公开(公告)号：US20220399242A1

公开(公告)日：2022-12-15

申请号：US17846320

申请日：2022-06-22

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11456225B2

公开(公告)日：2022-09-27

申请号：US17217027

申请日：2021-03-30

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US20220179126A1

公开(公告)日：2022-06-09

申请号：US17601505

申请日：2020-03-31

Applicant: Corning Incorporated ,  FUNDACIÓ INSTITUT DE CIÈNCIES FOTÒNIQUES ,  INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS

Inventor： Prantik Mazumder ,  Valerio Pruneri ,  Juan Rombaut

IPC: G02B1/118 ,  C09D179/08 ,  C09D5/00 ,  C09K13/04 ,  C03C17/38 ,  C03C17/32 ,  C03C17/36

Abstract: A method for fabricating a structured surface, includes: providing a transparent substrate; disposing a dewettable film over the substrate; annealing the dewettable film to form a plurality of islands; forming a coating over the plurality of islands; and etching the plurality of islands to form a structured array of surface features in the coating. A structured polymer and/or structured glass, includes: a structured array of surface features, such that the structured array of surface features has at least one dimension in a range of 0.5 nm to 5000 nm.

公开(公告)号：US20220140227A1

公开(公告)日：2022-05-05

申请号：US17515630

申请日：2021-11-01

Applicant: CORNING INCORPORATED

Inventor： Indrani Bhattacharyya ,  Julia Anne Dorothee Brueckner ,  Ya-Huei Chang ,  Bokyung Kong ,  Prantik Mazumder ,  Jun Ro Yoon ,  Jian-Zhi Jay Zhang

IPC: H01L41/312 ,  H01L41/337 ,  H01L41/187 ,  H01L41/08

Abstract: An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.

公开(公告)号：US11201109B2

公开(公告)日：2021-12-14

申请号：US16776663

申请日：2020-01-30

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/768 ,  C03C17/06 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00 ,  H05K3/42

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11192340B2

公开(公告)日：2021-12-07

申请号：US16732845

申请日：2020-01-02

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B17/06 ,  B32B3/26 ,  B32B7/06 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B17/00 ,  B32B27/06 ,  B32B38/00 ,  C03C15/00 ,  H01L21/02

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

公开(公告)号：US11152294B2

公开(公告)日：2021-10-19

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Aleksandrovna Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C03C15/00 ,  C23C18/38 ,  H01L21/768 ,  H05K3/38 ,  C23C14/18 ,  C23C28/02 ,  C03C17/06 ,  C03C3/06 ,  C03C23/00 ,  C03C17/00 ,  H05K3/42 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US11097509B2

公开(公告)日：2021-08-24

申请号：US16327497

申请日：2017-08-29

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jiangwei Feng ,  Prantik Mazumder

IPC: B32B7/12 ,  C09J183/04 ,  B32B9/04 ,  B32B9/00 ,  B32B17/06 ,  B32B15/04 ,  B32B7/06 ,  C09D183/08 ,  C09D183/00 ,  C09D183/04 ,  B32B27/28 ,  B32B37/24 ,  C09J5/04 ,  C08G77/26 ,  C08G77/04

Abstract: Described herein are glass articles and methods of making glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier or bonded together using a coating layer, which is preferably an organosiloxane polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The coating layer bonds the thin sheet and carrier together to prevent a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US20190184686A1

公开(公告)日：2019-06-20

申请号：US16326273

申请日：2017-08-15

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jiangwei Feng ,  Prantik Mazumder

IPC: B32B17/10 ,  B32B37/24 ,  B32B27/28

CPC classification number: B32B17/10036 ,  B32B17/10688 ,  B32B27/00 ,  B32B27/28 ,  B32B27/286 ,  B32B37/24 ,  B32B2037/246 ,  B32B2355/00 ,  B32B2457/14 ,  B32B2457/206

Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example an aromatic polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature processing while preventing a permanent bond during high temperature processing.

公开(公告)号：US10046542B2

公开(公告)日：2018-08-14

申请号：US15122366

申请日：2015-01-26

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B7/02 ,  B32B17/06 ,  C03C17/22 ,  C03C23/00 ,  C03C27/06 ,  C03C27/10

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.