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    Photonic integrated circuit bonded with interposer
    21.
    发明授权
    Photonic integrated circuit bonded with interposer 有权

    公开(公告)号：US10564352B1

    公开(公告)日：2020-02-18

    申请号：US16543441

    申请日：2019-08-16

    Applicant: Cisco Technology, Inc.

    Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

    Abstract: Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

    Photonic integrated circuit bonded with interposer
    23.
    发明授权
    Photonic integrated circuit bonded with interposer 有权

    公开(公告)号：US10393959B1

    公开(公告)日：2019-08-27

    申请号：US16172702

    申请日：2018-10-26

    Applicant: Cisco Technology, Inc.

    Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

    IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

    Abstract: A method comprises bonding a first surface of an interposer wafer with a first exterior surface of a photonic wafer assembly. The photonic wafer assembly comprises one or more optical devices coupled with one or more metal layers and with one or more first optical waveguides. The method further comprises forming, from a second surface opposite the first surface, a plurality of first conductive vias extending at least partway through the interposer wafer and coupled with the one or more metal layers. The method further comprises forming, at the second surface, a plurality of first conductive pads coupled with the plurality of first conductive vias. The method further comprises forming one or more second conductive pads coupled with the one or more metal layers. The one or more second conductive pads are accessible at a second exterior surface of the photonic wafer assembly opposite the first exterior surface.

    Optical data converter
    24.
    发明授权
    Optical data converter 有权

    公开(公告)号：US12255690B2

    公开(公告)日：2025-03-18

    申请号：US18177992

    申请日：2023-03-03

    Applicant: Cisco Technology, Inc.

    Inventor： Jock T. Bovington ,  Matthew J. Traverso

    IPC: H04B10/00 ,  H04B10/50 ,  H04J14/00

    Abstract: A pluggable device and method are presented. The pluggable device includes a substrate, a first pin positioned on the substrate, an optical source positioned on the substrate, and an integrated circuit positioned on the substrate. The optical source produces a source optical signal and transmits the source optical signal through the first pin. The integrated circuit transmits a received optical data signal and transmits a data signal based on a portion of the optical data signal.

    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips
    30.
    发明授权
    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips 有权

    公开(公告)号：US10746934B2

    公开(公告)日：2020-08-18

    申请号：US16058608

    申请日：2018-08-08

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

    IPC: G02B6/30 ,  G02B6/12 ,  G02B6/10

    Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

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