公开(公告)号：US20100224492A1

公开(公告)日：2010-09-09

申请号：US12718609

申请日：2010-03-05

Applicant: Yuanpang Samuel Ding ,  Ying-Cheng Lo ,  Joshua James Miller ,  Justin Rohde ,  Sujatha Karoor

Inventor： Yuanpang Samuel Ding ,  Ying-Cheng Lo ,  Joshua James Miller ,  Justin Rohde ,  Sujatha Karoor

IPC: B01D61/44

CPC classification number: A61M1/1696 ,  A61M1/1674 ,  A61M1/28 ,  A61M1/284 ,  A61M1/287 ,  A61M2202/0014 ,  B01D61/243 ,  B01D61/44 ,  B01D61/58

Abstract: Systems and methods for hemodialysis or peritoneal dialysis having integrated electrodeionization capabilities are provided. In an embodiment, the dialysis system includes a carbon source, a urease source and an electrodeionization unit. The carbon source and urease source can be in the form of removable cartridges.

Abstract translation: 提供了具有集成的电去离子能力的用于血液透析或腹膜透析的系统和方法。 在一个实施方案中，透析系统包括碳源，脲酶源和电去离子单元。 碳源和脲酶源可以是可移除的盒的形式。

公开(公告)号：US07731318B2

公开(公告)日：2010-06-08

申请号：US12039568

申请日：2008-02-28

Applicant: Chi-Shi Liu ,  Chih-Yi Lai ,  Chun-Ying Cheng

Inventor： Chi-Shi Liu ,  Chih-Yi Lai ,  Chun-Ying Cheng

IPC: B41J29/38

CPC classification number: B41J2/175 ,  B41J2/17596

Abstract: A pneumatic ink-jet system is applied in an inkjet printer and uses a negative pressure generator, which is designed according to the Bernoulli's Theory, with a stable airflow in a certain speed to generated stable pressure inside at least one inkpot and at least one print head. Therefore, the at least one print head is kept in an appropriate wet state and the quality of printing is enhanced. Moreover, a top surface of the ink inside the at least one inkpot can be controlled to be higher than the at least one print head, so the pneumatic ink-jet system can be applied in a large format inkjet printer.

Abstract translation: 气动喷墨系统应用在喷墨打印机中，并使用根据伯努利理论设计的负压发生器，以一定的速度具有稳定的气流，以在至少一个墨水罐内产生稳定的压力，并且至少一个打印 头。 因此，至少一个打印头保持在适当的湿润状态，并提高打印质量。 此外，可以将至少一个墨水罐内的墨水的顶面控制为高于至少一个打印头，因此气动喷墨系统可以应用于大型喷墨打印机。

公开(公告)号：US07619707B2

公开(公告)日：2009-11-17

申请号：US11604362

申请日：2006-11-27

Applicant: Wen-Chun Wang ,  Chian-Chang Lee ,  Chin-Chang Liu ,  Ying-Cheng Tsai ,  Yi-Lin Chou

Inventor： Wen-Chun Wang ,  Chian-Chang Lee ,  Chin-Chang Liu ,  Ying-Cheng Tsai ,  Yi-Lin Chou

IPC: G02F1/1337

CPC classification number: G02F1/134363 ,  G02F1/133707 ,  G02F1/136227 ,  G02F1/1393 ,  G02F2001/134318 ,  G02F2001/134372 ,  G02F2001/134381 ,  G02F2201/121

Abstract: A multi-domain liquid crystal display includes a first and a second substrates, and a liquid crystal layer is interposed between the first and the second substrates. A first common electrode is formed on an entire surface of the first substrate. A first dielectric layer is formed on the second substrate and covers first signal lines, and a second dielectric layer is formed on the first dielectric layer and covers second signal lines. A plurality of pixel electrodes are formed on the second dielectric layer, and a plurality of second common electrodes are formed on the second substrate, where a voltage difference existing between the second common electrodes and the pixel electrode produces fringe fields.

Abstract translation: 多域液晶显示器包括第一和第二基板，并且液晶层插入在第一和第二基板之间。 第一公共电极形成在第一基板的整个表面上。 第一介电层形成在第二基板上并覆盖第一信号线，第二电介质层形成在第一电介质层上并覆盖第二信号线。 在第二电介质层上形成多个像素电极，在第二基板上形成多个第二公共电极，第二公共电极和像素电极之间的电压差产生边缘场。

公开(公告)号：US20090280283A1

公开(公告)日：2009-11-12

申请号：US12249844

申请日：2008-10-10

Applicant: QIAN-LONG LIAO ,  XIAO-YING CHENG

Inventor： QIAN-LONG LIAO ,  XIAO-YING CHENG

IPC: B32B3/16 ,  B05D3/12

CPC classification number: B65D81/02 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/149 ,  Y10T428/15 ,  Y10T428/24314 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/2486 ,  Y10T428/2839

Abstract: An exemplary protecting film for coating a three-dimensional surface of a workpiece, includes an adhesive layer and a release layer. The adhesive layer defines a split. The release layer includes a remaining portion for shielding the split of the adhesive layer and a release portion detachably formed on the adhesive layer. The remaining portion is capable of remaining on the adhesive layer after the release portion detaches from the adhesive layer. A method for coating a protecting film on a workpiece is also provided.

Abstract translation: 用于涂覆工件的三维表面的示例性保护膜包括粘合剂层和剥离层。 粘合剂层限定了裂缝。 剥离层包括用于屏蔽粘合剂层的分离的剩余部分和可拆卸地形成在粘合剂层上的释放部分。 剩余部分能够在释放部分从粘合剂层分离之后残留在粘合剂层上。 还提供了一种在工件上涂覆保护膜的方法。

公开(公告)号：US20090262226A1

公开(公告)日：2009-10-22

申请号：US12173002

申请日：2008-07-14

Applicant: CHI-KUEI LEE ,  YING-CHENG WU

Inventor： CHI-KUEI LEE ,  YING-CHENG WU

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L25/043 ,  H01L25/0657 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.

Abstract translation: 图像传感器封装包括第一基板，图像传感器芯片，处理芯片和多个无源元件。 第一基板具有支撑表面和与支撑表面相对的底表面。 图像传感器芯片设置在支撑表面上并电连接到第一基板。 图像传感器芯片封装还包括第二基板。 处理芯片和无源元件安装在第二基板上并电连接到第二基板。 第一基板的底表面限定用于接收第二基板，处理芯片和其中的无源元件的空腔。

公开(公告)号：US20090166833A1

公开(公告)日：2009-07-02

申请号：US12061914

申请日：2008-04-03

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/0052 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively.

Abstract translation: 半导体单元包括接口板，与接口板一体形成的支撑板，位于支撑板的相对侧的两个芯片封装，以及分别与芯片封装相连接的界面板和支撑板中的导线。

公开(公告)号：US07538862B2

公开(公告)日：2009-05-26

申请号：US11592768

申请日：2006-11-03

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Yuan-Po Wang

IPC: G01N21/00

CPC classification number: H04N17/002

Abstract: A testing system (200) for digital camera modules (100) includes a first testing module (50), an assembling mechanism (60), a focusing module (62), a second testing module (70), a carrying mechanism (80), and a main processor (90). The carrying mechanism supports and transports subassemblies of the digital camera modules and the digital camera modules between the first testing module, the assembling mechanism, the focusing module and the second testing module. The first testing module, the assembling mechanism, the focusing module, the carrying mechanism, and the second testing module are all electronically connected with the main processor.

Abstract translation: 一种用于数字照相机模块（100）的测试系统（200）包括第一测试模块（50），组装机构（60），聚焦模块（62），第二测试模块（70） ，以及主处理器（90）。 携带机构在第一测试模块，组装机构，聚焦模块和第二测试模块之间支撑和传送数字照相机模块和数字照相机模块的子组件。 第一测试模块，组装机构，聚焦模块，承载机构和第二测试模块都与主处理器电连接。

公开(公告)号：US20080283895A1

公开(公告)日：2008-11-20

申请号：US11953882

申请日：2007-12-11

Applicant: Ching-Nan Hsiao ,  Ying-Cheng Chuang

Inventor： Ching-Nan Hsiao ,  Ying-Cheng Chuang

IPC: H01L29/00 ,  H01L21/425

CPC classification number: H01L27/115 ,  H01L27/11521

Abstract: A memory structure including a substrate, dielectric patterns, spacer patterns, a first dielectric layer, a conductor pattern, a second dielectric layer and doped regions is described. The dielectric patterns are disposed on the substrate. The spacer patterns are disposed on each sidewall of each of the dielectric patterns respectively. The first dielectric layer is disposed between the spacer patterns and the substrate. The conductor pattern is disposed on the substrate and covers the spacer patterns. The second dielectric layer is disposed between the spacer patterns and the conductor pattern. The doped regions are disposed in the substrate under each of the dielectric patterns respectively.

Abstract translation: 描述了包括衬底，电介质图案，间隔物图案，第一介电层，导体图案，第二电介质层和掺杂区域的存储器结构。 电介质图案设置在基板上。 间隔图案分别设置在每个电介质图案的每个侧壁上。 第一介电层设置在间隔物图案和基板之间。 导体图案设置在基板上并覆盖间隔图案。 第二电介质层设置在间隔物图案和导体图案之间。 掺杂区域分别设置在每个电介质图案下的衬底中。

公开(公告)号：US20080252760A1

公开(公告)日：2008-10-16

申请号：US11871925

申请日：2007-10-12

Applicant: YING-CHENG WU

Inventor： YING-CHENG WU

IPC: H04N5/335

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area with the bonding layer. The imaging lens is configured for forming images on the photosensitive area. The present invention also relates to a method for manufacturing the image sensor package.

Abstract translation: 示例性图像传感器封装包括基底，图像传感器芯片，结合层和成像透镜。 图像传感器芯片设置在基座上。 图像传感器芯片包括感光区域。 接合层设置在图像传感器芯片和基底中的至少一个上。 接合焊盘围绕感光区域。 将成像透镜粘附到粘合层上并用粘合层密封光敏区域。 成像透镜被配置用于在光敏区域上形成图像。 本发明还涉及图像传感器封装的制造方法。

公开(公告)号：US20080203512A1

公开(公告)日：2008-08-28

申请号：US12151369

申请日：2008-05-06

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L31/0203

CPC classification number: H04N5/2253 ,  G02B7/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73265 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: A chip package includes a carrier (32), an image sensor chip (34), a plurality of wires (36), an adhesive means (3262) and a transparent cover (38). The carrier has a cavity (321) therein. The image sensor chip is received in the cavity, and the image sensor has a photosensitive area (344). Each wire electronically connects the image sensor chip and the carrier. The adhesive means is applied to the image sensor chip around the photosensitive area and covers at least one portion of all the wires adjacent to the photosensitive area. The adhesive means surrounds an enclosing body (3264) around the photosensitive area. The transparent cover is mounted to the carrier, and the cover is adhered to the carrier with the adhesive means. The cover with the enclosing body defines a sealing space (37) for enclosing the photosensitive area of the image sensor chip therein.

Abstract translation: 芯片封装包括载体（32），图像传感器芯片（34），多个导线（36），粘合装置（3262）和透明盖（38）。 载体在其中具有空腔（321）。 图像传感器芯片被接收在空腔中，并且图像传感器具有感光区域（344）。 每条线电子连接图像传感器芯片和载体。 粘合装置被施加到感光区周围的图像传感器芯片上，并且覆盖与感光区域相邻的所有导线的至少一部分。 粘合剂包围围绕光敏区域的封闭体（3264）。 透明盖安装在托架上，盖子用粘合剂粘合到托架上。 具有封闭体的盖限定用于将图像传感器芯片的感光区域包围在其中的密封空间（37）。