ESD protection device
    21.
    发明授权
    ESD protection device 有权
    ESD保护装置

    公开(公告)号:US07633735B2

    公开(公告)日:2009-12-15

    申请号:US12274391

    申请日:2008-11-20

    Applicant: Jun Urakawa

    Inventor: Jun Urakawa

    CPC classification number: H01T4/12

    Abstract: An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.

    Abstract translation: ESD保护装置包括陶瓷多层板,设置在陶瓷多层板中的空腔,至少一对放电电极具有端部,端部的边缘在空腔中以预定距离彼此相对,并且设置的外部电极 在陶瓷多层板的外表面上并连接到放电电极。 陶瓷多层基板包括复合部,该复合部配置在配置有放电电极的表面附近,并且至少配置成与放电电极的相对端相邻并且位于相对端之间的空间。 复合部分包括金属材料和陶瓷材料。

    ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREFOR
    23.
    发明申请
    ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREFOR 有权
    ESD保护装置及其制造方法

    公开(公告)号:US20120169452A1

    公开(公告)日:2012-07-05

    申请号:US13407790

    申请日:2012-02-29

    Abstract: An ESD protection device includes opposed electrodes in a ceramic base material and a discharge auxiliary electrode in contact with each of the opposed electrodes which is arranged so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, the discharge auxiliary electrode includes metallic particles, semiconductor particles, and a vitreous material, and bonding is provided through the vitreous material between the metallic particles, between the semiconductor particles, and between the metallic particles and the semiconductor particles. The metallic particles have an average particle diameter X of about 1.0 μm or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average particle diameter X of the metallic particles satisfies about 0.5≦Y/X≦ about 3.

    Abstract translation: ESD保护装置包括陶瓷基材中的相对电极和与每个相对电极接触的放电辅助电极,其布置成提供从一侧的相对电极到另一侧的相对电极的桥, 放电辅助电极包括金属颗粒,半导体颗粒和玻璃质材料,并且通过金属颗粒之间,半导体颗粒之间以及金属颗粒和半导体颗粒之间的玻璃质材料提供接合。 金属颗粒的平均粒径X为约1.0μm以上,放电辅助电极的厚度Y与金属粒子的平均粒径X之间的关系为约0.5< 1lE; Y / X& 约3。

    ESD PROTECTION DEVICE
    24.
    发明申请
    ESD PROTECTION DEVICE 有权
    ESD保护装置

    公开(公告)号:US20110227196A1

    公开(公告)日:2011-09-22

    申请号:US13153589

    申请日:2011-06-06

    CPC classification number: H01T4/12 H01T1/20

    Abstract: An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.

    Abstract translation: ESD保护装置包括陶瓷多层基板,至少一对放电电极,其设置在陶瓷多层基板中,并且彼此面对并形成有空间,外部电极设置在陶瓷多层基板的表面上,并与放电电极 。 ESD保护器件包括通过分散金属材料和半导体材料并且被布置在将一对放电电极彼此连接的区域中而获得的支撑电极。

    ESD PROTECTION DEVICE
    25.
    发明申请
    ESD PROTECTION DEVICE 有权
    ESD保护装置

    公开(公告)号:US20100309595A1

    公开(公告)日:2010-12-09

    申请号:US12846878

    申请日:2010-07-30

    CPC classification number: H01T1/20 H01T4/10 H01T4/12

    Abstract: An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

    Abstract translation: ESD保护器件具有允许ESD特性容易调节和稳定的结构。 ESD保护装置包括:陶瓷多层基板,位于陶瓷多层基板中的至少一对放电电极,并且彼此面对,并且位于陶瓷多层基板的表面上并与该放电 电极。 ESD保护装置包括设置在连接该对放电电极的区域中的支撑电极。 辅助电极由涂覆有无导电性的无机材料的导电材料制成。

    Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus
    27.
    发明授权
    Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus 有权
    绝缘厚膜组合物,使用其的陶瓷电子器件和电子设备

    公开(公告)号:US06452264B2

    公开(公告)日:2002-09-17

    申请号:US09798758

    申请日:2001-03-02

    Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

    Abstract translation: 提供了一种用于形成具有高位置精度的阻焊层的绝缘厚膜组合物,其可以抑制多层陶瓷基板的翘曲和起伏,并且可以保持其优异的电气特性。 绝缘厚膜组合物主要由具有与生陶瓷片中所含的粉末状陶瓷相同组成体系的粉末陶瓷组成,绝缘厚膜组合物的粉末状陶瓷的平均粒径小于 包含在绿色陶瓷体中的粉末状陶瓷。

    Substrate including an ESD protection function
    28.
    发明授权
    Substrate including an ESD protection function 有权
    基板包括ESD保护功能

    公开(公告)号:US08693157B2

    公开(公告)日:2014-04-08

    申请号:US12915119

    申请日:2010-10-29

    Abstract: A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.

    Abstract translation: 包括ESD保护功能的基板包括绝缘基板,电路元件或布线图案和ESD保护部分中的至少一个。 在ESD保护部中,至少一对放电电极的相对部分设置在设置在绝缘基板中的空腔中,使得端部彼此面对。 放电电极电连接到电路元件和/或布线图案。

    Electrically conductive paste and multilayer ceramic substrate
    29.
    发明授权
    Electrically conductive paste and multilayer ceramic substrate 有权
    导电胶和多层陶瓷基板

    公开(公告)号:US07569162B2

    公开(公告)日:2009-08-04

    申请号:US10576801

    申请日:2004-11-10

    Abstract: An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.

    Abstract translation: 提供了用于形成布线导体(例如设置在多层陶瓷基板上的通孔)的导电糊,其中可以相对最佳地控制在烧制步骤中进行烧结的温度范围。 导电糊包含金属粉末,玻璃料和有机载体。 在烧成工序中包含在多层陶瓷基板中的陶瓷层的烧结温度下不烧结的无机成分配置在金属粉末的粒子表面。 玻璃料的软化点比上述烧结温度低150℃〜300℃。

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