公开(公告)号：US06655547B2

公开(公告)日：2003-12-02

申请号：US09924844

申请日：2001-08-09

申请人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

发明人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

IPC分类号： B65G4724

CPC分类号： H05K13/028

摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

公开(公告)号：US06290095B1

公开(公告)日：2001-09-18

申请号：US09571264

申请日：2000-05-15

申请人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

发明人： Koji Saito ,  Taro Yasuda ,  Hiroyuki Matsui

IPC分类号： B65H500

CPC分类号： H05K13/028

摘要： A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.

公开(公告)号：US06028076A

公开(公告)日：2000-02-22

申请号：US29076

申请日：1998-03-03

申请人： Kohsaku Hirota ,  Yoshiaki Isobe ,  Nobuyoshi Chiba ,  Harumi Satoh ,  Haruo Takaku ,  Hiroyuki Matsui ,  Haruhisa Ogita

发明人： Kohsaku Hirota ,  Yoshiaki Isobe ,  Nobuyoshi Chiba ,  Harumi Satoh ,  Haruo Takaku ,  Hiroyuki Matsui ,  Haruhisa Ogita

IPC分类号： C07D473/00 ,  C07D473/30 ,  C07D473/34 ,  A61K31/52 ,  C07D473/38

CPC分类号： C07D473/00 ,  C07D473/30 ,  C07D473/34

摘要： This invention relates to novel purine derivatives of formula (I): ##STR1## where R.sup.2 and R.sup.9 are hydrocarbon groups, R.sup.6 is an amino group and R.sup.8 is a hydroxyl, or acyloxy group. These purine derivatives are effective at promoting secretion of interferon in patients, and can be used to treat diseases against which interferon is effective.

摘要翻译： PCT No.PCT / JP97 / 02310 Sec。 371日期1998年3月3日 102（e）1998年3月3日PCT PCT 1997年7月3日PCT公布。 出版物WO98 / 01448 日本1998年1月15日本发明涉及式（I）的新型嘌呤衍生物：其中R2和R9为烃基，R6为氨基，R8为羟基或酰氧基。 这些嘌呤衍生物有效促进患者的干扰素分泌，并可用于治疗干扰素有效的疾病。

公开(公告)号：US5933506A

公开(公告)日：1999-08-03

申请号：US441988

申请日：1995-05-16

申请人： Shigeaki Aoki ,  Kazumasa Mitsuhashi ,  Yutaka Nishino ,  Kohichi Matsumoto ,  Chikara Yuse ,  Hiroyuki Matsui

发明人： Shigeaki Aoki ,  Kazumasa Mitsuhashi ,  Yutaka Nishino ,  Kohichi Matsumoto ,  Chikara Yuse ,  Hiroyuki Matsui

IPC分类号： H04R1/46 ,  H04R3/00 ,  H04R25/00

CPC分类号： H04R1/46 ,  H04R3/005 ,  H04R2460/13

摘要： Ear-piece type acoustic transducing part is provided with a bone-conducted sound pickup microphone for picking up a bone-conducted sound, a directional microphone for picking up an air-conducted sound and an electro-acoustic transducer for transducing a received speech signal to a received speech sound. A transmitting-receiving circuit connected to the acoustic transducing part includes: a low-pass filter which permits the passage therethrough of low-frequency components in a bone-conducted sound signal from the bone-conducted sound pickup microphone; a high-pass filter which permits the passage therethrough of high-frequency components in an air-conducted sound signal from the directional microphone; first and second variable loss circuits which impart losses to the outputs from the low-pass filter and the high-pass filter, respectively; a comparison/control circuit which compares the output levels of the low-pass filter and the high-pass filter with predetermined first and second reference levels, respectively, and based on the results of comparison, controls losses that are set in the first and second variable loss circuits; and a combining circuit which combines the outputs from the first and second variable loss circuits into a speech sending signal.

摘要翻译： 耳机式声学传感部件设置有用于拾取骨传导声音的骨传导拾音麦克风，用于拾取空气传导声音的定向麦克风和用于将接收到的语音信号转换的电声换能器 接收到的语音 连接到声学传感部分的发射接收电路包括：低通滤波器，其允许来自骨导声音传声器的骨传导声音信号中的低频分量的通过; 高通滤波器，其允许来自定向麦克风的空气传导声音信号中的高频分量的通过; 分别对来自低通滤波器和高通滤波器的输出赋予损耗的第一和第二可变损耗电路; 比较/控制电路，其分别将低通滤波器和高通滤波器的输出电平与预定的第一和第二参考电平进行比较，并且基于比较结果，控制在第一和第二参考电平中设置的损耗 可变损耗电路; 以及将来自第一和第二可变损耗电路的输出组合成语音发送信号的组合电路。

公开(公告)号：US5127330A

公开(公告)日：1992-07-07

申请号：US539333

申请日：1990-06-18

申请人： Satoshi Okazaki ,  Hiroyuki Matsui ,  Satoshi Takeuchi

发明人： Satoshi Okazaki ,  Hiroyuki Matsui ,  Satoshi Takeuchi

IPC分类号： B41M1/00 ,  B41M1/06 ,  B41M1/10 ,  H05K3/00

CPC分类号： B41M1/00 ,  B41M1/06 ,  B41M1/10 ,  H05K3/0079 ,  H05K2203/0537

摘要： For printing fine patterns, a fine pattern of a setting type ink is applied to a printing plate surface to become printing elements. Then, the setting type ink thus applied on the printing plate is subjected to a setting treatment thereby to set at least one part of the ink pattern, and thereafter the printing plate and an object to be printed are pressed relatively against each other thereby to transfer the ink pattern onto the print object. The printing plate can be an intaglio plate or a lithographic plate. Fine patterns of printing element widths as fine as 3 .mu.m with an ink film thickness of 2 .mu.m can be printed efficiently with the high precision on various objects including hard and rigid objects.

公开(公告)号：US08490857B2

公开(公告)日：2013-07-23

申请号：US13436843

申请日：2012-03-31

申请人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： B23K1/00 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。

公开(公告)号：US08302843B2

公开(公告)日：2012-11-06

申请号：US12412970

申请日：2009-03-27

申请人： Hiroyuki Matsui ,  Yutaka Makino ,  Yoshito Akutagawa

发明人： Hiroyuki Matsui ,  Yutaka Makino ,  Yoshito Akutagawa

IPC分类号： B23K31/02

CPC分类号： H01L21/67098 ,  H01L21/67115 ,  H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81012 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05599

摘要： A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

摘要翻译： 一种制造半导体器件的方法，包括：首先通过仅加热形成在半导体衬底的一个主表面上的电极上的凸起的上部来进行熔融; 并且还通过加热凸块的下部来熔化整个凸块。

公开(公告)号：US07888258B2

公开(公告)日：2011-02-15

申请号：US12143921

申请日：2008-06-23

申请人： Yoshito Akutagawa ,  Hiroyuki Matsui ,  Yutaka Makino

发明人： Yoshito Akutagawa ,  Hiroyuki Matsui ,  Yutaka Makino

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/13011 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00014

摘要： A forming method of an electrode includes the steps of providing an electrode material on a conductive part; exposing the electrode material at a temperature equal to or higher than a melting point of the electrode material in an oxidizing atmosphere; and exposing the melted electrode material, in a reducing atmosphere, at a temperature equal to or higher than the melting point of the electrode material and lower than the temperature at which the electrode material is exposed in the oxidizing atmosphere.

摘要翻译： 电极的形成方法包括以下步骤：在导电部件上提供电极材料; 在氧化气氛中，在电极材料的熔点以上的温度下使电极材料露出; 在还原性气氛中，在等于或高于电极材料的熔点的温度下暴露熔融的电极材料，并且低于在氧化气氛中电极材料暴露的温度。

公开(公告)号：US20090184156A1

公开(公告)日：2009-07-23

申请号：US12412970

申请日：2009-03-27

申请人： Hiroyuki Matsui ,  Yutaka Makino ,  Yoshito Akutagawa

发明人： Hiroyuki Matsui ,  Yutaka Makino ,  Yoshito Akutagawa

IPC分类号： B23K1/20 ,  B23K3/04 ,  B23K31/02

CPC分类号： H01L21/67098 ,  H01L21/67115 ,  H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81012 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05599

摘要： A process for producing a semiconductor device, includes: first melting by heating only a superior portion of a bump formed on an electrode on one principle surface of a semiconductor substrate; and second melting the entire bump by also heating an inferior portion of the bump.

摘要翻译： 一种制造半导体器件的方法，包括：首先通过仅加热形成在半导体衬底的一个主表面上的电极上的凸起的上部来进行熔融; 并且还通过加热凸块的下部来熔化整个凸块。

公开(公告)号：US20070099411A1

公开(公告)日：2007-05-03

申请号：US11361041

申请日：2006-02-24

申请人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

发明人： Hiroyuki Matsui ,  Hirohisa Matsuki ,  Koki Otake

IPC分类号： H01L21/44 ,  H01L21/00

CPC分类号： H01L24/11 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81011 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025

摘要： A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

摘要翻译： 公开了一种回流装置，其中使用甲酸清洗处理对象上的焊料电极的表面。 回流装置包括处理室，用于向处理室供给含有甲酸的气氛气体的甲酸引入机构，以及由对甲酸具有耐腐蚀性的材料制成的屏蔽构件。 屏蔽部件配置在处理室的回流处理部和处理室的内壁之间。 代替或除了屏蔽构件之外，回流装置可以包括用于分解残余甲酸的加热器。