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公开(公告)号：US20130330791A1
公开(公告)日：2013-12-12
申请号：US13995079
申请日：2011-12-21
IPC分类号： C12P7/14
CPC分类号： C12F3/10 , A23K10/38 , A23K50/30 , A23K50/75 , C12C7/053 , C12N9/14 , C12N9/2402 , C12N9/2437 , C12N9/244 , C12N9/2482 , C12N9/2491 , C12P7/06 , C12P7/14 , C12Y302/01004 , C12Y302/01015 , Y02E50/17 , Y02P60/873
摘要： The present disclosure relates to an improved process of producing a fermentation product, in particular ethanol. The present disclosure relates also to the use of enzymes for improving the quality of by-products in the fermentative production process and to compositions comprising enzymes capable of degrading components in the fermented mash in the fermentation process.
摘要翻译： 本公开涉及生产发酵产物，特别是乙醇的改进方法。 本公开还涉及酶用于改善发酵生产过程中副产物质量的组合物，以及包含能够在发酵过程中发酵的糊状物中的成分降解的酶的组合物。
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公开(公告)号：US08373186B2
公开(公告)日：2013-02-12
申请号：US12677320
申请日：2008-08-28
申请人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
发明人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
IPC分类号： H01L33/58
CPC分类号： H01L33/60 , H01L33/44 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.
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公开(公告)号：US09243336B2
公开(公告)日：2016-01-26
申请号：US12448191
申请日：2008-01-30
摘要： In the case of a process for the manufacture of contact strips, in particular for electrolyzers (membrane cells), the objective is to provide a solution that allows to create a cheap but also extremely efficient method for the manufacture of such contact strips at a high electrical efficiency. This objective is achieved by applying the roll bonding method to attach a copper strip to a titanium strip.
摘要翻译： 在制造接触条的方法（特别是电解槽（膜电池））的情况下，目的是提供一种解决方案，其允许创造一种便宜而又非常有效的方法来制造高接触条 电效率。 该目的通过应用辊粘合方法将铜带连接到钛带来实现。
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公开(公告)号：US08461616B2
公开(公告)日：2013-06-11
申请号：US12995181
申请日：2009-04-20
申请人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
发明人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
IPC分类号： H01L31/048
CPC分类号： H01L33/54 , H01L25/042 , H01L25/0753 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00
摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。
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5.发明申请OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF 有权OPTO-ELECTRONIC SEMICONDUCTOR MODULLE AND METHOD FOR PRODUCTION THEREOF公开(公告)号：US20100230697A1
公开(公告)日：2010-09-16
申请号：US12673800
申请日：2008-08-11
申请人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
发明人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要翻译： 光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧， 并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。
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公开(公告)号：US20110266571A1
公开(公告)日：2011-11-03
申请号：US12995181
申请日：2009-04-20
申请人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
发明人： Thomas Zeiler , Reiner Windisch , Stefan Gruber , Markus Kirsch , Julius Muschaweck , Torsten Baade , Herbert Brunner , Steffen Köhler
IPC分类号： H01L33/58 , H01L31/0232
CPC分类号： H01L33/54 , H01L25/042 , H01L25/0753 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00
摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。
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公开(公告)号：US20100207148A1
公开(公告)日：2010-08-19
申请号：US12677320
申请日：2008-08-28
申请人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
发明人： Stefan Grötsch , Jan Marfeld , Jörg Erich Sorg , Moritz Engl , Steffen Köhler
IPC分类号： H01L33/58
CPC分类号： H01L33/60 , H01L33/44 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.
摘要翻译： 辐射发射部件包括具有发射电磁辐射的有源区的半导体层堆叠以及透射电磁辐射的半导体层堆叠或光学元件的至少一个表面，其中表面具有法向量，其中在 半导体层堆叠或电磁辐射通过的光学元件的至少一个表面，防反射层被布置成使得对于预定波长，其具有相对于第一电极的法向量的视角的最小反射 电磁辐射的带状光通量增加的表面大约为最大值。
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公开(公告)号：US20100012707A1
公开(公告)日：2010-01-21
申请号：US12448191
申请日：2008-01-30
摘要： In the case of a process for the manufacture of contact strips, in particular for electrolysers (membrane cells), the objective is to provide a solution that allows to create a cheap but also extremely efficient method for the manufacture of such contact strips at a high electrical efficiency.This objective is achieved by applying the roll bonding method to attach a copper strip to a titanium strip.
摘要翻译： 在制造接触片的方法的情况下，特别是用于电解槽（膜电池）的方法，目的是提供一种解决方案，其允许创造一种便宜但也是非常有效的方法来制造高接触条 电效率。 该目的通过应用辊粘合方法将铜带连接到钛带来实现。
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9.发明授权公开(公告)号：US09564555B2
公开(公告)日：2017-02-07
申请号：US12673800
申请日：2008-08-11
申请人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
发明人： Steffen Köhler , Moritz Engl , Frank Singer , Stefan Grötsch , Thomas Zeiler , Mathias Weiss
IPC分类号： B63B45/00 , H01L25/10 , H01L25/075 , H01L25/13 , H05B33/02 , F21V5/00 , H01L33/48 , H01L33/58 , H01L33/44 , H01L33/46 , H01L33/60
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0058 , H01L2924/00
摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.
摘要翻译： 光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧， 并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。
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公开(公告)号：US08962286B2
公开(公告)日：2015-02-24
申请号：US13995079
申请日：2011-12-21
CPC分类号： C12F3/10 , A23K10/38 , A23K50/30 , A23K50/75 , C12C7/053 , C12N9/14 , C12N9/2402 , C12N9/2437 , C12N9/244 , C12N9/2482 , C12N9/2491 , C12P7/06 , C12P7/14 , C12Y302/01004 , C12Y302/01015 , Y02E50/17 , Y02P60/873
摘要： The present disclosure relates to an improved process of producing a fermentation product, in particular ethanol. The present disclosure relates also to the use of enzymes for improving the quality of by-products in the fermentative production process and to compositions comprising enzymes capable of degrading components in the fermented mash in the fermentation process.
摘要翻译： 本公开涉及生产发酵产物，特别是乙醇的改进方法。 本公开还涉及酶用于改善发酵生产过程中副产物质量的组合物，以及包含能够在发酵过程中发酵的糊状物中的成分降解的酶的组合物。
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