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公开(公告)号：US20250048769A1
公开(公告)日：2025-02-06
申请号：US18807492
申请日：2024-08-16
Applicant: Apple Inc.
Inventor： Saijin Liu , Tongbi T. Jiang , Saahil Mehra
Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
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公开(公告)号：US12074244B2
公开(公告)日：2024-08-27
申请号：US17473745
申请日：2021-09-13
Applicant: Apple Inc.
Inventor： Saijin Liu , Tongbi T. Jiang , Saahil Mehra
CPC classification number: H01L31/167 , A61B5/0059 , A61B5/681 , G04C10/00 , G04G21/025 , G06F1/163 , H02J50/10
Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
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公开(公告)号：US11561144B1
公开(公告)日：2023-01-24
申请号：US16262724
申请日：2019-01-30
Applicant: Apple Inc.
Inventor： Caleb C. Han , Brad G. Boozer , Mark G. Walsh , William S. Lee , Tongbi T. Jiang , Jun Zhai , Yun X. Ma , James G. Horiuchi , David MacNeil , Ashwin Balasubramanian , Wei Chen , Jie-Hua Zhao
Abstract: An electronic device, such as a smart watch, incorporating a fluid-based pressure-sensing device is disclosed. The fluid-based pressure-sensing device includes an enclosure, a pressure sensor, a diaphragm and a sensing medium. The enclosure includes an opening and the pressure sensor is disposed inside the enclosure. The diaphragm hermetically seals the opening, and the sensing medium transfers a pressure exerted on the diaphragm to the pressure sensor. The sensing medium can be liquid oil filling a space of the enclosure, and the diaphragm is a polymer material. The pressure-sensing device may sense an environmental pressure, which may be used by the electronic device to modify its operations, change information that is displayed, and so on.
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公开(公告)号：US20220336405A1
公开(公告)日：2022-10-20
申请号：US17654637
申请日：2022-03-14
Applicant: Apple Inc.
Inventor： Saijin Liu , Fang Ou , Tongbi T. Jiang
IPC: H01L23/00
Abstract: Hybrid bonded structures and methods of manufacture are described. In an embodiment, a hybrid bonded structure includes a first plurality of first conductive bonding regions of a first substrate stack bonded directly to a second plurality of second conductive bonding regions of a second substrate stack, and a first dielectric layer of the first substrate stack bonded to a second dielectric layer of the second substrate stack with an intermediate organic adhesive layer.
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公开(公告)号：US11422104B2
公开(公告)日：2022-08-23
申请号：US16854688
申请日：2020-04-21
Applicant: Apple Inc.
Inventor： Caleb C. Han , Brad G. Boozer , David MacNeil , Gregory B. Arndt , Patrick E. O'Brien , Roham Solasi , Tongbi T. Jiang , Ashwin Balasubramanian , William S. Lee , Manoj K. Bhattacharyya , Jiahui Liang , James G. Horiuchi , Savas Gider
Abstract: An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.
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Patent Agency Ranking
公开(公告)号：US20220240803A1
公开(公告)日：2022-08-04
申请号：US17166914
申请日：2021-02-03
Applicant: Apple Inc.
Inventor： Caleb C. Han , Patrick E. O'Brien , Tongbi T. Jiang
Abstract: Embodiments are directed to a blood pressure measurement device that includes a strap configured to couple the blood pressure measurement device to a user, an air pump coupled to the strap and having a housing defining a surface facing the user, and an inflatable chamber positioned on the surface of the air pump and fluidly coupled to the air pump. The inflatable chamber can be positioned between the air pump and the user when the blood pressure measurement device is worn by the user and expand towards the user when inflated. The blood pressure measurement device can also include a pressure sensing chamber coupled to the inflatable chamber and positioned between the inflatable chamber and the user when the blood pressure measurement device is worn by the user. The pressure sensing chamber can include a liquid volume and a pressure sensing device configured to detect a pressure of the liquid volume.
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公开(公告)号：US20220005798A1
公开(公告)日：2022-01-06
申请号：US17475831
申请日：2021-09-15
Applicant: Apple Inc.
Inventor： Jun Qi , Rong Liu , Saijin Liu , Shaofeng Liu , Tongbi T. Jiang , Victor H. Yin , Xia Li , Xiang Fang , Ziruo Hong
Abstract: An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired.
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公开(公告)号：US09735539B2
公开(公告)日：2017-08-15
申请号：US15011562
申请日：2016-01-31
Applicant: APPLE INC.
Inventor： Tongbi T. Jiang , Weiping Li , Xiaofeng Fan
CPC classification number: H01S5/02469 , H01S5/0207 , H01S5/026 , H01S5/0425 , H01S5/183 , H01S5/423
Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
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公开(公告)号：US20170025815A1
公开(公告)日：2017-01-26
申请号：US15011562
申请日：2016-01-31
Applicant: APPLE INC.
Inventor： Tongbi T. Jiang , Weiping Li , Xiaofeng Fan
CPC classification number: H01S5/02469 , H01S5/0207 , H01S5/026 , H01S5/0425 , H01S5/183 , H01S5/423
Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
Abstract translation: 光电子器件包括半导体衬底，其具有正面和背面，并且具有至少一个从背面穿过半导体衬底延伸到与前侧接近的腔。 至少一个光电子发射器形成在半导体衬底的与该至少一个腔相邻的正面上。 导热材料至少部分地填充至少一个空腔，并被配置为用作至少一个光电发射器的散热器。
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公开(公告)号：US20160050379A1
公开(公告)日：2016-02-18
申请号：US14462032
申请日：2014-08-18
Applicant: Apple Inc.
Inventor： Tongbi T. Jiang , Xiaofeng Fan
CPC classification number: H04N5/2253
Abstract: An optical system can include a curved light sensor and an optical system positioned in front of the curved light sensor. The curved light sensor includes a substrate and a patterned stress film formed over at least surface of the substrate.
Abstract translation: 光学系统可以包括弯曲光传感器和位于弯曲光传感器前面的光学系统。 弯曲光传感器包括基板和形成在基板的至少表面上的图案化应力膜。
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