晶片,提供了一种制造SOI晶片的有效方法和使用这种SOI晶片的高可靠性MEMS器件,其包括:支撑晶片(1) 以及与它们之间的氧化膜(3)结合在一起的有源层晶片(6),所述支撑晶片(1)和所述有源层晶片(6)中的每一个都是硅晶片; 形成在所述硅晶片中的至少一个的接合面中的空腔(1b) 以及形成在与所述接合面相反的一侧的表面上的吸气材料(2)。

    SUBSTITUTED BENZOCHALCOGENOACENE COMPOUND, THIN FILM COMPRISING THE COMPOUND, AND ORGANIC SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM
    23.
    发明申请
    SUBSTITUTED BENZOCHALCOGENOACENE COMPOUND, THIN FILM COMPRISING THE COMPOUND, AND ORGANIC SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM 审中-公开
    取代的苯并三氮烯化合物,包含化合物的薄膜和包括薄膜的有机半导体器件

    公开(公告)号:US20120190868A1

    公开(公告)日:2012-07-26

    申请号:US13382821

    申请日:2010-07-08

    IPC分类号: C07D495/14

    摘要: Provided are a novel compound suitable as an organic semiconductor material, the compound being a substituted benzochalcogenoacene compound represented by the formula (1), a thin film comprising the compound, and an organic semiconductor device having the thin film as a component. In the formula (1), each E independently represents a sulfur or selenium atom, and R1 and R2 each independently represents a hydrogen atom, an optionally substituted C4-30 alkyl group, an optionally substituted C4-30 alkoxy group, an optionally substituted C6-30 aryl group, an optionally substituted C7-30 aralkyl group, an optionally substituted C4-30 heteroaryl group, an optionally substituted C5-30 heteroaralkyl group, or an optionally fluorinated C3-30 trialkylsilyl group, both R1 and R2 being not hydrogen atoms.

    摘要翻译: 提供了适合作为有机半导体材料的新化合物,该化合物是由式(1)表示的取代的苯并硫代辛烷化合物,包含该化合物的薄膜和具有该薄膜作为组分的有机半导体器件。 在式(1)中,每个E独立地表示硫或硒原子,并且R 1和R 2各自独立地表示氢原子,任选取代的C 4-30烷基,任选取代的C 4-30烷氧基,任选取代的C 6 -30芳基,任选取代的C 3-30芳烷基,任选取代的C 4-30杂芳基,任选取代的C 3-30杂芳烷基或任选氟化的C 3-30三烷基甲硅烷基,R 1和R 2不是氢原子 。

    Transition metal complexes, ligands, catalysts for olefin polymerization, and process for production of olefin polymers
    25.
    发明申请
    Transition metal complexes, ligands, catalysts for olefin polymerization, and process for production of olefin polymers 失效
    过渡金属配合物,配体,烯烃聚合用催化剂和烯烃聚合物生产方法

    公开(公告)号:US20060111525A1

    公开(公告)日:2006-05-25

    申请号:US11324260

    申请日:2006-01-04

    IPC分类号: C08F4/44

    摘要: A transition metal complex represented by the formula (1): wherein M is a Group 4 transition metal, A is a Group 16 element, B is a Group 14 element, n is an integer of 0 or 1, R1, R2, R3 and R4 may be the same or different and each independently denotes a substituent selected from the group consisting of the groups (I) and (II): group (I): hydrogen, alkyl and so on group (II): alkoxy, alkylthio and so on, provided that at least one of R1, R2, R3 and R4 is a substituent selected from group (II); R5, R6, R7, R8R9, R10, X1 and X2 may be the same or different and are each hydrogen, halogen, alkyl or the like; and a catalyst for olefin polymerization comprising said complex, an organoaluminum compound and a boron compound are provided.

    摘要翻译: 由式(1)表示的过渡金属络合物:其中M是第4族过渡金属,A是第16族元素,B是第14族元素,n是0或1的整数,R 1, R 2,R 3,R 4和R 4可以相同或不同,并且各自独立地表示选自以下的取代基: 的基团(I)和(II):基团(I):氢,烷基等基团(II):烷氧基,烷硫基等,条件是R 1, R 2,R 3和R 4是选自组(II)的取代基; R 5,R 6,R 7,R 8,R 9,R 9, X 1,X 1和X 2可以相同或不同,各自为氢,卤素,烷基等; 并提供包含所述络合物,有机铝化合物和硼化合物的烯烃聚合催化剂。

    SOI wafer, manufacturing method therefor, and MEMS device
    27.
    发明授权
    SOI wafer, manufacturing method therefor, and MEMS device 有权
    SOI晶片,其制造方法和MEMS器件

    公开(公告)号:US09212049B2

    公开(公告)日:2015-12-15

    申请号:US13743878

    申请日:2013-01-17

    摘要: In order to obtain a SOI wafer having an excellent ability of gettering metal impurities, an efficient method of manufacturing a SOI wafer, and a highly reliable MEMS device using such a SOI wafer, provided is a SOI wafer including: a support wafer (1) and an active layer wafer (6) which are bonded together with an oxide film (3) therebetween, each of the support wafer (1) and the active layer wafer (6) being a silicon wafer; a cavity (1b) formed in a bonding surface of at least one of the silicon wafers; and a gettering material (2) formed on a surface on a side opposite to the bonding surface.

    摘要翻译: 为了获得具有优异的金属杂质吸收能力的SOI晶片,提供了一种制造SOI晶片的有效方法和使用这种SOI晶片的高可靠性MEMS器件,其包括:支撑晶片(1) 以及与它们之间的氧化膜(3)结合在一起的有源层晶片(6),所述支撑晶片(1)和所述有源层晶片(6)中的每一个都是硅晶片; 形成在所述硅晶片中的至少一个的接合面中的空腔(1b) 以及形成在与所述接合面相反的一侧的表面上的吸气材料(2)。

    Transition metal complexes, ligands, catalysts for olefin polymerization, and process for production of olefin polymers
    28.
    发明授权
    Transition metal complexes, ligands, catalysts for olefin polymerization, and process for production of olefin polymers 失效
    过渡金属络合物,配体,烯烃聚合用催化剂和烯烃聚合物生产方法

    公开(公告)号:US07241927B2

    公开(公告)日:2007-07-10

    申请号:US11324260

    申请日:2006-01-04

    摘要: A transition metal complex represented by the formula (1): wherein M is a Group 4 transition metal, A is a Group 16 element, B is a Group 14 element, n is an integer of 0 or 1, R1, R2, R3 and R4 may be the same or different and each independently denotes a substituent selected from the group consisting of the groups (I) and (II): group (I): hydrogen, alkyl and so on, group (II): alkoxy, alkylthio and so on, provided that at least one of R1, R2, R3 and R4 is a substituent selected from group (II); R5, R6, R7, R8, R9, R10, X1 and X2 may be the same or different and are each hydrogen, halogen, alkyl or the like; and a catalyst for olefin polymerization comprising said complex, an organoaluminum compound and a boron compound are provided.

    摘要翻译: 由式(1)表示的过渡金属络合物:其中M是第4族过渡金属,A是第16族元素,B是第14族元素,n是0或1的整数,R 1, R 2,R 3,R 4和R 4可以相同或不同,并且各自独立地表示选自以下的取代基: 的基团(I)和(II):基团(I):氢,烷基等,基团(II):烷氧基,烷硫基等,条件是R 1, R 2,R 3和R 4是选自(II)组的取代基。 R 5,R 6,R 7,R 8,R 9, R 10,X 1和X 2可以相同或不同,各自为氢,卤素,烷基等; 并提供包含所述络合物,有机铝化合物和硼化合物的烯烃聚合催化剂。

    Acceleration sensor
    29.
    发明授权
    Acceleration sensor 有权
    加速度传感器

    公开(公告)号:US06955086B2

    公开(公告)日:2005-10-18

    申请号:US10739069

    申请日:2003-12-19

    IPC分类号: G01P15/125

    CPC分类号: G01P15/125

    摘要: An acceleration sensor includes first and second fixed electrodes on a substrate, and a movable electrode located above the first and second fixed electrodes, with respect to the substrate, and facing them. The movable electrode is elastically supported on the substrate by a first elastic supporting body and is movable. A mass, which is elastically supported on the substrate by a second elastic supporting body, moves in response to an acceleration in a direction perpendicular to the substrate. A linking portion links the movable electrode and the mass at a position spaced from an axis of movement of the movable electrode by a distance. Acceleration is measured based on changes in a first capacitance between the first fixed electrode and the movable electrode and a second capacitance between the second fixed electrode and the movable electrode. Thus, a highly impact resistant and highly reliable acceleration sensor is obtained.

    摘要翻译: 加速度传感器包括基板上的第一固定电极和第二固定电极以及相对于基板位于第一和第二固定电极上方并面向它们的可动电极。 可移动电极通过第一弹性支撑体弹性支撑在基板上并且可移动。 通过第二弹性支撑体弹性地支撑在基板上的质量响应于垂直于基板的方向的加速度而移动。 连接部分在与可移动电极的运动轴线间隔一定距离的位置处连接可移动电极和质量块。 基于第一固定电极和可动电极之间的第一电容的变化和第二固定电极与可动电极之间的第二电容来测量加速度。 因此,获得了高度耐冲击和高度可靠的加速度传感器。

    Pressure switch
    30.
    发明授权
    Pressure switch 有权
    压力开关

    公开(公告)号:US06194678B1

    公开(公告)日:2001-02-27

    申请号:US09567007

    申请日:2000-05-09

    IPC分类号: H01H3534

    CPC分类号: H01H1/0036 H01H35/34

    摘要: A pressure switch with improved sealing of an airtight chamber, and improved electrical characteristics reducing chattering, increasing response rate, and minimizing the pressure necessary for activation. The pressure switch includes an upper substrate with a diaphragm readily deformed by an applied stress, a lower substrate overlapped with the upper substrate to form the airtight chamber, a contact electrically switched in response to the deformation of the diaphragm, and a sealing member continuously surrounding the airtight chamber, disposed between the first and second substrate, and hermetically sealing the airtight chamber.

    摘要翻译: 具有改进的密封腔密封的压力开关,以及改善的电气特性,减少抖动,增加响应速度,并使活化所需的压力最小化。 压力开关包括具有通过施加的应力容易变形的膜片的上基板,与上基板重叠的下基板以形成气密室,响应于膜片的变形而电切换的触点和连续围绕的密封构件 所述密封室设置在所述第一和第二基板之间,并且气密地密封所述气密室。