公开(公告)号：US20250067778A1

公开(公告)日：2025-02-27

申请号：US18944096

申请日：2024-11-12

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US20240003995A1

公开(公告)日：2024-01-04

申请号：US17810353

申请日：2022-07-01

Applicant: Allegro MicroSystems, LLC

Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

CPC classification number: G01R33/06 ,  G01R19/0092 ,  H05K1/181 ,  H05K2201/10151

Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

公开(公告)号：US20220137097A1

公开(公告)日：2022-05-05

申请号：US17648310

申请日：2022-01-19

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US11313899B2

公开(公告)日：2022-04-26

申请号：US16655657

申请日：2019-10-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  David J. Haas ,  Gregory Delmain ,  Michael Gaboury ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/02 ,  G01R31/3187 ,  G01R35/00 ,  G01R33/09 ,  G01R33/00 ,  G01R33/07

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

公开(公告)号：US20200057120A1

公开(公告)日：2020-02-20

申请号：US15999448

申请日：2018-08-20

Applicant: Allegro MicroSystems, LLC ,  Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： Noémie Belin ,  Shaun D. Milano ,  Wade Bussing ,  Claude Fermon

IPC: G01R33/09

Abstract: Systems and methods described herein provide a current sensor based on magnetic field detection having multiple sensor arrangements with multiple, different sensitivity ranges. The outputs of the multiple sensor arrangements can be combined to generate a single output signal. The current sensor can include two or more sensor arrangements, each having one or more magnetic field sensing elements, and configured to sense a magnetic field in different first measurement ranges corresponding to different ranges of currents through the conductor and further configured to generate different magnetic field signals indicative of the sensed magnetic field in the respective measurement range. The current sensor can include a circuit configured to generate an output signal indicative of a combination of the different magnetic field signals that corresponds to the current through the conductor.

公开(公告)号：US10333055B2

公开(公告)日：2019-06-25

申请号：US15447320

申请日：2017-03-02

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Michael C. Doogue ,  William P. Taylor

IPC: G01R33/00 ,  G01R33/07 ,  G01R33/09 ,  H01L23/00 ,  H01L23/31 ,  H01L43/02 ,  H01L43/04 ,  H01L43/06 ,  H01L43/08 ,  H01L43/12 ,  H01L43/14 ,  H01L23/495 ,  H01L21/00

Abstract: Methods for providing a sensor integrated circuit package including employing a conductive leadframe and forming a non-conductive die paddle in relation to the leadframe. The method can further include placing a die on the non-conductive die paddle to form an assembly, forming at least one electrical connection between the die and the leadframe, and overmolding the assembly to form an integrated circuit package.

公开(公告)号：US10247758B2

公开(公告)日：2019-04-02

申请号：US15231133

申请日：2016-08-08

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Peter Cisar ,  Stefan Kranz ,  Stephan Schurt

IPC: G01R33/36 ,  G01R15/18 ,  G01R15/20

Abstract: A current sensor includes a ferromagnetic core having a substantially central opening for receiving a current conductor and at least two gaps portions, each of the gap portions having an associated gap spacing. A detector of the current sensor includes at least one first sensing element disposed in a first one of the gap portions and configured to generate a respective first magnetic field signal in response to a first magnetic field generated in the first gap portion in response to a current through the current conductor. The detector also includes at least one second sensing element disposed in a second one of the gap portions and configured to generate a respective second magnetic field signal in response to a second magnetic field generated in the second gap portion in response to the current through the conductor. A method of sensing a current through a current conductor is also provided.

公开(公告)号：US09910088B2

公开(公告)日：2018-03-06

申请号：US14578813

申请日：2014-12-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  William P. Taylor

IPC: G01B7/30 ,  G01R27/02 ,  G01R31/02 ,  G01R31/28 ,  G01R33/00 ,  G01R31/3187 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R35/00

CPC classification number: G01R31/2884 ,  G01R31/2829 ,  G01R31/3187 ,  G01R33/00 ,  G01R33/0023 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R33/091 ,  G01R35/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

公开(公告)号：US20160282388A1

公开(公告)日：2016-09-29

申请号：US15179147

申请日：2016-06-10

Applicant: Allegro Microsystems, LLC

Inventor： Shaun D. Milano ,  Shixi Louis Liu

IPC: G01R15/20 ,  H01L43/04 ,  G01R19/00 ,  H01L43/06 ,  H01L43/08 ,  H01L43/12 ,  H01L23/495 ,  H01L23/00

CPC classification number: G01R15/20 ,  G01R15/202 ,  G01R15/207 ,  G01R19/0092 ,  G01R33/0052 ,  G01R33/07 ,  G01R33/09 ,  H01L21/4828 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L43/02 ,  H01L43/04 ,  H01L43/065 ,  H01L43/08 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/29084 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73103 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A current sensor integrated circuit includes a lead frame having a primary conductor and at least one secondary lead, a semiconductor die disposed adjacent to the primary conductor, an insulation structure disposed between the primary conductor and the semiconductor die, and a non-conductive insulative material enclosing the semiconductor die, the insulation structure, a first portion of the primary conductor, and a first portion of the at least one secondary lead to form a package. The first portion of the at least one secondary lead (between a first end proximal to the primary conductor and a second end proximal to the second, exposed portion of the at least one secondary lead) has a thickness that is less than a thickness of the second, exposed portion of the least one secondary lead. A distance between the second, exposed portion of the primary conductor and the second, exposed portion of the at least one secondary lead is at least 7.2 mm.

Abstract translation: 电流传感器集成电路包括具有主导体和至少一个次级引线的引线框架，与主导体相邻设置的半导体管芯，设置在主导体和半导体管芯之间的绝缘结构，以及非导电绝缘材料 封装半导体管芯，绝缘结构，初级导体的第一部分和至少一个次级引线的第一部分以形成封装。 至少一个次级引线的第一部分（在靠近主导体的第一端和靠近至少一个次级引线的第二暴露部分的第二端之间）具有的厚度小于 第二，至少一个次级引线的暴露部分。 主导体的第二暴露部分和至少一个次级引线的第二暴露部分之间的距离为至少7.2mm。

公开(公告)号：US20160028001A1

公开(公告)日：2016-01-28

申请号：US14877309

申请日：2015-10-07

Applicant: Allegro Microsystems, LLC

Inventor： Shixi Louis Liu ,  Harianto Wong ,  Paul A. David ,  John B. Sauber ,  Shaun D. Milano ,  Raguvir Kanda ,  Bruce Hemenway

IPC: H01L43/14 ,  H01L43/06 ,  H01L43/04

CPC classification number: H01L43/14 ,  G01R15/202 ,  G01R15/207 ,  G01R33/0052 ,  G01R33/09 ,  H01L21/4828 ,  H01L23/49548 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L43/04 ,  H01L43/065 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/81801 ,  H01L2924/15162 ,  H01L2924/014 ,  H01L2924/00014

Abstract: In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Abstract translation: 在一个方面，一种方法包括处理金属衬底，在金属衬底的第一表面上执行第一蚀刻，以形成用于集成电路封装的次级引线和具有两个初级引线并执行第二次蚀刻的弯曲元件 所述基板的与所述第一表面相对的第二表面，在所述次级引线上的位置和所述弯曲部件上的位置处，以提供锁定机构。 每个主引线位于弯曲部件的相应端部。