Techniques for adapting a color gamut
    21.
    发明申请
    Techniques for adapting a color gamut 有权
    适应色域的技术

    公开(公告)号:US20110157212A1

    公开(公告)日:2011-06-30

    申请号:US12655354

    申请日:2009-12-29

    IPC分类号: G09G5/02

    摘要: Techniques are described that can be used to provide color space conversion for images and video to a display color gamut space. Some techniques provide for accessing an sRGB gamut color table, determining a color conversion matrix based on the sRGB gamut color table and chromaticity values of RGBW primary and gamma stored in the display or associated with the display, applying color space conversion to the pixels for pixels using the color conversion matrix, and applying linear correction of pixels by applying a normalization factor to the color conversion matrix. In addition, some techniques provide analysis of content gamut with respect to display gamut in HSV space, adjustment in HSV space, and conversion back to RGB space before applying color space conversion.

    摘要翻译: 描述了可用于向显示色域空间提供图像和视频的颜色空间转换的技术。 一些技术提供访问sRGB色域颜色表,基于sRGB色域颜色表确定颜色转换矩阵,以及存储在显示器中或与显示器相关联的RGBW原始和伽马的色度值,将颜色空间转换应用于像素的像素 使用颜色转换矩阵,并通过将归一化因子应用于颜色转换矩阵来应用像素的线性校正。 此外,一些技术提供了在HSV空间中显示色域的内容色域分析,HSV空间调整,以及在应用颜色空间转换之前转换回RGB空间。

    Isolation in CMOSFET devices utilizing buried air bags
    26.
    发明授权
    Isolation in CMOSFET devices utilizing buried air bags 有权
    使用埋入式气囊的CMOSFET器件中的隔离

    公开(公告)号:US08395217B1

    公开(公告)日:2013-03-12

    申请号:US13283031

    申请日:2011-10-27

    IPC分类号: H01L27/12 H01L21/84

    摘要: A semiconductor device structure having an isolation region and method of manufacturing the same are provided. The semiconductor device structure includes a silicon-on-insulator (SOI) substrate. A plurality of gates is formed on the SOI substrate. The semiconductor device structure further includes trenches having sidewalls, formed between each of the plurality of gates. The semiconductor device structure further includes an epitaxial lateral growth layer formed in the trenches. The epitaxial lateral growth layer is grown laterally from the opposing sidewalls of the trenches, so that the epitaxial lateral growth layer encloses a portion of the trenches extended into the SOI substrate. The epitaxial lateral growth layer is formed in such way that it includes an air gap region overlying a buried dielectric layer of the SOI substrate.

    摘要翻译: 提供了具有隔离区域的半导体器件结构及其制造方法。 半导体器件结构包括绝缘体上硅(SOI)衬底。 在SOI衬底上形成多个栅极。 半导体器件结构还包括形成在多个栅极中的每一个之间的具有侧壁的沟槽。 半导体器件结构还包括形成在沟槽中的外延横向生长层。 外延横向生长层从沟槽的相对侧壁横向生长,使得外延横向生长层包围延伸到SOI衬底中的沟槽的一部分。 外延横向生长层以这样的方式形成,使得其包括覆盖SOI衬底的掩埋介电层的气隙区域。

    Method of forming deep trench capacitor
    27.
    发明授权
    Method of forming deep trench capacitor 有权
    形成深沟槽电容器的方法

    公开(公告)号:US08299515B2

    公开(公告)日:2012-10-30

    申请号:US13023047

    申请日:2011-02-08

    IPC分类号: H01L29/94

    CPC分类号: H01L29/66181

    摘要: Aspects of the invention provide for methods of forming a deep trench capacitor structure. In one embodiment, aspects of the invention include a method of forming a deep trench capacitor structure, including: forming a deep trench within a semiconductor substrate; depositing a first liner within the deep trench; filling a lower portion of the deep trench with a filler material; depositing a second liner within an upper portion of the deep trench; removing the filler material, such that the lower portion of the deep trench includes only the first liner and the upper portion of the deep trench includes the first liner and the second liner; forming a high doped region around the lower portion of the deep trench; and removing the first liner within the lower portion of the deep trench and the second liner within the upper portion of the deep trench.

    摘要翻译: 本发明的方面提供了形成深沟槽电容器结构的方法。 在一个实施例中,本发明的方面包括形成深沟槽电容器结构的方法,包括:在半导体衬底内形成深沟槽; 在所述深沟槽内沉积第一衬里; 用填充材料填充深沟槽的下部; 在所述深沟槽的上部中沉积第二衬垫; 去除填充材料,使得深沟槽的下部仅包括第一衬里,并且深沟槽的上部包括第一衬垫和第二衬垫; 在深沟槽的下部周围形成高掺杂区域; 以及在所述深沟槽的上部部分内移除所述深沟槽的下部内的所述第一衬垫和所述第二衬套。

    FET structures with trench implantation to improve back channel leakage and body resistance
    28.
    发明授权
    FET structures with trench implantation to improve back channel leakage and body resistance 有权
    具有沟槽注入的FET结构,以改善背沟道泄漏和体电阻

    公开(公告)号:US08236632B2

    公开(公告)日:2012-08-07

    申请号:US12899635

    申请日:2010-10-07

    摘要: An FET structure on a semiconductor substrate which includes forming recesses for a source and a drain of the gate structure on a semiconductor substrate, halo implanting regions through the bottom of the source and drain recesses, the halo implanted regions being underneath the gate stack, implanting junction butting at the bottom of the source and drain recesses, and filling the source and drain recesses with a doped epitaxial material. In exemplary embodiments, the semiconductor substrate is a semiconductor on insulator substrate including a semiconductor layer on a buried oxide layer. In exemplary embodiments, the junction butting and halo implanted regions are in contact with the buried oxide layer. In other exemplary embodiments, there is no junction butting. In exemplary embodiments, halo implants implanted to a lower part of the FET body underneath the gate structure provide higher doping level in lower part of the FET body to reduce body resistance, without interfering with FET threshold voltage.

    摘要翻译: 半导体衬底上的FET结构,其包括在半导体衬底上形成用于栅极结构的源极和漏极的凹槽,通过源极和漏极凹部的底部的晕圈注入区域,位于栅极叠层下方的晕圈注入区域,注入 在源极和漏极凹部的底部接合,并且用掺杂的外延材料填充源极和漏极凹部。 在示例性实施例中,半导体衬底是在掩埋氧化物层上包括半导体层的绝缘体上半导体衬底。 在示例性实施例中,接合对接和晕圈注入区域与掩埋氧化物层接触。 在其他示例性实施例中,没有接合对接。 在示例性实施例中,注入到栅极结构下面的FET体的下部的卤素注入在FET体的下部提供更高的掺杂水平,以降低体电阻,而不会干扰FET阈值电压。

    Forming implanted plates for high aspect ratio trenches using staged sacrificial layer removal
    29.
    发明授权
    Forming implanted plates for high aspect ratio trenches using staged sacrificial layer removal 失效
    使用分层牺牲层去除形成用于高纵横比沟槽的植入板

    公开(公告)号:US08232162B2

    公开(公告)日:2012-07-31

    申请号:US12880419

    申请日:2010-09-13

    IPC分类号: H01L21/8242

    CPC分类号: H01L29/66181 H01L27/1087

    摘要: A method of forming a deep trench structure for a semiconductor device includes forming a mask layer over a semiconductor substrate. An opening in the mask layer is formed by patterning the mask layer, and a deep trench is formed in the semiconductor substrate using the patterned opening in the mask layer. A sacrificial fill material is formed over the mask layer and into the deep trench. A first portion of the sacrificial fill material is recessed from the deep trench and a first dopant implant forms a first doped region in the semiconductor substrate. A second portion of the sacrificial fill material is recessed from the deep trench and a second dopant implant forms a second doped region in the semiconductor substrate, wherein the second doped region is formed underneath the first doped region such that the second doped region and the first doped region are contiguous with each other.

    摘要翻译: 形成半导体器件的深沟槽结构的方法包括在半导体衬底上形成掩模层。 通过对掩模层进行构图来形成掩模层中的开口,并且使用掩模层中的图案化开口在半导体衬底中形成深沟槽。 牺牲填充材料形成在掩模层上并进入深沟槽中。 牺牲填充材料的第一部分从深沟槽凹陷,并且第一掺杂剂注入在半导体衬底中形成第一掺杂区域。 牺牲填充材料的第二部分从深沟槽凹陷,并且第二掺杂剂注入在半导体衬底中形成第二掺杂区,其中第二掺杂区形成在第一掺杂区的下方,使得第二掺杂区和第一掺杂区 掺杂区域彼此邻接。

    FET STRUCTURES WITH TRENCH IMPLANTATION TO IMPROVE BACK CHANNEL LEAKAGE AND BODY RESISTANCE
    30.
    发明申请
    FET STRUCTURES WITH TRENCH IMPLANTATION TO IMPROVE BACK CHANNEL LEAKAGE AND BODY RESISTANCE 有权
    具有TRENCH植入的FET结构以提高反向通道泄漏和体电阻

    公开(公告)号:US20120187490A1

    公开(公告)日:2012-07-26

    申请号:US13426547

    申请日:2012-03-21

    IPC分类号: H01L29/78

    摘要: A field effect transistor (FET) structure on a semiconductor substrate which includes a gate structure having a spacer on a semiconductor substrate; an extension implant underneath the gate structure; a recessed source and a recessed drain filled with a doped epitaxial material; halo implanted regions adjacent a bottom of the recessed source and drain and being underneath the gate stack. In an exemplary embodiment, there is implanted junction butting underneath the bottom of each of the recessed source and drain, the junction butting being separate and distinct from the halo implanted regions. In another exemplary embodiment, the doped epitaxial material is graded from a lower dopant concentration at a side of the recessed source and drain to a higher dopant concentration at a center of the recessed source and drain. In a further exemplary embodiment, the semiconductor substrate is a semiconductor on insulator substrate.

    摘要翻译: 一种半导体衬底上的场效应晶体管(FET)结构,其包括在半导体衬底上具有间隔物的栅极结构; 栅极结构下面的延伸植入物; 凹陷的源极和填充有掺杂的外延材料的凹陷的漏极; 邻近凹陷源的底部的卤素注入区域和漏极并位于栅极叠层下方。 在示例性实施例中,在凹陷源和漏极中的每一个的底部下方注入结合对接,该接合部分与光晕注入区域分开且不同。 在另一个示例性实施例中,掺杂的外延材料从凹陷源的一侧的较低掺杂剂浓度和漏极分级到凹陷源极和漏极的中心处的较高掺杂剂浓度。 在另一示例性实施例中,半导体衬底是绝缘体上半导体衬底。