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52 条记录 (耗时 0.018 秒)

    Optoelectronic Semiconductor Component
    22.
    发明申请
    Optoelectronic Semiconductor Component 有权
    光电半导体元件

    公开(公告)号：US20120161162A1

    公开(公告)日：2012-06-28

    申请号：US13146124

    申请日：2009-12-23

    申请人： Moritz Engl ,  Jörg Erich Sorg ,  Thomas Zeiler ,  Joachim Reill

    发明人： Moritz Engl ,  Jörg Erich Sorg ,  Thomas Zeiler ,  Joachim Reill

    IPC分类号： H01L33/58 ,  H01L33/50 ,  H01L25/075

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (2), arranged in a matrix-like manner, wherein the semiconductor chips (2) are applied on a common carrier (1), at least one converter element (3) disposed downstream of at least one semiconductor chip (2) for converting electromagnetic radiation emitted by the semiconductor chip (2), at least one scattering element (4) situated downstream of each semiconductor chip (2) and serving for diffusely scattering electromagnetic radiation emitted by the semiconductor chip (2), wherein the scattering element (4) is in direct contact with the converter element (3).

    摘要翻译： 规定了一种光电子半导体器件，其包括以矩阵状排列的多个辐射发射半导体芯片（2），其中半导体芯片（2）施加在公共载体（1）上，至少一个转换元件 （3），设置在用于转换由半导体芯片（2）发射的电磁辐射的至少一个半导体芯片（2）的下游，位于每个半导体芯片（2）下游的至少一个散射元件（4），用于漫射电磁 由半导体芯片（2）发射的辐射，其中散射元件（4）与转换器元件（3）直接接触。

    HOUSING FOR A LUMINESCENCE DIODE COMPONENT
    29.
    发明申请
    HOUSING FOR A LUMINESCENCE DIODE COMPONENT 审中-公开
    用于发光二极管组件的壳体

    公开(公告)号：US20090159912A1

    公开(公告)日：2009-06-25

    申请号：US12162161

    申请日：2007-01-24

    申请人： Moritz Engl ,  Joachim Reill ,  Martin Wüller ,  Lukas Schwenkschuster

    发明人： Moritz Engl ,  Joachim Reill ,  Martin Wüller ,  Lukas Schwenkschuster

    IPC分类号： H01L33/00

    CPC分类号： H01L33/58 ,  F21S41/14 ,  F21S41/16 ,  F21Y2115/10 ,  H01L33/505 ,  H01L51/5271 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00

    摘要： What is specified is a housing for a luminescence diode component comprising a housing cavity within which is arranged at least one chip mounting region for a luminescence diode chip and which has an output opening. In accordance with one embodiment, the housing has, at least at a vertical distance from the chip mounting region, inner walls which laterally bound the housing cavity and are at a maximum lateral distance of less than or equal to 500 μm from the chip mounting region. What is additionally specified is a housing in which the housing cavity has at least one partial region which is laterally covered by a housing material that laterally delimits the housing cavity. Moreover, a description is given of a luminescence diode component, in particular for a motor vehicle headlight.

    摘要翻译： 指定的是用于发光二极管部件的壳体，其包括壳体腔体，其中布置有用于发光二极管芯片的至少一个芯片安装区域，并具有输出开口。 根据一个实施例，壳体至少在与芯片安装区域垂直的距离处具有横向地限定壳体腔体并且处于与芯片安装区域小于或等于500μm的最大横向距离的内壁 。 额外规定的是壳体，其中壳体空腔具有至少一个部分区域，该局部区域由横向限定壳体空腔的壳体材料横向覆盖。 此外，给出了发光二极管部件的描述，特别是用于机动车辆前灯。