CAM device with 3D CAM cells
    21.
    发明授权

    公开(公告)号:US11211111B1

    公开(公告)日:2021-12-28

    申请号:US17038795

    申请日:2020-09-30

    Applicant: Arm Limited

    Abstract: A content-addressable memory (CAM) storage element includes bit storage cell bit comparison cells. The bit storage cell is arranged on a first die tier and includes at least one transistor, one or two bit lines, and a storage node. The bit comparison cell is arranged on a second die tier and has a match line, complementary search lines, and at least three transistors. The complementary search lines are decoupled from the bit line(s). A 3D connection couples the storage node to one of the transistors of the second die tier. The CAM cell performs at least one CAM search per clock cycle using at least four transistors per search, including the at least one transistor of the bit storage cell and the at least three transistors of the bit comparison cell, and to output results of the at least one CAM search on the match line.

    Buried Metal Techniques
    25.
    发明公开

    公开(公告)号:US20240038297A1

    公开(公告)日:2024-02-01

    申请号:US17874611

    申请日:2022-07-27

    Applicant: Arm Limited

    CPC classification number: G11C11/419 G11C11/412 H01L27/1104

    Abstract: Various implementations described herein are related to a device having bitline drivers coupled to passgates of bitcells via bitlines and buried metal lines formed within a substrate including a buried enable signal line and a buried ground line coupled to ground connections of the bitline drivers. The buried enable signal line transfers a negative bias to a selected bitline of the bitlines via the buried ground line that is coupled to the ground connections of the bitline drivers so as to increase gate-source bias of the passgates of the selected bitcell to thereby enhance write capability of the selected bitcell.

    Circuitry apportioning of an integrated circuit

    公开(公告)号:US11532353B2

    公开(公告)日:2022-12-20

    申请号:US17162532

    申请日:2021-01-29

    Applicant: Arm Limited

    Abstract: According to one implementation of the present disclosure, an integrated circuit comprises a memory macro unit that includes an input/output (I/O) circuit block, where read/write circuitry of the I/O circuit block is apportioned on at least first and second tiers of the memory macro unit. In a particular implementation, read circuitry of the read/write circuitry is arranged on the first tier and write circuitry of the read/write circuitry is arranged on the second tier.

    Methods and Circuits of Spatial Alignment

    公开(公告)号:US20220391469A1

    公开(公告)日:2022-12-08

    申请号:US17339895

    申请日:2021-06-04

    Applicant: Arm Limited

    Abstract: According to one implementation of the present disclosure, a method includes performing a spatial alignment of at least one of first or second data tiers of a circuit; and performing a computation based on the spatial alignment of the at least one of the first and second data tiers. According to another implementation of the present disclosure, a circuit includes: a compute circuitry; and at least first and second data tiers of two or more data tiers positioned at least partially overlapping one another. In an example, each of the at least first and second data tiers is coupled to the compute circuitry. In certain implementations, the positioning of the first and second data tiers at least partially overlapping one another corresponds to a spatial alignment.

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