公开(公告)号：US20120235584A1

公开(公告)日：2012-09-20

申请号：US13482781

申请日：2012-05-29

申请人： Grigory ONUSHKIN ,  Gil Han Park ,  Jung Ja Yang ,  Young Jin Lee

发明人： Grigory ONUSHKIN ,  Gil Han Park ,  Jung Ja Yang ,  Young Jin Lee

IPC分类号： H05B37/00

CPC分类号： H01L27/156 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/49107 ,  H05B33/0821 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An alternating current (AC) driven light emitting device includes a substrate, K number of first light emitting diode (LED) cells arranged in a row on a top surface of the substrate, where K is an integer satisfying K≧3, K number of second LED cells arranged in a row parallel to the row of the first LED cells on the top surface of the substrate, and (K−1) number of third LED cells arranged in a row between the respective rows of the first and second LED cells on the top surface of the substrate. The AC driven light emitting device has a connection structure between LED cells to be operable at an AC.

公开(公告)号：US08076692B2

公开(公告)日：2011-12-13

申请号：US12255469

申请日：2008-10-21

申请人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

发明人： Hyung Kun Kim ,  Ho Sun Paek ,  Suk Ho Jung ,  Hak Hwan Kim ,  Young Jin Lee

IPC分类号： H01L33/00 ,  H01L23/34

CPC分类号： H01L33/642 ,  F21K9/00 ,  H01L2224/48091 ,  H01L2924/00014

摘要： The present invention provides an LED package including: a heat discharge body provided with a plurality of radially protruding heat discharge fins at an outer circumferential surface and molding material filled spaces between the heat discharge fins; a package body which is received on a top surface of the heat discharge body and has a cavity; a pair of lead frames extended from upper parts of the heat discharge body to both sides thereof; and an LED chip mounted inside the cavity.

摘要翻译： 本发明提供一种LED封装体，其特征在于，包括：散热体，其在外周面设置有多个径向突出的散热片，在所述散热片之间填充空间的成型材料; 封装体，其被容纳在所述散热体的顶面上并具有空腔; 一对引线框架从散热体的上部延伸到其两侧; 以及安装在腔内的LED芯片。

公开(公告)号：US08043962B2

公开(公告)日：2011-10-25

申请号：US11756005

申请日：2007-05-31

申请人： Dong Ha Jung ,  Baek Mann Kim ,  Soo Hyun Kim ,  Young Jin Lee ,  Sun Woo Hwang ,  Jeong Tae Kim

发明人： Dong Ha Jung ,  Baek Mann Kim ,  Soo Hyun Kim ,  Young Jin Lee ,  Sun Woo Hwang ,  Jeong Tae Kim

IPC分类号： H01L21/4763

CPC分类号： H01L21/76879 ,  H01L21/76831 ,  H01L21/76856 ,  H01L21/76886 ,  H01L21/76888 ,  H01L23/53223 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A metal wiring of a semiconductor device includes a semiconductor substrate; an insulating layer provided with a damascene pattern formed over the semiconductor substrate; a diffusion barrier layer which contains a RuO2 layer formed on a surface of the damascene pattern and an Al deposit-inhibiting layer formed on a portion of the RuO2 layer in both-side upper portion of the damascene pattern; and a wiring metal layer including Al formed on the diffusion barrier layer by MOCVD method in order to fill the damascene pattern.

摘要翻译： 半导体器件的金属布线包括半导体衬底; 绝缘层，设置有形成在所述半导体衬底上的镶嵌图案; 包含在镶嵌图案的表面上形成的RuO 2层的扩散阻挡层和形成在该镶嵌图案的两侧上部的RuO 2层的一部分上的Al沉积抑制层; 以及通过MOCVD法在扩散阻挡层上形成的包括Al的布线金属层，以填充镶嵌图案。

公开(公告)号：US07820468B2

公开(公告)日：2010-10-26

申请号：US12546142

申请日：2009-08-24

申请人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

发明人： Seung Hee Lee ,  Doo Cheol Park ,  Joo Hun Park ,  Young Jin Lee ,  Sang Wook Park ,  Nam Hyeong Kim

IPC分类号： H01L21/782

CPC分类号： H03H9/1085 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H03H3/08 ,  H03H9/059 ,  H03H9/1078 ,  H01L2224/81 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Disclosed herein is a stack type surface acoustic wave package. The surface acoustic wave package comprises a first bare chip having a plurality of electrodes formed thereon, a second bare chip having a plurality of electrodes and via-holes formed thereon, a connecting portion electrically connecting the first bare chip to an upper surface of the second bare chip such that the electrodes of the first bare chip face the electrodes of the second bare chip, and a sealing member provided on the first and second bare chips to form an air-tight space on an operating surface between the first and second bare chips. The surface acoustic wave package can prevent deformation due to thermal impact from the outside during a packaging process, enhancing reliability of the product, minimizing the size of the product, and reducing manufacturing costs by reducing the number of components and material costs.

摘要翻译： 这里公开了一种堆叠型表面声波封装。 表面声波封装包括具有形成在其上的多个电极的第一裸芯片，具有形成在其上的多个电极和通孔的第二裸芯片，将第一裸芯片电连接到第二裸芯片的上表面的连接部分 裸芯片，使得第一裸芯片的电极面对第二裸芯片的电极;以及密封构件，设置在第一裸芯片和第二裸芯片上，以在第一和第二裸芯片之间的操作表面上形成气密空间 。 表面声波封装可以防止在包装过程中由于外界的热冲击而引起的变形，提高产品的可靠性，最小化产品尺寸，并通过减少部件数量和材料成本降低制造成本。

公开(公告)号：US07638425B2

公开(公告)日：2009-12-29

申请号：US11940370

申请日：2007-11-15

申请人： Dong Ha Jung ,  Seung Jin Yeom ,  Baek Mann Kim ,  Young Jin Lee ,  Jeong Tae Kim

发明人： Dong Ha Jung ,  Seung Jin Yeom ,  Baek Mann Kim ,  Young Jin Lee ,  Jeong Tae Kim

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： H01L21/76843 ,  H01L21/28556 ,  H01L21/76873 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A metal line of a semiconductor device having a diffusion barrier including CrxBy and a method for forming the same is described. The metal line of a semiconductor device includes an insulation layer formed on a semiconductor substrate. The insulation layer is formed having a metal line forming region. A diffusion barrier including a CrxBy layer is subsequently formed on the surface of the metal line forming region and the insulation layer. A metal line is finally formed to fill the metal line forming region of the insulation layer on the diffusion barrier including a CrxBy layer.

摘要翻译： 描述了具有包括CrxBy的扩散阻挡层的半导体器件的金属线及其形成方法。 半导体器件的金属线包括形成在半导体衬底上的绝缘层。 绝缘层形成有金属线形成区域。 随后在金属线形成区域和绝缘层的表面上形成包括Cr x B y层的扩散阻挡层。 最后形成金属线以填充包含CrxBy层的扩散阻挡层上的绝缘层的金属线形成区域。

公开(公告)号：US07531902B2

公开(公告)日：2009-05-12

申请号：US11755814

申请日：2007-05-31

申请人： Jeong Tae Kim ,  Baek Mann Kim ,  Soo Hyun Kim ,  Young Jin Lee ,  Dong Ha Jung

发明人： Jeong Tae Kim ,  Baek Mann Kim ,  Soo Hyun Kim ,  Young Jin Lee ,  Dong Ha Jung

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L21/76846 ,  H01L21/76843 ,  H01L21/76856 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-layered metal line of a semiconductor device has a lower metal line and an upper metal line. The upper metal line includes a diffusion barrier, which is made of a stack of a first WNx layer, a WCyNx layer and a second WNx layer.

摘要翻译： 半导体器件的多层金属线具有下金属线和上金属线。 上金属线包括由第一WNx层，WCyNx层和第二WNx层的堆叠构成的扩散阻挡层。

公开(公告)号：US06908625B2

公开(公告)日：2005-06-21

申请号：US10011081

申请日：2001-12-07

申请人： Seung Ji Lee ,  Byoung Kee Jo ,  Young Jin Lee ,  Chun Mong Lee

发明人： Seung Ji Lee ,  Byoung Kee Jo ,  Young Jin Lee ,  Chun Mong Lee

IPC分类号： A61K8/30 ,  A61K8/00 ,  A61K8/02 ,  A61K8/11 ,  A61K8/14 ,  A61K8/31 ,  A61K8/34 ,  A61K8/36 ,  A61K8/37 ,  A61K8/39 ,  A61K8/42 ,  A61K8/55 ,  A61K8/58 ,  A61K8/60 ,  A61K8/63 ,  A61K8/67 ,  A61K8/68 ,  A61K8/72 ,  A61K8/73 ,  A61K8/89 ,  A61K8/891 ,  A61K8/96 ,  A61K8/97 ,  A61K8/98 ,  A61K31/07 ,  A61Q19/00 ,  A61Q19/08 ,  A61K9/127 ,  A61K7/00

CPC分类号： A61K8/0295 ,  A61K8/14 ,  A61K8/55 ,  A61K8/553 ,  A61K8/63 ,  A61K8/671 ,  A61K8/68 ,  A61K31/07 ,  A61K2800/412 ,  A61K2800/52 ,  A61Q19/08 ,  Y10S514/887 ,  Y10S514/937

摘要： The present invention concerns stabilized cosmetic material containing triple-encapsulated retinol. Unstable, fat-soluble retinol is stabilized firstly by addition into vesicles consisting of nonionic surface-active agent, cholesterol and cholesteryl ester. The firstly stabilized retinol(vesicle) is subsequently inserted into sphingosomes (a kind of multi lamellar liposome) consisting of lecithin and ceramide. Finally the double-encapsulated retinol (sphingosome) is inserted into lamellar liquid-crystal emulsifying base, thereby being triply encapsulated.

摘要翻译： 本发明涉及含有三重包封的视黄醇的稳定的化妆品。 不稳定的脂溶性视黄醇首先通过加入由非离子表面活性剂，胆固醇和胆固醇酯组成的囊泡来稳定。 随后将第一稳定化的视黄醇（囊泡）插入由卵磷脂和神经酰胺组成的鞘体（一种多层脂质体）中。 最后将双包囊视黄醇（鞘氨醇）插入层状液晶乳化基质中，由此进行三次包封。

公开(公告)号：US11819154B2

公开(公告)日：2023-11-21

申请号：US17927255

申请日：2020-09-04

申请人： Seung Hun Shin ,  Se Yeol Choi ,  Young Jin Lee

发明人： Seung Hun Shin ,  Se Yeol Choi ,  Young Jin Lee

IPC分类号： A47J27/08 ,  A47J27/18 ,  A47J27/092 ,  A47J27/04 ,  A47J27/16 ,  A47J27/00

CPC分类号： A47J27/0815 ,  A47J27/04 ,  A47J27/0802 ,  A47J27/092 ,  A47J27/16 ,  A47J27/18 ,  A47J2027/008

摘要： A compression chamber for a compression type ramen cooker is capable of cooking ramen by compression by blocking a discharge of air in a cooking container while cooking ramen. The compression chamber includes a lid, a chamber container having an upper portion on which the lid is mounted and a bottom surface to which the cooking container is coupled to seal the cooking container, a heater installed through the lid and mounted inside the chamber container to heat the water stored in the chamber container, a supply valve unit installed through the lid to supply water to the inside of the chamber container, a discharge valve unit installed through the lid to supply water in the chamber container to the cooking container, and a vapor discharge unit on a lower side of the chamber container to discharge compressed steam inside the cooking container.

公开(公告)号：US09623537B2

公开(公告)日：2017-04-18

申请号：US14785243

申请日：2014-04-15

申请人： Byung Geun Choi ,  Young Jin Lee

发明人： Byung Geun Choi ,  Young Jin Lee ,  Dong Seon Lee ,  Man Soo Kim ,  Seong Bin Kim

IPC分类号： B24B41/06 ,  B24B55/06 ,  B24B19/26 ,  B24B11/00 ,  B24B19/08

CPC分类号： B24B41/067 ,  B24B11/00 ,  B24B19/08 ,  B24B19/26 ,  B24B55/06

摘要： The present invention provides an apparatus for treating the surface of a radome, comprising: a rotary driving unit; a vacuum suction unit; a vertical driving unit; and a surface treatment unit. The rotary driving unit comprises: a rotary shaft; and a driving motor, installed at a predetermined portion spaced apart from the rotary shaft. The vacuum suction unit comprises: a plurality of first hydraulic cylinders positioned on the rotary shaft in the circumferential direction; and a suction plate equipped at an end of a piston rod of each of the first hydraulic cylinders. The vertical driving unit comprises: a mounting plate having a hole formed in the central portion thereof. The surface treatment unit comprises: a support column vertically installed on a predetermined portion spaced apart from the mounting plate; and a support arm.

公开(公告)号：US09398798B2

公开(公告)日：2016-07-26

申请号：US14404185

申请日：2013-04-23

申请人： Sung Won Yi ,  Chang Man Park ,  Jun Oh Kim ,  Chan Ki Lee ,  Young Jin Lee ,  Jin Gug Kim

发明人： Sung Won Yi ,  Chang Man Park ,  Jun Oh Kim ,  Chan Ki Lee ,  Young Jin Lee ,  Jin Gug Kim

IPC分类号： A45D29/00

CPC分类号： A45D29/00 ,  A45D2029/005

摘要： The nail art device having a control unit; a holder; a display panel that displays a predetermined selected pattern through the control of the control unit; and a UV irradiation unit that irradiates the display panel with UV rays is provided. When a finger, to the nail of which polish having a UV-reactive component has been applied, is placed in the holder, the polish applied to the nail reacts with the UV rays which are transmitted through the display panel where the selected pattern is displayed to form a nail pattern.

摘要翻译： 具有控制单元的美甲装置; 持有人 显示面板，其通过控制单元的控制显示预定的选定图案; 并且提供了用紫外线照射显示面板的UV照射单元。 当已经施加了具有UV反应性成分的抛光剂的手指被放置在保持器中时，施加到指甲上的抛光剂与通过显示面板传输的紫外线反应，其中所选择的图案被显示 形成指甲图案。