Method of fabricating circuitized structures
    28.
    发明授权
    Method of fabricating circuitized structures 失效
    制造电路结构的方法

    公开(公告)号:US06528218B1

    公开(公告)日:2003-03-04

    申请号:US09808334

    申请日:2001-03-14

    Abstract: A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

    Abstract translation: 一种制造电路化基板的方法,其减少短路,并且不需要烘烤和得到的膜。 该方法使用溶剂含量小于约5%的光致成像电介质膜,当固化时玻璃化转变温度大于约110℃。提供具有约95%至约100的光致成像电介质膜 %固体,并且包含:0%至约30%的固体,颗粒状流变改性剂; 约70%至约100%的环氧树脂体系的固体(20℃的液体),包含:约85%至约99.9%的环氧树脂; 和约0.1至15份的总树脂重量,阳离子光引发剂; 0至约5%的溶剂; 将光致成像电介质膜施加到电路化基板上; 并将膜暴露于光化辐射。

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