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    Arrangement having at least two light-emitting semiconductor components and method for the production of such an arrangement
    3.
    发明授权
    Arrangement having at least two light-emitting semiconductor components and method for the production of such an arrangement 有权
    具有至少两个发光半导体元件的布置和用于制造这种布置的方法

    公开(公告)号：US08426875B2

    公开(公告)日：2013-04-23

    申请号：US12745249

    申请日：2008-11-18

    申请人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

    发明人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

    IPC分类号： H01L31/048

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

    摘要翻译： 具有彼此相邻布置的至少两个发光半导体部件（101,111）的布置具有在每种情况下至少部分地包围至少两个发光半导体部件的封套（102,112）。 信封包含转换器物质，其部分地或完全地转换由半导体元件发射的辐射的波长范围。 至少一个光学阻尼元件（103）被布置在所述至少两个发光半导体部件之间，所述至少两个发光半导体部件光学地隔离半导体部件的各个封套，以便减少从至少一个封套（102）到...的耦合 信封（112）中的至少一个，或者至少一个半导体部件（101）进入至少一个其它半导体部件（111）的外壳（112）中。

    Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement
    4.
    发明申请
    Arrangement Having at Least Two Light-Emitting Semiconductor Components and Method for the Production of Such an Arrangement 有权
    具有至少两个发光二极管组件的布置及其制造方法

    公开(公告)号：US20110186867A1

    公开(公告)日：2011-08-04

    申请号：US12745249

    申请日：2008-11-18

    申请人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

    发明人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

    IPC分类号： H01L27/15 ,  H01L33/50

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

    摘要翻译： 具有彼此相邻布置的至少两个发光半导体部件（101,111）的布置具有在每种情况下至少部分地包围至少两个发光半导体部件的封套（102,112）。 信封包含转换器物质，其部分地或完全地转换由半导体元件发射的辐射的波长范围。 至少一个光学阻尼元件（103）被布置在所述至少两个发光半导体部件之间，所述至少两个发光半导体部件光学地隔离半导体部件的各个封套，以便减少从至少一个封套（102）到...的耦合 信封（112）中的至少一个，或者至少一个半导体部件（101）进入至少一个其它半导体部件（111）的外壳（112）中。

    Semiconductor laser device
    5.
    发明授权
    Semiconductor laser device 有权
    半导体激光器件

    公开(公告)号：US08411715B2

    公开(公告)日：2013-04-02

    申请号：US12809677

    申请日：2008-11-19

    申请人： Frank Singer ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Roland Schulz

    发明人： Frank Singer ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Roland Schulz

    IPC分类号： H01S3/04 ,  H01S5/00

    CPC分类号： H01S5/02469 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/49175 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/06825 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/20755

    摘要： The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

    摘要翻译： 本发明涉及一种包括激光棒（2），柔性导体支撑（10），金属或金属合金的支撑体（3）和散热器（4）的半导体激光器件，其布置在 支撑体（3）和激光棒（2），激光棒（2）由柔性导体支撑件（10）和支撑体（3）电连接，厚度至少为2mm。 本发明还涉及一种用于制造上述半导体激光器件的方法，其中使用同步焊接工艺来通过硬焊料层（30）将激光棒（2）焊接到散热器（4），并且 通过另外的硬焊料层（31）将散热片（4）连接到支撑体（3）上。

    Monolithic, Optoelectronic Semiconductor Body and Method for the Production Thereof
    6.
    发明申请
    Monolithic, Optoelectronic Semiconductor Body and Method for the Production Thereof 有权
    单片，光电半导体及其制造方法

    公开(公告)号：US20110101390A1

    公开(公告)日：2011-05-05

    申请号：US12920317

    申请日：2009-02-25

    申请人： Karl Engl ,  Frank Singer ,  Patrick Rode ,  Lutz Hoppel ,  Martin Strassburg

    发明人： Karl Engl ,  Frank Singer ,  Patrick Rode ,  Lutz Hoppel ,  Martin Strassburg

    IPC分类号： H01L27/15 ,  H01L33/08

    CPC分类号： H01L27/156 ,  H01L33/08 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An optoelectronic semiconductor body comprises a semiconductor layer sequence which is subdivided into at least two electrically isolated subsegments. The semiconductor layer sequence has an active layer in each subarea. Furthermore, at least three electrical contact pads are provided. A first line level makes contact with a first of the at least two subsegments and with the first contact pad. A second line level makes contact with the second of the at least two subsegments and with a second contact pad. A third line level connects the two subsegments to one another and makes contact with the third contact pad. Furthermore, the line levels are each arranged opposite a first main face, wherein the first main face is intended to emit electromagnetic radiation that is produced.

    摘要翻译： 光电半导体主体包括半导体层序列，其被细分为至少两个电隔离的子区段。 半导体层序列在每个子区域中具有活性层。 此外，提供至少三个电接触垫。 第一线路级别与至少两个子片段中的第一个以及与第一接触焊盘接触。 第二线路级别与至少两个子段中的第二线路接触并且与第二接触焊盘接触。 第三线路电平将两个子段彼此连接并与第三接触焊盘接触。 此外，线路电平各自布置成与第一主面对置，其中第一主面面用于发射产生的电磁辐射。

    Optical sensing head and method for fabricating the sensing head
    7.
    发明授权
    Optical sensing head and method for fabricating the sensing head 有权
    光学感测头及其制造方法

    公开(公告)号：US07223952B2

    公开(公告)日：2007-05-29

    申请号：US10667717

    申请日：2003-09-22

    申请人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    发明人： Ulrich Steegmüller ,  Wolfgang Gramann ,  Frank Singer ,  Jürgen Dachs ,  Mathias Kämpf

    IPC分类号： G01B7/00

    CPC分类号： G11B7/1263 ,  G02B6/4214 ,  G11B7/123 ,  G11B7/22

    摘要： An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.

    摘要翻译： 用于读出光学数据存储器的光学检测头具有具有主表面的基板。 边缘发射激光器部件被构造在基板的主表面上，并具有基本上平行于第一主平面定向的照射轴。 偏转装置设置在基板的主表面上，并使激光辐射沿基本垂直于主表面的方向偏转。 提供至少一个信号检测器用于感测由光学数据存储器反射的激光辐射。 光学元件将偏转的激光辐射引导到光学数据存储器并将反射的激光辐射引导到信号检测器。 光学元件通过至少一个支撑元件连接到基板。 本发明还包括一种用于制造这种感测头的方法。

    Semiconductor Laser Device
    9.
    发明申请
    Semiconductor Laser Device 有权
    半导体激光器件

    公开(公告)号：US20110032962A1

    公开(公告)日：2011-02-10

    申请号：US12809677

    申请日：2008-11-19

    申请人： Frank Singer ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Roland Schulz

    发明人： Frank Singer ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Roland Schulz

    IPC分类号： H01S3/04 ,  H01L21/02

    CPC分类号： H01S5/02469 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/49175 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/06825 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/20755

    摘要： The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).

    摘要翻译： 本发明涉及一种包括激光棒（2），柔性导体支撑（10），金属或金属合金的支撑体（3）和散热器（4）的半导体激光器件，其布置在 支撑体（3）和激光棒（2），激光棒（2）由柔性导体支撑件（10）和支撑体（3）电连接，厚度至少为2mm。 本发明还涉及一种用于制造上述半导体激光器件的方法，其中使用同步焊接工艺来通过硬焊料层（30）将激光棒（2）焊接到散热器（4），并且 通过另外的硬焊料层（31）将散热片（4）连接到支撑体（3）上。

    Semiconductor laser component, optical device for a semiconductor laser component, and method for producing an optical device
    10.
    发明授权
    Semiconductor laser component, optical device for a semiconductor laser component, and method for producing an optical device 有权
    半导体激光元件，半导体激光元件用光学元件及光学元件的制造方法

    公开(公告)号：US07860144B2

    公开(公告)日：2010-12-28

    申请号：US11659065

    申请日：2005-06-24

    申请人： Michael Kühnelt ,  Thomas Schwarz ,  Frank Singer ,  Ulrich Steegmüller

    发明人： Michael Kühnelt ,  Thomas Schwarz ,  Frank Singer ,  Ulrich Steegmüller

    IPC分类号： H01S3/08

    CPC分类号： H01S5/14 ,  H01L2224/48091 ,  H01S3/0815 ,  H01S3/109 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/041 ,  H01S5/183 ,  H01L2924/00014

    摘要： A semiconductor laser component comprising a semiconductor laser chip (1) provided for generating radiation and an optical device comprising a carrier (7), a radiation deflecting element (8) arranged on the carrier and a mirror arranged on the carrier is proposed, wherein the mirror is formed as an external mirror (9) of an external optical resonator for the semiconductor laser chip (1), the radiation deflecting element is arranged within the resonator, the radiation deflecting element is formed for deflecting at least a portion of a radiation (13, 160) that is generated by the semiconductor laser chip (1) and reflected by the external mirror, the carrier has a lateral main extension direction, and the semiconductor laser chip (1) is disposed downstream of the carrier in a vertical direction with respect to the lateral main extension direction.

    摘要翻译： 提供了一种半导体激光器部件，其包括用于产生辐射的半导体激光器芯片（1）和包括载体（7），布置在载体上的辐射偏转元件（8）和布置在载体上的反射镜的光学装置， 反射镜被形成为用于半导体激光器芯片（1）的外部光学谐振器的外部反射镜（9），该辐射偏转元件被布置在谐振器内，该辐射偏转元件形成为用于偏转至少一部分辐射 由所述半导体激光器芯片（1）产生并由所述外部反射镜反射的所述载体具有侧向主延伸方向，并且所述半导体激光器芯片（1）沿垂直方向设置在所述载体的下游， 相对于侧向主延伸方向。