公开(公告)号：US20090262226A1

公开(公告)日：2009-10-22

申请号：US12173002

申请日：2008-07-14

Applicant: CHI-KUEI LEE ,  YING-CHENG WU

Inventor： CHI-KUEI LEE ,  YING-CHENG WU

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H01L27/14618 ,  H01L25/043 ,  H01L25/0657 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.

Abstract translation: 图像传感器封装包括第一基板，图像传感器芯片，处理芯片和多个无源元件。 第一基板具有支撑表面和与支撑表面相对的底表面。 图像传感器芯片设置在支撑表面上并电连接到第一基板。 图像传感器芯片封装还包括第二基板。 处理芯片和无源元件安装在第二基板上并电连接到第二基板。 第一基板的底表面限定用于接收第二基板，处理芯片和其中的无源元件的空腔。

公开(公告)号：US20090166833A1

公开(公告)日：2009-07-02

申请号：US12061914

申请日：2008-04-03

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  MENG-LUNG YU ,  SHIH-MIN LO

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/50 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/0052 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively.

Abstract translation: 半导体单元包括接口板，与接口板一体形成的支撑板，位于支撑板的相对侧的两个芯片封装，以及分别与芯片封装相连接的界面板和支撑板中的导线。

公开(公告)号：US20080252760A1

公开(公告)日：2008-10-16

申请号：US11871925

申请日：2007-10-12

Applicant: YING-CHENG WU

Inventor： YING-CHENG WU

IPC: H04N5/335

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area with the bonding layer. The imaging lens is configured for forming images on the photosensitive area. The present invention also relates to a method for manufacturing the image sensor package.

Abstract translation: 示例性图像传感器封装包括基底，图像传感器芯片，结合层和成像透镜。 图像传感器芯片设置在基座上。 图像传感器芯片包括感光区域。 接合层设置在图像传感器芯片和基底中的至少一个上。 接合焊盘围绕感光区域。 将成像透镜粘附到粘合层上并用粘合层密封光敏区域。 成像透镜被配置用于在光敏区域上形成图像。 本发明还涉及图像传感器封装的制造方法。

公开(公告)号：US20080265350A1

公开(公告)日：2008-10-30

申请号：US11862510

申请日：2007-09-27

Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

IPC: H01L31/0232

CPC classification number: H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an insulative layer, and an image sensor. The substrate has a surface facing an object side of the image capturing device, the surface defines a cavity therein. The at least one passive component is disposed within the cavity and electrically connected to the substrate. The insulative layer is received in the cavity and encases the at least one passive component. The image sensor is disposed on the insulative layer and electrically connected to the substrate. The holder has an end connecting with the barrel and an opposite end secured on the substrate.

Abstract translation: 图像捕获装置包括图像传感器封装和与图像传感器封装件对准的透镜模块。 图像传感器封装包括衬底，至少一个无源部件，绝缘层和图像传感器。 基板具有面向图像捕获装置的物体侧的表面，该表面在其中限定空腔。 所述至少一个无源部件设置在所述腔体内并电连接到所述基板。 绝缘层被接收在空腔中并且包围至少一个无源部件。 图像传感器设置在绝缘层上并与衬底电连接。 保持器具有与筒连接的端部，并且相对端固定在基底上。

公开(公告)号：US20080252771A1

公开(公告)日：2008-10-16

申请号：US11871923

申请日：2007-10-12

Applicant: YING-CHENG WU

Inventor： YING-CHENG WU

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  H04N5/2257

Abstract: An exemplary camera module includes a lens module, a base, an image sensor chip, a bonding layer, and an imaging lens. The lens module is disposed on the base. The lens module is optically aligned with the image sensor chip. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area. The imaging lens is configured for focusing light signals onto the photosensitive area. The present invention also relates to a method for manufacturing the camera module.

Abstract translation: 示例性相机模块包括透镜模块，底座，图像传感器芯片，粘结层和成像透镜。 透镜模块设置在基座上。 镜头模块与图像传感器芯片光学对准。 图像传感器芯片设置在基座上。 图像传感器芯片包括感光区域。 接合层设置在图像传感器芯片和基底中的至少一个上。 接合焊盘围绕感光区域。 成像透镜粘附到粘合层上并气密地密封感光区域。 成像透镜被配置为将光信号聚焦到感光区域上。 本发明还涉及一种用于制造相机模块的方法。

公开(公告)号：US20080100934A1

公开(公告)日：2008-05-01

申请号：US11682275

申请日：2007-03-05

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

IPC: G02B7/02

CPC classification number: G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

Abstract translation: 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

公开(公告)号：US20130026589A1

公开(公告)日：2013-01-31

申请号：US13243800

申请日：2011-09-23

Applicant: YING-CHENG WU ,  KANG-WEI LEE

Inventor： YING-CHENG WU ,  KANG-WEI LEE

IPC: H01L31/0232 ,  H01L31/18

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A miniaturization active sensing module includes a substrate unit, an active sensing unit, and an optical unit. The substrate unit includes a substrate body, a plurality of first bottom conductive pads disposed on the bottom side of the substrate body, and a plurality of first conductive tracks embedded in the substrate body. The substrate body has at least one first groove formed therein. The active sensing unit includes at least one active sensing chip embedded in the first groove. The active sensing chip has at least one active sensing area and a plurality of electric conduction pads disposed on the top side thereof, and each first conductive track has two ends electrically contacted by one electric conduction pad and one first bottom conductive pad, respectively. The optical unit includes at least one optical element, disposed on the substrate body, for protecting the active sensing area.

Abstract translation: 小型化主动感测模块包括基板单元，主动感测单元和光学单元。 基板单元包括基板主体，设置在基板主体的底侧上的多个第一底部导电焊盘以及嵌入基板主体中的多个第一导电轨迹。 衬底主体具有形成在其中的至少一个第一凹槽。 主动感测单元包括嵌入第一凹槽中的至少一个主动感测芯片。 主动感测芯片具有至少一个有源感测区域和设置在其顶侧上的多个导电焊盘，并且每个第一导电轨道具有分别由一个导电焊盘和一个第一底部导电焊盘电接触的两个端部。 光学单元包括设置在基板主体上的至少一个光学元件，用于保护主动感测区域。

公开(公告)号：US20090267206A1

公开(公告)日：2009-10-29

申请号：US12192083

申请日：2008-08-14

Applicant: YING-CHENG WU ,  TE-CHUN CHOU

Inventor： YING-CHENG WU ,  TE-CHUN CHOU

IPC: H01L23/488

CPC classification number: H01L25/105 ,  H01L24/16 ,  H01L2224/16 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01015 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H05K3/323

Abstract: A stacked semiconductor package includes a circuit board with a number of pads disposed thereon, and a number of package units stacked on the circuit board. Each of the package units includes a substrate, a chip, an anisotropic conductive layer, and a number of conductive elements. The substrate has a first surface facing to the circuit board and a second surface opposite to the first surface, both of the first surface and the second surface have a number of pads disposed thereon. The chip is disposed on the substrate and electrically connected with the substrate. The anisotropic conductive layer is disposed between the substrate and the chip, and is capable of fixing the chip on the substrate. The conductive elements electrically connect the pads on the first surface of the substrate with the pads on the second surface of an adjacent substrate and the pads on the circuit board.

Abstract translation: 堆叠的半导体封装包括其上布置有多个焊盘的电路板和堆叠在电路板上的多个封装单元。 每个封装单元包括基板，芯片，各向异性导电层和多个导电元件。 基板具有面对电路板的第一表面和与第一表面相对的第二表面，第一表面和第二表面都具有设置在其上的多个焊盘。 芯片设置在基板上并与基板电连接。 各向异性导电层设置在基板和芯片之间，并且能够将芯片固定在基板上。 导电元件将衬底的第一表面上的焊盘与相邻衬底的第二表面上的焊盘和电路板上的焊盘电连接。

公开(公告)号：US20080251875A1

公开(公告)日：2008-10-16

申请号：US11850619

申请日：2007-09-05

Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

IPC: H01L23/22 ,  H01L31/0203

CPC classification number: H01L23/3121 ,  H01L23/16 ,  H01L23/3135 ,  H01L23/50 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An exemplary semiconductor package includes a substrate, at least one passive component, an insulative layer and a chip. The substrate defines a cavity therein. The at least one passive component is disposed within the cavity, and is electrically connected to the substrate. The insulative layer is received in the cavity, and encases the at least one passive component. The chip is disposed on the insulative layer, and is electrically connected to the substrate. The semiconductor package packaging the at least one passive component within the cavity and under the chip can improve a space usage thereof, thus a packaging scale of the semiconductor package could be reduced.

Abstract translation: 示例性半导体封装包括衬底，至少一个无源部件，绝缘层和芯片。 衬底在其中限定空腔。 所述至少一个无源部件设置在所述空腔内，并且电连接到所述基板。 绝缘层被接收在空腔中，并且包围至少一个无源部件。 芯片设置在绝缘层上，并与基板电连接。 封装空腔内和芯片下方的至少一个无源部件的半导体封装可以改善其空间使用，从而可以减少半导体封装的封装尺寸。

公开(公告)号：US20080099864A1

公开(公告)日：2008-05-01

申请号：US11695441

申请日：2007-04-02

Applicant: YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： YING-CHENG WU ,  CHUN-HUNG LIN

IPC: H01L31/0232 ,  H01L21/58 ,  H01L23/48

CPC classification number: H01L31/0203 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14627 ,  H01L31/0232 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.

Abstract translation: 数字照相机模块（100）包括安装在芯片封装上的芯片封装（110）和透镜模块（130），用于在芯片封装上形成聚焦图像。 芯片封装包括支撑件（112），芯片（114），多个电线（116），主粘合剂（118）和盖板（119）。 支撑件包括通过其定义的通孔，并且在通孔周围形成有多个顶部触头（1130）。 芯片设置在通孔中并且包括布置在其上的多个焊盘（1144）。 电线将焊盘电连接到顶部触点。 将主要粘合剂施加到芯片和支撑件之间的间隙，并将芯片固定到支撑件上。 盖板粘接并支撑在主粘合剂上。 还提供了制造芯片封装的方法。