Abstract:
An ESD protection device includes a ceramic multilayer board, a cavity disposed in the ceramic multilayer board, at least one pair of discharge electrodes having ends, edges of the ends being opposed to each other at a predetermined distance in the cavity, and external electrodes disposed on outer surfaces the ceramic multilayer board and connected to the discharge electrodes. The ceramic multilayer board includes a composite portion, which is disposed in the vicinity of the surface on which the discharge electrodes are disposed and is at least disposed adjacent to the opposed ends of the discharge electrodes and to a space between the opposed ends. The composite portion includes a metal material and a ceramic material.
Abstract:
An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including a portion exposed in the cavity, the exposed portions being arranged to face each other, and external electrodes provided on a surface of the insulating substrate and connected to the at least one pair of discharge electrodes. A particulate supporting electrode material having conductivity is dispersed between the exposed portions of the at least one pair of discharge electrodes in the cavity.
Abstract:
An ESD protection device includes opposed electrodes in a ceramic base material and a discharge auxiliary electrode in contact with each of the opposed electrodes which is arranged so as to provide a bridge from the opposed electrode on one side to the opposed electrode on the other side, the discharge auxiliary electrode includes metallic particles, semiconductor particles, and a vitreous material, and bonding is provided through the vitreous material between the metallic particles, between the semiconductor particles, and between the metallic particles and the semiconductor particles. The metallic particles have an average particle diameter X of about 1.0 μm or more, and the relationship between the thickness Y of the discharge auxiliary electrode and the average particle diameter X of the metallic particles satisfies about 0.5≦Y/X≦ about 3.
Abstract translation:ESD保护装置包括陶瓷基材中的相对电极和与每个相对电极接触的放电辅助电极,其布置成提供从一侧的相对电极到另一侧的相对电极的桥, 放电辅助电极包括金属颗粒,半导体颗粒和玻璃质材料,并且通过金属颗粒之间,半导体颗粒之间以及金属颗粒和半导体颗粒之间的玻璃质材料提供接合。 金属颗粒的平均粒径X为约1.0μm以上,放电辅助电极的厚度Y与金属粒子的平均粒径X之间的关系为约0.5< 1lE; Y / X& 约3。
Abstract:
An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.
Abstract:
An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.
Abstract:
A glass ceramic composition is used for a multilayer ceramic substrate 2 including glass ceramic layers 3 laminated, the multilayer ceramic substrate 2 being used for a multilayer ceramic module 1. The glass ceramic composition includes a first ceramic powder mainly composed of forsterite, a second ceramic powder mainly composed of at least one component selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder containing Li2O, MgO, B2O3, SiO2, ZnO and Al2O3. The glass ceramic composition contains 3 percent by weight or more of the borosilicate glass powder and further contains at least one additive selected from the group consisting of CaO, BaO and SrO.
Abstract:
An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.
Abstract:
A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are disposed in a cavity provided in the insulating substrate so that the ends face each other. The discharge electrodes are electrically connected to the circuit elements and or the wiring pattern.
Abstract:
An electrically conductive paste used for forming wiring conductors, such as via holes disposed on a multilayer ceramic substrate, is provided, wherein the temperature range in which sintering is effected in a firing step can be controlled relatively optimally. The electrically conductive paste contains a metal powder, a glass frit, and an organic vehicle. An inorganic component, which is not sintered at a sintering temperature capable of sintering the ceramic layers included in the multilayer ceramic substrate in the firing step, is disposed on particle surfaces of the metal powder. The glass frit has a softening point 150° C. to 300° C. lower than the above-described sintering temperature.
Abstract:
A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.