公开(公告)号：US20110058771A1

公开(公告)日：2011-03-10

申请号：US12835246

申请日：2010-07-13

Applicant: Joon KI LEE ,  Sae-Kyoung Kang

Inventor： Joon KI LEE ,  Sae-Kyoung Kang

IPC: G02B6/32

CPC classification number: G02B6/4215 ,  G02B6/12009 ,  G02B6/29367 ,  G02B6/32

Abstract: A multi-wavelength optical transmitting module includes a housing, an optical output block, an optical transmitting block, and an optical multiplexer (MUX) block. The housing has a first coupling hole and a second coupling hole respectively formed in opposite surfaces thereof. The optical output block is coupled to the first coupling hole of the housing, is connected to an optical signal connector, and includes a first lens. The optical transmitting block is coupled to the second coupling hole of the housing and is connected to an electrical signal connector. In addition, the optical transmitting block includes a plurality of transmitting devices which respectively output light having different wavelengths and are arranged parallel to the optical output block, and a plurality of second lenses which are arranged on a light output side of the transmitting devices to correspond respectively to the transmitting devices. The optical multiplexer (MUX) block is disposed within the housing, multiplexes optical signals of multiple wavelengths, which were output from the transmitting devices and passed through the second is lenses, and transmits the multiplexed optical signals to the optical output block.

Abstract translation: 多波长光发射模块包括壳体，光输出块，光发射块和光复用器（MUX）块。 壳体具有分别形成在其相对表面中的第一联接孔和第二联接孔。 光输出块耦合到壳体的第一耦合孔，连接到光信号连接器，并且包括第一透镜。 光传输块联接到壳体的第二耦合孔并连接到电信号连接器。 此外，光发送块包括分别输出具有不同波长并且平行于光输出块的光的多个发送装置，以及布置在发送装置的光输出侧的多个第二透镜，以对应于 分别发送到发送设备。 光复用器（MUX）块设置在外壳内，复用从发送设备输出并通过第二个透镜的多个波长的光信号，并将复用的光信号发送到光输出块。

公开(公告)号：US20110026123A1

公开(公告)日：2011-02-03

申请号：US12773129

申请日：2010-05-04

Applicant: Joon-ki LEE ,  Sae-kyoung KANG ,  Jyung-chan LEE ,  Kwang-joon KIM

Inventor： Joon-ki LEE ,  Sae-kyoung KANG ,  Jyung-chan LEE ,  Kwang-joon KIM

IPC: G02B5/28

CPC classification number: G02B27/145 ,  G02B27/1006

Abstract: A wavelength-division apparatus and a wavelength combining apparatus are provided. Each of the wavelength-division apparatus and the wavelength combining apparatus includes a transparent block having one surface which is coated with an anti-reflective coating layer and the other surface which is coated with a partial transmitting coating layer. Each of the anti-reflective coating layer and the partial transmitting coating layer is coupled to a plurality of wavelength-selective filters that separate optical signals of different wavelengths through different paths other than a transmission path or a receiving path. Thus, the optical signals of the respective wavelengths output through the different paths can be used for various purposes such as monitoring the signal intensity and/or the signal quality.

Abstract translation: 提供了一种波分分割装置和波长组合装置。 波分分割装置和波长组合装置中的每一个包括具有一个表面的透明块，该表面涂覆有抗反射涂层，另一个表面涂覆有部分透射涂层。 抗反射涂层和部分透射涂层中的每一个耦合到多个波长选择滤光器，其通过除传输路径或接收路径之外的不同路径分离不同波长的光信号。 因此，通过不同路径输出的各个波长的光信号可以用于各种目的，例如监视信号强度和/或信号质量。

公开(公告)号：US20080107423A1

公开(公告)日：2008-05-08

申请号：US11935191

申请日：2007-11-05

Applicant: Joon Ki LEE ,  Jyung Chan Lee ,  Kwangjoon Kim

Inventor： Joon Ki LEE ,  Jyung Chan Lee ,  Kwangjoon Kim

IPC: H04B10/00

CPC classification number: H04B10/40 ,  H04L25/03343

Abstract: An optical transceiver which can effectively reduce optical output jitter when an error is made during designing and manufacturing of a printed circuit board (PCB), and a method of controlling optical output jitter using the optical transceiver are provided. The optical transceiver includes a transmitter unit including an equalizing (EQ) filter which can reduce jitter of a high speed electric signal; a control circuit which controls the EQ filter; a receiver unit which receives an optical signal; and a micro-controller which controls the transmitter unit and the receiver unit. Further included in the optical transceiver is an active type or passive type EQ filter and, in the case of the active type, the control circuit is used to control the filter, in order to compensate for high-frequency component of a high speed electric signal in the transmitter unit in order to reduce reflection or loss on the PCB, and thus deterministic optical output jitter occurring due to Inter-Symbol Interference (ISI) can be reduced.

Abstract translation: 提供了在印刷电路板（PCB）的设计和制造期间发生错误时有效降低光输出抖动的光收发器，以及使用该光收发器控制光输出抖动的方法。 光收发器包括一个发射单元，它包括均衡（EQ）滤波器，可以减少高速电信号的抖动; 控制EQ滤波器的控制电路; 接收单元，其接收光信号; 以及控制发射机单元和接收机单元的微控制器。 在光收发器中还包括有源型或无源型EQ滤波器，并且在有源类型的情况下，控制电路用于控制滤波器，以便补偿高速电信号的高频分量 在发射机单元中以减少PCB上的反射或损耗，因此可以减少由于符号间干扰（ISI）引起的确定性的光输出抖动。

公开(公告)号：US07167493B2

公开(公告)日：2007-01-23

申请号：US10897362

申请日：2004-07-21

Applicant: Jyung-Chan Lee ,  Joon-Ki Lee ,  Yun-Hee Cho ,  Seung-Il Myong ,  Youn-Seon Jang ,  Yool Kwon ,  Kwangjoon Kim ,  Moo-Jung Chu

Inventor： Jyung-Chan Lee ,  Joon-Ki Lee ,  Yun-Hee Cho ,  Seung-Il Myong ,  Youn-Seon Jang ,  Yool Kwon ,  Kwangjoon Kim ,  Moo-Jung Chu

IPC: H01S3/00 ,  H01S3/04 ,  H01S3/10 ,  H01S3/13 ,  H01S3/14

CPC classification number: H01S5/06804 ,  H01S5/02415 ,  H01S5/0265 ,  H01S5/042

Abstract: The present invention relates to a method for revising a wavelength of the EML by controlling a working temperature based on arithmetic functional relations between the DC-Offset voltage and the wavelength and between the working temperature and the wavelength, and a computer-readable recording medium thereof. The method includes the steps of: re-setting initial values of a working temperature, a amplifying voltage and the DC-Offset voltage; determining a wavelength with respect to the re-set DC-Offset voltage based on a functional relation between the DC-Offset voltage and the wavelength of the EML; and determining the revising working temperature for the determined wavelength based on the functional relation between the working temperature and the wavelength of the EML, and re-setting the working temperature with the revising working temperature.

Abstract translation: 本发明涉及一种通过基于DC偏移电压与波长之间以及工作温度和波长之间的算术函数关系来控制工作温度来修改EML的波长的方法及其计算机可读记录介质 。 该方法包括以下步骤：重新设定工作温度，放大电压和DC偏移电压的初始值; 基于所述DC偏移电压和所述EML的波长之间的函数关系来确定相对于所述重新设定的DC偏移电压的波长; 并根据工作温度和EML波长之间的功能关系确定确定波长的修正工作温度，并根据修改工作温度重新设定工作温度。

公开(公告)号：USD445797S1

公开(公告)日：2001-07-31

申请号：US29122561

申请日：2000-04-28

Applicant: Joon-Ki Lee ,  Ki-Won Choi ,  Young-Shin Kwon

Designer： Joon-Ki Lee ,  Ki-Won Choi ,  Young-Shin Kwon

公开(公告)号：US08540437B2

公开(公告)日：2013-09-24

申请号：US12835246

申请日：2010-07-13

Applicant: Joon Ki Lee ,  Sae-Kyoung Kang

Inventor： Joon Ki Lee ,  Sae-Kyoung Kang

IPC: G02B6/36 ,  G02B6/32

CPC classification number: G02B6/4215 ,  G02B6/12009 ,  G02B6/29367 ,  G02B6/32

Abstract: A multi-wavelength optical transmitting module includes a housing, an optical output block, an optical transmitting block, and an optical multiplexer (MUX) block. The optical output block is coupled to a first coupling hole of the housing and to an optical signal connector, and includes a first lens. The optical transmitting block is coupled to a second coupling hole of the housing and to an electrical signal connector. The optical transmitting block includes a plurality of transmitting devices which respectively output light having different wavelengths and are arranged parallel to the optical output block, and a plurality of second lenses which correspond respectively to the transmitting devices. The optical multiplexer (MUX) block multiplexes optical signals of multiple wavelengths, which were output from the transmitting devices and passed through the second lenses, and transmits the multiplexed optical signals to the optical output block.

Abstract translation: 多波长光发射模块包括壳体，光输出块，光发射块和光复用器（MUX）块。 光学输出块耦合到壳体的第一耦合孔和光信号连接器，并且包括第一透镜。 光传输块联接到壳体的第二耦合孔和电信号连接器。 光发送块包括分别输出具有不同波长并且平行于光输出块的光的多个发送装置和分别对应于发送装置的多个第二透镜。 光复用器（MUX）块复用从发送设备输出并通过第二透镜的多个波长的光信号，并将复用的光信号发送到光输出块。

公开(公告)号：US20120263917A1

公开(公告)日：2012-10-18

申请号：US13442371

申请日：2012-04-09

Applicant: Sae-Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH

Inventor： Sae-Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH

IPC: B32B3/10

CPC classification number: G02B6/4201 ,  Y10T428/24331

Abstract: There is provided an optical module having a top open can (TO-CAN) structure. The optical module having the TO-CAN structure includes a stem that accommodates an optical element or an electronic element therein, and a lead pin that is connected to the optical element or the electronic element through a hole of the stem, wherein the lead pin is bent in a “” shaped structure. Accordingly, the optical module with the TO-CAN structure may operate at high speed and be manufactured at low cost.

Abstract translation: 提供了具有顶部开罐（TO-CAN）结构的光学模块。 具有TO-CAN结构的光学模块包括容纳光学元件或电子元件的杆，以及通过杆的孔连接到光学元件或电子元件的引脚，其中引脚是 弯成成形结构。 因此，具有TO-CAN结构的光学模块可以高速运行并以低成本制造。

公开(公告)号：US20120235764A1

公开(公告)日：2012-09-20

申请号：US13365491

申请日：2012-02-03

Applicant: Sae Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH ,  Jyung Chan LEE

Inventor： Sae Kyoung KANG ,  Joon Ki LEE ,  Joon Young HUH ,  Jyung Chan LEE

IPC: H01P3/08 ,  H05K3/10 ,  H03H7/38

CPC classification number: H01P3/006 ,  H01P5/028 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/0253 ,  H05K1/147 ,  H05K2201/058 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/10121 ,  Y10T29/49155

Abstract: Disclosed is a structure for impedance matching by applying a CPW structure to an impedance discontinuous portion on a data signal line or using a micro-strip open stub so as to be used for high-speed transmission by a flexible PCB. According to the present invention, it is possible to fabricate a flexible PCB capable of performing low-priced and high-speed transmission.

Abstract translation: 公开了通过将CPW结构应用于数据信号线上的阻抗不连续部分或使用微带开路短截线来进行阻抗匹配的结构，以便用于通过柔性PCB的高速传输。 根据本发明，可以制造能够执行低价和高速传输的柔性PCB。

公开(公告)号：US07440700B2

公开(公告)日：2008-10-21

申请号：US11134202

申请日：2005-05-20

Applicant: Jyung Chan Lee ,  Joon Ki Lee ,  Hyun Jae Lee ,  Kwangjoon Kim

Inventor： Jyung Chan Lee ,  Joon Ki Lee ,  Hyun Jae Lee ,  Kwangjoon Kim

IPC: H04B10/00

CPC classification number: G01M11/00

Abstract: Provided is an apparatus for testing the performance of an optical transceiver by referencing various performance clocks provided by an OTU2 signal connection transceiver and an STM-64/OC-192 signal. The apparatus for testing performance of an optical transceiver includes: a transmitter/receiver reference clock selector for selecting one of various transmitter/receiver reference clocks provided by an STM-64/OC-192 connection optical transceiver or an OTN connection optical transceiver; a transmitter test reference clock selection switch for selecting a receiver data synchronous clock provided by the transceivers or the selected transmitter/receiver reference clock as a transmitter test reference clock; and a receiver test reference clock selection switch for selecting a transmitter supervisory clock provided by the transceivers or the selected transmitter/receiver reference clock as a receiver test reference clock.

Abstract translation: 提供了一种用于通过参考由OTU2信号连接收发器和STM-64 / OC-192信号提供的各种性能时钟来测试光收发器的性能的装置。 用于测试光收发器性能的装置包括：用于选择由STM-64 / OC-192连接光收发器或OTN连接光收发器提供的各种发射机/接收机参考时钟之一的发射机/接收机参考时钟选择器; 发射机测试参考时钟选择开关，用于选择由收发器或选定的发射机/接收机参考时钟提供的接收机数据同步时钟作为发射机测试参考时钟; 以及接收机测试参考时钟选择开关，用于选择由收发器或选定的发射机/接收机参考时钟提供的发射机监控时钟作为接收机测试参考时钟。

公开(公告)号：US06617700B2

公开(公告)日：2003-09-09

申请号：US09923669

申请日：2001-08-06

Applicant: Joon-Ki Lee ,  Young-Hee Song ,  Young-Shin Kwon

Inventor： Joon-Ki Lee ,  Young-Hee Song ,  Young-Shin Kwon

IPC: H01L2328

CPC classification number: H01L23/5382 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Disclosed are a repairable multi-chip package and a high-density memory card having the multi-chip package. The package includes a circuit substrate having bonding tips on a first surface and external contact pads on a second surface opposite to the first surface. The bonding tips and the external contact pads are electrically connected to each other. The package also includes at least two memory chips each mounted on the first surface and having chip pads thereon. The package includes electrically connecting members coupling each bonding tip to each chip pad, and an encapsulation layer covering the chips and the electrically connecting members. Particularly, the encapsulation layer is divided into two or more parts, and the bonding tips are partially embedded in and partially exposed out of the divided encapsulation layer. Accordingly, the exposed bonding tips can be selectively cut or re-connected for repairing the multi-chip package. Additionally, a high-density memory card having the package is also disclosed.