公开(公告)号：US11502153B2

公开(公告)日：2022-11-15

申请号：US16761823

申请日：2019-03-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Jaiil Ryu ,  Zhiwei Liang ,  Yingwei Liu ,  Wusheng Li ,  Muxin Di

IPC: H01L27/32

Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.

公开(公告)号：US11335712B2

公开(公告)日：2022-05-17

申请号：US16755652

申请日：2019-05-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Muxin Di ,  Ke Wang ,  Yingwei Liu ,  Xiaoyan Zhu ,  Zhanfeng Cao ,  Guangcai Yuan

IPC: H01L27/12 ,  H01L33/62

Abstract: An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.

公开(公告)号：US11239298B2

公开(公告)日：2022-02-01

申请号：US16641560

申请日：2019-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Yingwei Liu ,  Zhiwei Liang ,  Haixu Li ,  Zhanfeng Cao

IPC: G09G3/3225 ,  H01L27/32 ,  H01L51/56

Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.

公开(公告)号：US11239257B2

公开(公告)日：2022-02-01

申请号：US16468240

申请日：2019-01-09

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Haixu Li ,  Muxin Di ,  Qingzhao Liu

IPC: H01L27/12 ,  H01L29/786

Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel and a display device, and relates to the field of display technology. The display backplane includes a first backplane and a second backplane. The first backplane includes a first substrate, and a first thin film transistor, on the first substrate, configured to drive a light emitting unit. The second backplane, which is attached to a surface of the first substrate facing away from the first thin film transistor, includes a second substrate and at least one second thin film transistor located between the second substrate and the first substrate.

公开(公告)号：US20210407976A1

公开(公告)日：2021-12-30

申请号：US16765530

申请日：2019-05-31

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Yingwei Liu ,  Ke Wang ,  Qi Yao ,  Huijuan Wang ,  Haixu Li ,  Zhanfeng Cao ,  Guangcai Yuan ,  Xue Dong ,  Guoqiang Wang ,  Zhijun Lv

IPC: H01L25/16 ,  H01L27/12 ,  H01L23/00

Abstract: Provided is a display backplate includes including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

公开(公告)号：US20200273786A1

公开(公告)日：2020-08-27

申请号：US16530605

申请日：2019-08-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Muxin Di ,  Zhiwei Liang ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao ,  Renquan Gu ,  Qi Yao ,  Jaiil Ryu

IPC: H01L23/498 ,  H01L21/48

Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.

公开(公告)号：US12087892B2

公开(公告)日：2024-09-10

申请号：US17043937

申请日：2019-10-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhiwei Liang ,  Wenqian Luo ,  Zhijun Lv ,  Yingwei Liu ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05655 ,  H01L2224/0568 ,  H01L2224/1145 ,  H01L2224/11622 ,  H01L2224/13011 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13124 ,  H01L2224/16057 ,  H01L2224/1607 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81345 ,  H01L2224/81898

Abstract: The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.

公开(公告)号：US12062744B2

公开(公告)日：2024-08-13

申请号：US16975771

申请日：2019-10-12

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Muxin Di ,  Ke Wang ,  Guoqiang Wang ,  Zhiwei Liang ,  Renquan Gu ,  Yingwei Liu ,  Qi Yao ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L33/387 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

公开(公告)号：US12021173B2

公开(公告)日：2024-06-25

申请号：US17435016

申请日：2020-11-06

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Mingxing Wang ,  Binbin Tong ,  Lizhen Zhang ,  Chenyang Zhang ,  Zhen Zhang ,  Xiawei Yun ,  Guangcai Yuan ,  Xue Dong ,  Muxin Di ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/00 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/46 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: A light-emitting diode (LED) chip includes a plurality of epitaxial structures, at least one first electrode, and a plurality of second electrodes. Any two adjacent epitaxial structures of the plurality of epitaxial structures have a gap therebetween. Each epitaxial structure includes a first semiconductor pattern, a light-emitting pattern and a second semiconductor pattern stacked in sequence. First semiconductor patterns in at least two of the plurality of epitaxial structures are connected to each other to form a first semiconductor layer. A first electrode is electrically connected to the first semiconductor layer. Each second electrode is electrically connected to the second semiconductor pattern in at least one of the plurality of epitaxial structures.

公开(公告)号：US11869897B2

公开(公告)日：2024-01-09

申请号：US17057546

申请日：2020-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

CPC classification number: H01L27/124 ,  H01L27/127 ,  H01L27/1251

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.