公开(公告)号：US11150273B2

公开(公告)日：2021-10-19

申请号：US16884311

申请日：2020-05-27

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: H01L23/495 ,  G01R15/08 ,  H01L43/04 ,  H01L43/06

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US10725100B2

公开(公告)日：2020-07-28

申请号：US13837982

申请日：2013-03-15

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/02 ,  G01R33/00 ,  G01R33/07

Abstract: Methods and apparatus for magnetic field sensor having a sensing element, an analog circuit path coupled to the sensing element for generating an output voltage in response to a magnetic field applied to the sensing element, and a coil in proximity to the sensing element, the coil having a first terminal that is accessible external to the magnetic field sensor.

公开(公告)号：US20200049760A1

公开(公告)日：2020-02-13

申请号：US16655657

申请日：2019-10-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  David J. Haas ,  Gregory Delmain ,  Michael Gaboury ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/09 ,  G01R33/00 ,  G01R31/3187 ,  G01R33/02 ,  G01R33/07 ,  G01R35/00

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

公开(公告)号：US20190277889A1

公开(公告)日：2019-09-12

申请号：US16426215

申请日：2019-05-30

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Shixi Louis Liu

IPC: G01R15/20 ,  G01R33/00 ,  G01R33/09 ,  G01R33/07 ,  H01L43/02 ,  H01L21/48 ,  H01L43/04 ,  H01L23/495 ,  H01L23/00 ,  G01R19/00 ,  H01L43/08 ,  H01L43/06

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

公开(公告)号：US20180038897A1

公开(公告)日：2018-02-08

申请号：US15231133

申请日：2016-08-08

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Peter Cisar ,  Stefan Kranz ,  Stephan Schurt

IPC: G01R15/18 ,  G01R15/20

CPC classification number: G01R15/183 ,  G01R15/185 ,  G01R15/202 ,  G01R15/205

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and at least two gaps portions, each of the gap portions having an associated gap spacing. A detector of the current sensor includes at least one first sensing element disposed in a first one of the gap portions and configured to generate a respective first magnetic field signal in response to a first magnetic field generated in the first gap portion in response to a current through the current conductor. The detector also includes at least one second sensing element disposed in a second one of the gap portions and configured to generate a respective second magnetic field signal in response to a second magnetic field generated in the second gap portion in response to the current through the conductor. A method of sensing a current through a current conductor is also provided.

公开(公告)号：US20170179377A1

公开(公告)日：2017-06-22

申请号：US15447320

申请日：2017-03-02

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: H01L43/04 ,  H01L43/14 ,  H01L43/08 ,  H01L43/12 ,  H01L43/02 ,  H01L43/06

CPC classification number: H01L43/04 ,  G01R33/0029 ,  G01R33/0052 ,  G01R33/0076 ,  G01R33/07 ,  G01R33/09 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49503 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L43/02 ,  H01L43/06 ,  H01L43/065 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

公开(公告)号：US12282075B2

公开(公告)日：2025-04-22

申请号：US17810353

申请日：2022-07-01

Applicant: Allegro MicroSystems, LLC

Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

公开(公告)号：US11262385B2

公开(公告)日：2022-03-01

申请号：US16421982

申请日：2019-05-24

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US10481181B2

公开(公告)日：2019-11-19

申请号：US15496152

申请日：2017-04-25

Applicant: Allegro MicroSystems, LLC

Inventor： Wade Bussing ,  Alexander Latham ,  Shaun D. Milano ,  Christian Feucht

IPC: G01R15/20 ,  H01L23/495 ,  G01R33/00

Abstract: Systems and methods described herein are directed towards differential current sensing a current sensor having two or more magnetic field sensing elements that are oriented to sense a magnetic field generated by a current through an external conductor in the same direction. The current sensor can be positioned such that at least one first magnetic field sensing element is vertically aligned with the external conductor and at least one second magnetic field sensing element is not vertically aligned with the external conductor. The magnetic field sensing elements may be spaced from each to measure a gradient field and can generate a magnetic field signal indicative of a distance between the respective magnetic field sensing element and the current carrying external conductor. A difference between the magnetic field signals can be determined that is indicative of the current through the external conductor.

公开(公告)号：US20180238938A1

公开(公告)日：2018-08-23

申请号：US15435725

申请日：2017-02-17

Applicant: Allegro Microsystems, LLC

Inventor： Christian Feucht ,  Shaun D. Milano

IPC: G01R19/25 ,  G01R15/20

Abstract: Systems and methods are described herein for reducing the effects of magnetic field cross-coupling in a multi-conductor current sensor system. A current sensor system includes one or more current sensors, each positioned proximate to at least one conductor and spaced from at least one other conductor. Each conductor carries a current intended to be measured by a respective current sensor. The current sensors include one or more magnetic field sensing elements to generate a magnetic field signal indicative of a detected magnetic field. A characterization measurement is performed to determine the coupling between each current sensor and the respective current conductor and to determine the coupling between the current sensor and the other ones of the current conductors, by providing a reference current to each of the conductors and measuring the outputs at each of the current sensors. The characterization measurement can be used to generate a coupling matrix.