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    Apparatus And Method For Providing An Inerting Gas During Soldering
    22.
    发明申请
    Apparatus And Method For Providing An Inerting Gas During Soldering 有权
    在焊接过程中提供惰性气体的设备和方法

    公开(公告)号：US20130098974A1

    公开(公告)日：2013-04-25

    申请号：US13449470

    申请日：2012-04-18

    申请人： Chun Christine Dong ,  Victor Wang ,  Jerry Wu ,  Ranajit Ghosh ,  Gregory Khosrov Arslanian

    发明人： Chun Christine Dong ,  Victor Wang ,  Jerry Wu ,  Ranajit Ghosh ,  Gregory Khosrov Arslanian

    IPC分类号： B23K3/08 ,  B23K1/20 ,  B23K3/06

    CPC分类号： B23K3/082 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/08 ,  B23K2101/42 ,  H05K3/3468 ,  H05K2203/044

    摘要： Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

    摘要翻译： 这里描述了一种用于在对工件进行焊接的过程中提供惰性气体的装置和方法。 在一个方面，提供了一种用于在工件焊接期间将惰性气体提供到焊料储存器上方的气氛中的外壳，包括：与惰性气体源流体连通的管，其中管包括用于流动的一个或多个开口 的惰性气体通过其中的基部，其中管位于其中并包括内部容积的基部，颈部包括开口和与基部的内部空间流体连通的内部容积，以及靠近开口的盖，其中惰性 气体源通过颈部和盖子限定的开口穿过管进入内部空间并进入大气。

    Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment
    24.
    发明申请
    Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment 审中-公开
    添加D2至H2以检测和校准通过分离电子附着形成的原子氢

    公开(公告)号：US20090008426A1

    公开(公告)日：2009-01-08

    申请号：US12233678

    申请日：2008-09-19

    申请人： Chun Christine Dong ,  Eugene Joseph Karwacki, JR. ,  Richard E. Patrick

    发明人： Chun Christine Dong ,  Eugene Joseph Karwacki, JR. ,  Richard E. Patrick

    IPC分类号： B23K37/00

    CPC分类号： B23K1/206 ,  H01L2924/0002 ,  H05K3/3489 ,  H01L2924/00

    摘要： A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

    摘要翻译： 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一种或多种待焊接的组分， 连接到作为目标组件的第一电极; b）提供邻近目标组件的第二电极; c）在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。

    Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
    27.
    发明授权
    Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment 失效
    添加D2至H2以检测和校准由离子电子附着形成的原子氢

    公开(公告)号：US07434719B2

    公开(公告)日：2008-10-14

    申请号：US11298262

    申请日：2005-12-09

    申请人： Chun Christine Dong ,  Eugene Joseph Karwacki, Jr. ,  Richard E. Patrick

    发明人： Chun Christine Dong ,  Eugene Joseph Karwacki, Jr. ,  Richard E. Patrick

    IPC分类号： B23K35/38 ,  B23H3/00

    CPC分类号： B23K1/206 ,  H01L2924/0002 ,  H05K3/3489 ,  H01L2924/00

    摘要： A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.

    摘要翻译： 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一种或多种待焊接的组分， 连接到作为目标组件的第一电极; b）提供邻近目标组件的第二电极; c）在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。

    CONDUCTIVE COMPOSITION AND CONDUCTIVE FEATURE FORMED AT LOW TEMPERATURES
    29.
    发明申请
    CONDUCTIVE COMPOSITION AND CONDUCTIVE FEATURE FORMED AT LOW TEMPERATURES 有权
    导电组成和低温形成的导电特征

    公开(公告)号：US20130252372A1

    公开(公告)日：2013-09-26

    申请号：US13877824

    申请日：2011-10-07

    申请人： Chun Christine Dong

    发明人： Chun Christine Dong

    IPC分类号： H01L31/0224

    CPC分类号： H01L31/022425 ,  C08K3/08 ,  C08K5/053 ,  C08K5/41 ,  H01B1/22 ,  Y02E10/50

    摘要： A method for forming a conductive feature. The method includes providing a substrate and providing a conductive composition. The conductive composition includes metal particles, a non-acid protic solvent, and a high polarity solvent. The non-acid protic solvent and high polarity solvent are present in concentrations sufficient to ionize the non-acid protic solvent and remove oxides when heated. The method further includes heating the composition to a temperature less than about 250° C. to form a conductive feature having less than about ten times the resistivity of bulk copper.

    摘要翻译： 一种形成导电特征的方法。 该方法包括提供基底并提供导电组合物。 导电组合物包括金属颗粒，非酸性质子溶剂和高极性溶剂。 非酸性质子溶剂和高极性溶剂以足以使非酸性质子溶剂电离并在加热时除去氧化物的浓度存在。 该方法还包括将组合物加热至低于约250℃的温度，以形成具有小于体积铜电阻率的约十倍的导电特征。

    Apparatus and method for providing an inerting gas during soldering
    30.
    发明授权
    Apparatus and method for providing an inerting gas during soldering 有权
    在焊接过程中提供惰性气体的装置和方法

    公开(公告)号：US08220699B2

    公开(公告)日：2012-07-17

    申请号：US13040594

    申请日：2011-03-04

    申请人： Chun Christine Dong ,  Gregory Khosrov Arsianian ,  Ranajit Ghosh ,  Victor Wang ,  Jerry Wu

    发明人： Chun Christine Dong ,  Gregory Khosrov Arsianian ,  Ranajit Ghosh ,  Victor Wang ,  Jerry Wu

    IPC分类号： B23K31/02

    CPC分类号： B23K3/085 ,  B23K3/0653 ,  B23K3/08

    摘要： Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve.

    摘要翻译： 这里描述了一种用于在对工件进行焊接的过程中提供惰性气体的装置和方法。 在一个方面，提供了一种放置在焊料容器顶部并包括与惰性气体流体连通的多个多孔管的设备。 在另一方面，提供了一种用于向波峰焊装置提供惰性气体的方法，包括以下步骤：将装置放置在焊料储存器的至少一个边缘上方，其中该装置包括多个管，其包括一个 或更多的开口与惰性气体源流体连通。 在另一方面，至少一个管包括不粘涂层或由诸如套筒的多孔不粘材料构成。