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公开(公告)号:US20230205196A1
公开(公告)日:2023-06-29
申请号:US18114915
申请日:2023-02-27
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Garrett H. Sin , Heng-Cheng Pai , Pramod Nambiar , Ganesh Balasubramanian , Irfan Jamil
IPC: G05B23/02 , G05B19/418 , G06F11/34 , G06F11/30 , G05B19/404
CPC classification number: G05B23/0286 , G05B19/404 , G05B19/4183 , G05B19/4184 , G05B19/41875 , G05B19/41885 , G05B23/024 , G05B23/0294 , G06F11/3089 , G06F11/3447 , G06F11/3466 , G06F11/3495 , G06N20/00
Abstract: A method includes identifying sets of sensor data associated with wafers processed via wafer processing equipment and identifying sets of metrology data associated with the wafers processed via the wafer processing equipment. The method further includes generating sets of aggregated sensor-metrology data, each of the sets of aggregated sensor-metrology data including a respective set of sensor data and a respective set of metrology data. The method further includes causing, based on the sets of aggregated sensor-metrology data, performance of a corrective action associated with the wafer processing equipment.
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公开(公告)号:US11545376B2
公开(公告)日:2023-01-03
申请号:US16940957
申请日:2020-07-28
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Edward P. Hammond, IV , Bhaskar Kumar , Anup Kumar Singh , Vivek Bharat Shah , Ganesh Balasubramanian
IPC: H01J37/32 , H01L21/67 , H01L21/3065 , G06T7/00
Abstract: Embodiments of the present disclosure relate to a method and an apparatus for monitoring plasma behavior inside a plasma processing chamber. In one example, a method for monitoring plasma behavior includes acquiring at least one image of a plasma, and determining a plasma parameter based on the at least one image.
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公开(公告)号:US11328964B2
公开(公告)日:2022-05-10
申请号:US16599962
申请日:2019-10-11
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Jie Feng , Dermot Cantwell
IPC: G05B13/02 , H01L21/66 , G06Q50/04 , H01L21/67 , G06N3/08 , H01L21/02 , G11C11/16 , H01J37/32 , G01B7/06 , G06T7/00 , G01N21/41
Abstract: Methods, systems, and non-transitory computer readable medium are described for prescriptive analytics in highly collinear response space. A method includes receiving film property data associated with manufacturing parameters of manufacturing equipment. The method further includes determining that the film property data is correlated and is different from target data. The method further includes selecting a set of data points of the film property data that are orthogonal to the target data. The method further includes performing feature extraction on the set of data points. The method further includes determining, based on the feature extraction, updates to one or more of the manufacturing parameters to meet the target data.
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公开(公告)号:US11157661B2
公开(公告)日:2021-10-26
申请号:US16716274
申请日:2019-12-16
Applicant: Applied Materials, Inc.
Inventor: Vinayak Veer Vats , Sidharth Bhatia , Garrett Ho-Yee Sin , Pramod Nambiar , Hang Yu , Sanjay Kamath , Deenesh Padhi , Heng-Cheng Pai
IPC: G06F30/12 , G06F16/904 , G06F16/903 , G06F119/18
Abstract: A process development visualization tool generates a first visualization of a parameter associated with a manufacturing process, and provides a GUI control element associated with a process variable of the manufacturing process, wherein the GUI control element has a first setting associated with a first value for the process variable. The process development tool receives a user input to adjust the GUI control element from the first setting to a second setting, determines a second value for the process variable based on the second setting, and determines a second set of values for the parameter that are associated with the second value for the process variable. The process development tool then generates a second visualization of the parameter, wherein the second visualization represents the second set of values for the parameter that are associated with the second value for the process variable.
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公开(公告)号:US11120976B2
公开(公告)日:2021-09-14
申请号:US16927618
申请日:2020-07-13
Applicant: Applied Materials, Inc.
Inventor: Bhaskar Kumar , Anup Kumar Singh , Vivek Bharat Shah , Sidharth Bhatia , Ganesh Balasubramanian
Abstract: A method and apparatus for operating a plasma processing chamber includes performing a plasma process at a process pressure and a pressure power to generate a plasma. A first ramping-down stage starts in which the process power and the process pressure are ramped down substantially simultaneously to an intermediate power level and an intermediate pressure level, respectively. The intermediate power level and intermediate pressure level are preselected so as to raise a plasma sheath boundary above a threshold height from a surface of a substrate. A purge gas is flowed from a showerhead assembly at a sufficiently high rate to sweep away contaminant particles trapped in the plasma such that one or more contaminant particles move outwardly of an edge of the substrate. A second ramping-down stage starts where the intermediate power level and the intermediate pressure level decline to a zero level and a base pressure, respectively.
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公开(公告)号:US10755903B2
公开(公告)日:2020-08-25
申请号:US15397883
申请日:2017-01-04
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Zhili Zuo , Hidehiro Kojiri , Anjana M. Patel , Song-Moon Suh , Ganesh Balasubramanian
Abstract: A method of cleaning a remote plasma source includes supplying a first cycle of one or more first cleaning gases to a remote plasma source. The method includes supplying a second cycle of one or more second cleaning gases to the remote plasma source. The method includes supplying one or more cooling fluids to one or more cooling conduits coupled with the remote plasma source.
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公开(公告)号:US20200264335A1
公开(公告)日:2020-08-20
申请号:US16791081
申请日:2020-02-14
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Garrett H. Sin , Heng-Cheng Pai , Pramod Nambiar , Ganesh Balasubramanian , Irfan Jamil
Abstract: Methods, systems, and non-transitory computer readable medium are described for sensor metrology data integration. A method includes receiving sets of sensor data and sets of metrology data. Each set of sensor data includes corresponding sensor values associated with producing corresponding product by manufacturing equipment and a corresponding sensor data identifier. Each set of metrology data includes corresponding metrology values associated with the corresponding product manufactured by the manufacturing equipment and a corresponding metrology data identifier. The method further includes determining common portions between each corresponding sensor data identifier and each corresponding metrology data identifier. The method further includes, for each of the sensor-metrology matches, generating a corresponding set of aggregated sensor-metrology data and storing the sets of aggregated sensor-metrology data to train a machine learning model. The trained machine learning model is capable of generating one or more outputs for performing a corrective action associated with the manufacturing equipment.
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公开(公告)号:US20240395505A1
公开(公告)日:2024-11-28
申请号:US18791193
申请日:2024-07-31
Applicant: Applied Materials, Inc.
Inventor: Jie Yu , Yue Guo , Kartik Ramaswamy , Tao Zhang , Shahid Rauf , John Forster , Sidharth Bhatia , Rong Gang Zheng
IPC: H01J37/32
Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.
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公开(公告)号:US20240176312A1
公开(公告)日:2024-05-30
申请号:US18070448
申请日:2022-11-28
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Roger Lindley , Upendra Ummethala , Thomas Li , Michael Howells , Steven Babayan , Mimi-Diemmy Dao
CPC classification number: G05B13/027 , G05B13/048
Abstract: A method includes providing, as input to a first trained machine learning model, trace data associated with one or more substrate processing procedures. The input further includes equipment constants associated with the one or more substrate processing procedures. The input further includes trace data of a first processing chamber. The input further includes equipment constants of the first processing chamber. The method further includes obtaining, as output from the first trained machine learning model, a recommended update to a first equipment constant of the first processing chamber. The method further includes updated the first equipment constant of the first processing chamber responsive to obtaining the output from the first trained machine learning model.
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公开(公告)号:US20240046096A1
公开(公告)日:2024-02-08
申请号:US18489528
申请日:2023-10-18
Applicant: Applied Materials, Inc.
Inventor: Sidharth Bhatia , Dermot Cantwell , Serghei Malkov , Jie Feng
IPC: G06N3/08 , G05B19/418 , G05B13/02 , G06N3/045
CPC classification number: G06N3/08 , G05B19/41885 , G05B13/027 , G06N3/045 , G05B2219/32335
Abstract: Disclosed herein is technology for performing predictive modeling to identify inputs for a manufacturing process. An example method may include receiving expected output data defining an attribute of a semiconductor device manufactured by at least one semiconductor device manufacturing process performed within at least one processing chamber, wherein the expected output data corresponds to an unexplored portion of a process space associated with the at least one semiconductor device manufacturing process, and identifying expected input data by using the expected output data as input to a plurality of homogeneous inverted machine learning models, wherein each inverted machine learning model of the plurality of homogeneous inverted machine learning models is trained to determine, by performing linear extrapolation based on the expected output data, a respective set of input data of a plurality of sets of input data for configuring the semiconductor device manufacturing process to manufacture the semiconductor device.
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