公开(公告)号：US06837417B2

公开(公告)日：2005-01-04

申请号：US10247112

申请日：2002-09-19

Applicant: Vasudevan Srinivasan

Inventor： Vasudevan Srinivasan

IPC: B23K20/02 ,  B23K31/02 ,  B23K31/00

CPC classification number: B23K20/023 ,  B23K2101/001 ,  F05B2230/211

Abstract: A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturing process. The green seal plate cap is inserted into the opening in the cast member and the cast member is subjected to iso-static pressing, which bonds the seal plate cap to the cast member and sinters the cap to form a solid seal.

Abstract translation: 一种密封浇铸构件中的开口的方法，其采用由在足够的压力下固结粉末金属和粘合剂的混合物而形成的绿色密封盖，以在叶片制造过程中为盖赋予足够的强度以保持其形状。 将绿色密封板帽插入铸造件的开口中，铸造件进行等静压，将密封板盖与铸件接合，并烧结盖形成固体密封。

公开(公告)号：US06528178B1

公开(公告)日：2003-03-04

申请号：US10024049

申请日：2001-12-17

Applicant: Vasudevan Srinivasan

Inventor： Vasudevan Srinivasan

IPC: B32B1500

CPC classification number: C23C28/3215 ,  C23C4/02 ,  C23C28/325 ,  C23C28/3455 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944

Abstract: A high temperature resistant article with improved protective coating bonding and method of manufacturing the article is provided. In one embodiment, the high temperature resistant article comprises a base body having a surface at least partly coated with an oxidation and corrosion protective coating containing a carbide forming element, wherein said base body is made from a metallic alloy having a medium carbon content and wherein the carbon content in a depth of 50 &mgr;m or deeper from said coated surface is less than 0.3% of said medium carbon content.

Abstract translation: 提供了具有改进的保护性涂层结合的耐高温制品和制造该制品的方法。 在一个实施例中，耐高温制品包括具有至少部分地涂覆有包含碳化物形成元件的氧化和腐蚀保护涂层的表面的基体，其中所述基体由具有中等碳含量的金属合金制成，并且其中 所述涂覆表面的深度为50μm或更深的碳含量小于所述中等碳含量的0.3％。

公开(公告)号：US20160216754A1

公开(公告)日：2016-07-28

申请号：US15089350

申请日：2016-04-01

Applicant: ERIC DISTEFANO ,  GUY M. THERIEN ,  VASUDEVAN SRINIVASAN ,  TAWFIK M. RAHAL-ARABI ,  VENKATESH RAMANI ,  RYAN D. WELLS ,  STEPHEN H. GUNTHER ,  JEREMY J. SHRALL ,  JAMES G. HERMERDING, II

Inventor： ERIC DISTEFANO ,  GUY M. THERIEN ,  VASUDEVAN SRINIVASAN ,  TAWFIK M. RAHAL-ARABI ,  VENKATESH RAMANI ,  RYAN D. WELLS ,  STEPHEN H. GUNTHER ,  JEREMY J. SHRALL ,  JAMES G. HERMERDING, II

IPC: G06F1/32

CPC classification number: G06F1/3234 ,  G06F1/206 ,  G06F1/26 ,  Y02D10/16

Abstract: A technique to change a thermal design power (TDP) value. In one embodiment, one or more environmental or user-driven changes may cause a processor's TDP value to be changed. Furthermore, in some embodiments a change in TDP may alter a turbo mode target frequency.

公开(公告)号：US08816539B2

公开(公告)日：2014-08-26

申请号：US12827656

申请日：2010-06-30

Applicant: James G. Hermerding, II ,  Jorge P. Rodriguez ,  Vasudevan Srinivasan

Inventor： James G. Hermerding, II ,  Jorge P. Rodriguez ,  Vasudevan Srinivasan

IPC: G05F3/06 ,  G06F1/00

CPC classification number: H02J7/34 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3234 ,  H02J7/0068 ,  Y02D10/16 ,  Y10T307/625

Abstract: Systems and methods of managing platform power consumption may involve determining a power consumption level of a platform based on at least in part a current supplied by an AC adaptor. A power limit of an integrated circuit in the platform can be determined based on at least in part the power consumption level of the platform, wherein the power level may be applied to the integrated circuit.

Abstract translation: 管理平台功耗的系统和方法可以包括至少部分地基于由AC适配器提供的电流来确定平台的功率消耗水平。 可以至少部分地基于平台的功率消耗水平来确定平台中的集成电路的功率限制，其中功率电平可以被施加到集成电路。

公开(公告)号：US20140189378A1

公开(公告)日：2014-07-03

申请号：US13730926

申请日：2012-12-29

Applicant: James G. Hermerding, II ,  Ramya Subramanian ,  Vasudevan Srinivasan

Inventor： James G. Hermerding, II ,  Ramya Subramanian ,  Vasudevan Srinivasan

IPC: G06F1/26

CPC classification number: G06F9/5094 ,  G06F1/206 ,  G06F1/3234 ,  Y02D10/16 ,  Y02D10/22

Abstract: Methods and apparatus relating to table driven multiple passive trip, platform passive thermal management are described. In one embodiment, the power consumption limit of one or more components of a platform is modified based on one or more thermal relationships between one or more power consuming components of the platform and one or more heat generating components of the platform. Furthermore, a first relationship of the one or more thermal relationships indicates a mapping between a plurality of temperature thresholds and a corresponding plurality of performance limits. Other embodiments are also claimed and disclosed.

Abstract translation: 描述了与桌面驱动多被动跳闸，平台被动热管理有关的方法和设备。 在一个实施例中，基于平台的一个或多个功耗部件与平台的一个或多个发热部件之间的一个或多个热关系来修改平台的一个或多个部件的功耗限制。 此外，一个或多个热关系的第一关系表示多个温度阈值与对应的多个性能极限之间的映射。 还要求和公开其它实施例。

公开(公告)号：US20140188302A1

公开(公告)日：2014-07-03

申请号：US13730240

申请日：2012-12-28

Applicant: Vasudevan Srinivasan ,  James G. Hermerding, II ,  Ramya Subramanian

Inventor： Vasudevan Srinivasan ,  James G. Hermerding, II ,  Ramya Subramanian

IPC: G05D23/19

CPC classification number: G05D23/19 ,  G06F1/206 ,  G06F1/3206 ,  Y02D10/16

Abstract: Methods and apparatus relating to priority based intelligent platform passive thermal management are described. In one embodiment, the power consumption limit of one or more components of a platform is modified based on one or more thermal relationships between one or more power consuming components of the platform and one or more heat generating components of the platform. Furthermore, a first relationship of the one or more thermal relationships indicates an influence priority of a source component of the platform on a target component of the platform. Other embodiments are also claimed and disclosed.

Abstract translation: 描述了基于优先级智能平台被动热管理的方法和设备。 在一个实施例中，基于平台的一个或多个功耗部件与平台的一个或多个发热部件之间的一个或多个热关系来修改平台的一个或多个部件的功耗限制。 此外，一个或多个热关系的第一关系表示平台的源组件对平台的目标部件的影响优先级。 还要求和公开其它实施例。

公开(公告)号：US20140173305A1

公开(公告)日：2014-06-19

申请号：US13715810

申请日：2012-12-14

Applicant: ALEXANDER B. UAN-ZO-LI ,  Jorge P. Rodriguez ,  PHILIP R. LEHWALDER ,  PATRICK K. LEUNG ,  James G. Hermerding, II ,  Vasudevan Srinivasan

Inventor： ALEXANDER B. UAN-ZO-LI ,  Jorge P. Rodriguez ,  PHILIP R. LEHWALDER ,  PATRICK K. LEUNG ,  James G. Hermerding, II ,  Vasudevan Srinivasan

IPC: G06F1/32

CPC classification number: G06F1/3296 ,  G06F1/28 ,  G06F1/3212 ,  Y02D10/172 ,  Y02D10/174

Abstract: An apparatus may include first circuitry coupled to one or more platform components, the first circuitry operative to receive an unfiltered input voltage signal, compare a first voltage level of the unfiltered input voltage signal to a first reference voltage level, and generate a control signal operative to lower operation power of one or more of the one or more platform components when the first voltage level is less than the first reference voltage level.

Abstract translation: 装置可以包括耦合到一个或多个平台组件的第一电路，第一电路可操作以接收未滤波的输入电压信号，将未滤波的输入电压信号的第一电压电平与第一参考电压电平进行比较，并产生操作的控制信号 以当所述第一电压电平小于所述第一参考电压电平时降低所述一个或多个平台组件中的一个或多个的操作功率。

公开(公告)号：US20120241140A1

公开(公告)日：2012-09-27

申请号：US13072488

申请日：2011-03-25

Applicant: Mark MacDonald ,  Vasudevan Srinivasan

Inventor： Mark MacDonald ,  Vasudevan Srinivasan

IPC: F28F27/00

CPC classification number: G06F1/206 ,  Y02D10/16

Abstract: Embodiments of an apparatus, system and method are described for monitoring an airflow and performing thermal management operations for a mobile computing device. An apparatus may comprise, for example, a heat generating component, an air mover, and a thermal management module to monitor one or more parameters of the air mover and to perform one or more thermal management operations based on one or more changes in the one or more parameters indicating one or more changes in an airflow for the apparatus. Other embodiments are described and claimed.

Abstract translation: 描述了用于监测气流并执行移动计算设备的热管理操作的设备，系统和方法的实施例。 装置可以包括例如发热部件，空气推动器和热管理模块，用于监视空气推进器的一个或多个参数，并且基于一个或多个变化来执行一个或多个热管理操作 或更多参数，其指示装置的气流中的一个或多个变化。 描述和要求保护其他实施例。

公开(公告)号：US20250004495A1

公开(公告)日：2025-01-02

申请号：US18765128

申请日：2024-07-05

Applicant: Vasudevan Srinivasan ,  Krishnakanth V. Sistla ,  Corey D. Gough ,  Ian M. Steiner ,  Nikhil Gupta ,  Vivek Garg ,  Ankush Varma ,  Sujal A. Vora ,  David P. Lerner ,  Joseph M. Sullivan ,  Nagasubramanian Gurumoorthy ,  William J. Bowhill ,  Venkatesh Ramamurthy ,  Chris MacNamara ,  John J. Browne ,  Ripan Das

Inventor： Vasudevan Srinivasan ,  Krishnakanth V. Sistla ,  Corey D. Gough ,  Ian M. Steiner ,  Nikhil Gupta ,  Vivek Garg ,  Ankush Varma ,  Sujal A. Vora ,  David P. Lerner ,  Joseph M. Sullivan ,  Nagasubramanian Gurumoorthy ,  William J. Bowhill ,  Venkatesh Ramamurthy ,  Chris MacNamara ,  John J. Browne ,  Ripan Das

IPC: G06F1/08 ,  G06F1/3203 ,  G06F1/324 ,  G06F9/30 ,  G06F9/455

Abstract: A processing device includes a plurality of processing cores, a control register, associated with a first processing core of the plurality of processing cores, to store a first base clock frequency value at which the first processing core is to run, and a power management circuit to receive a base clock frequency request comprising a second base clock frequency value, store the second base clock frequency value in the control register to cause the first processing core to run at the second base clock frequency value, and expose the second base clock frequency value on a hardware interface associated with the power management circuit.

公开(公告)号：US20160252942A1

公开(公告)日：2016-09-01

申请号：US14633438

申请日：2015-02-27

Applicant: Ankush Varma ,  Vasudevan Srinivasan ,  Eugene Gorbatov ,  Andrew D. Henroid ,  Barnes Cooper ,  David W. Browning ,  Guy M. Therien ,  Neil W. Songer ,  Krishnakanth V. Sistla ,  James G. Hermerding, II

Inventor： Ankush Varma ,  Vasudevan Srinivasan ,  Eugene Gorbatov ,  Andrew D. Henroid ,  Barnes Cooper ,  David W. Browning ,  Guy M. Therien ,  Neil W. Songer ,  Krishnakanth V. Sistla ,  James G. Hermerding, II

IPC: G06F1/26 ,  G06F1/20 ,  G06F1/32

CPC classification number: G06F1/263 ,  G06F1/206 ,  G06F1/3212 ,  G06F1/324 ,  G06F15/00 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/174

Abstract: In one embodiment, a system includes: a plurality of compute nodes to couple in a chassis; a first shared power supply to provide a baseline power level to the plurality of compute nodes; and an auxiliary power source to provide power to one or more of the plurality of compute nodes during operation at a higher power level than the baseline power level. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，系统包括：多个计算节点，用于耦合在机架中; 第一共享电源，用于向所述多个计算节点提供基线功率电平; 以及辅助电源，用于在比基线功率电平更高的功率电平的操作期间向多个计算节点中的一个或多个提供电力。 描述和要求保护其他实施例。