Chip bonding method and bonding device

    公开(公告)号:US11239198B2

    公开(公告)日:2022-02-01

    申请号:US16830834

    申请日:2020-03-26

    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

    Array substrate and methods of manufacturing and driving the same

    公开(公告)号:US10452190B2

    公开(公告)日:2019-10-22

    申请号:US15484259

    申请日:2017-04-11

    Abstract: Embodiments of the present disclosure relate to the field of display technologies, and particularly, to an array substrate and methods of manufacturing and driving the same. With the embodiments of the present disclosure, undesirable phenomenon, e.g. color mixing and so on is avoid in a display device having the array substrate while simplifying the manufacture process of the array substrate. The array substrate comprises a substrate, thin-film transistors, pixel electrodes and a common electrode on the substrate, a plurality of leading wires and a color filter layer; wherein the common electrode comprises a plurality of common electrode blocks reusable as self-capacitance electrodes, and each of the leading wires has one end electrically connected to one of the common electrode blocks and the other end electrically connected to a touch integrated circuit. The array substrate according to the embodiments of the present disclosure is used in the display device.

    Array substrate, display panel and display apparatus having the same, and fabricating method thereof

    公开(公告)号:US10290684B2

    公开(公告)日:2019-05-14

    申请号:US15520554

    申请日:2016-10-11

    Abstract: The present application discloses an array substrate having a subpixel region and an inter-subpixel region, a display panel and a display apparatus having the same, and a fabricating method thereof. The array substrate includes a plasmonic color filter layer including a plurality of color filter blocks in the subpixel region on a base substrate. Each of the plurality of color filter blocks includes a plurality of plasmonic nanostructures made of a semiconductor material. A first color filter block corresponding to a subpixel of a first color has an arrangement of nanostructures different from that of a second color filter block corresponding to a subpixel of a second color; the second color being different from the first color.

    CONDUCTIVE BRIDGING METHOD, BRIDGING STRUCTURE, TOUCH PANEL AND TOUCH CONTROL DISPLAY APPARATUS
    25.
    发明申请
    CONDUCTIVE BRIDGING METHOD, BRIDGING STRUCTURE, TOUCH PANEL AND TOUCH CONTROL DISPLAY APPARATUS 有权
    导线桥接方法,桥梁结构,触控面板和触控控制显示设备

    公开(公告)号:US20170038865A1

    公开(公告)日:2017-02-09

    申请号:US14913298

    申请日:2015-07-17

    CPC classification number: G06F3/044 G06F3/041 G06F3/0412 G06F2203/04111

    Abstract: The present invention relates to the technical field of display by a touch screen, and particularly relates to a conductive bridging method, a bridging structure, a touch panel and a touch control display apparatus. The conductive bridging method comprises: sequentially forming an insulating layer and a self-assembled-monolayer on the base substrate provided with first electrode lines and second electrode lines which mutually intersect; forming via holes penetrating through the insulating layer and the self-assembled-monolayer; removing the self-assembled-monolayer between two adjacent via holes close to a same first electrode line; and forming a conductive film in the via holes and in a region between two adjacent via holes. In this way, a bridging connection is achieved with the help of the electrical conductivity of the conductive film.

    Abstract translation: 本发明涉及通过触摸屏进行显示的技术领域,特别涉及导电桥接方法,桥接结构,触摸面板和触摸控制显示装置。 导电桥接方法包括:在设置有相互交叉的第一电极线和第二电极线的基底基板上依次形成绝缘层和自组装单层; 形成穿过绝缘层和自组装单层的通孔; 在靠近相同的第一电极线的两个相邻通孔之间移除自组装单层; 以及在通孔中和两个相邻通孔之间的区域中形成导电膜。 以这种方式,借助导电膜的导电性实现桥接连接。

    MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND THIN FILM TRANSISTOR , ARRAY SUBSTRATE
    26.
    发明申请
    MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND THIN FILM TRANSISTOR , ARRAY SUBSTRATE 审中-公开
    薄膜晶体管和薄膜晶体管的制造方法,阵列基板

    公开(公告)号:US20160351813A1

    公开(公告)日:2016-12-01

    申请号:US14913314

    申请日:2015-09-17

    CPC classification number: H01L51/0004 H01L51/0007 H01L51/0096 H01L51/0566

    Abstract: The present disclosure pertains to the technical field of display, which relates to a manufacturing method of a thin film transistor and a thin film transistor, and an array substrate. The manufacturing method of a thin film transistor comprises: forming, above a substrate, patterns comprising different surface energies; coating, above said substrate, a composite solution containing organic semiconductor material and polymer insulating material, and forming a composite film layer; patterning said composite film layer according to the patterns with different surface energies above said substrate, preserving said composite film layer corresponding to the pattern areas with relatively high surface energies; layering said patterned composite film layer by means of an organic solvent steam treatment method; forming two separate metal electrodes at two opposite sides of said patterned composite film layer.

    Abstract translation: 本公开涉及薄膜晶体管和薄膜晶体管的制造方法以及阵列基板的显示技术领域。 薄膜晶体管的制造方法包括:在衬底之上形成包括不同表面能的图案; 在所述基板上涂覆含有有机半导体材料和聚合物绝缘材料的复合溶液,并形成复合膜层; 根据具有不同表面能的图案将所述复合薄膜层图形化在所述基底上方,以相对高的表面能保留对应于图案区域的所述复合薄膜层; 通过有机溶剂蒸汽处理方法对所述图案化复合膜层进行分层; 在所述图案化的复合膜层的两个相对侧上形成两个单独的金属电极。

    Method for detecting resistance of side trace of display substrate and display substrate

    公开(公告)号:US12198989B2

    公开(公告)日:2025-01-14

    申请号:US17255079

    申请日:2019-11-29

    Abstract: The present disclosure provides a method for detecting resistance of a side trace of a display substrate and the display substrate, and belongs to the field of display technology. In the method for detecting resistance of a side trace of a display substrate, the display substrate includes: a base substrate including a first surface and a second surface opposite to each other; a plurality of first pads at intervals on the first surface; and a plurality of second pads at intervals on the second surface; the first pad is electrically connected to a corresponding second pad through a side trace; the method includes forming at least one detection unit; wherein forming the detection unit includes: connecting two first pads through a connection part; and detecting two second pads in the detection unit, and obtaining resistance of the detection unit to obtain the resistance of the side trace.

    Detection circuit for detecting luminance of ambient light, display panel, and detection method

    公开(公告)号:US12170042B2

    公开(公告)日:2024-12-17

    申请号:US17778489

    申请日:2021-05-18

    Abstract: There is provided a detection circuit, a display panel and a detection method. The detection circuit includes: a conversion circuit configured to acquire a photoelectric sensing signal in real time and convert the acquired photoelectric sensing signal into a luminance value; a storage circuit configured to store N luminance values from the conversion circuit on a first input first output basis; a discrimination circuit connected to the storage circuit and configured to determine whether at least two of the N luminance values meet a preset condition; and an output circuit connected to the discrimination circuit and the storage circuit, and configured to output a preset default luminance value in response to the at least two luminance values meeting the preset condition and output at least one of the N luminance values in response to the at least two luminance values not meeting the preset condition.

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